Topic
Electroless nickel plating
About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.
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Patent•
04 Jul 2005
TL;DR: In this paper, the problem of providing an electroless palladium plating liquid where a gold film is formed only by easily treatable substitution gold plating is solved, which has excellent joining strength in both of wire bonding joining and solder ball joining.
Abstract: PROBLEM TO BE SOLVED: To provide an electroless palladium plating liquid where, in a three layer plating film terminal of an electroless nickel plating film/ an electroless palladium plating film/a substitution gold plating film, a gold film is formed only by easily treatable substitution gold plating, and, even when electroless nickel-phosphorous having high flexibility is used, which has excellent joining strength in both of wire bonding joining and solder ball joining, and has excellent running properties as well. SOLUTION: The electroless palladium plating liquid at least comprises: a component (a): a palladium salt organic complex; a component (b): sulfide group-containing monocarboxylic acid or the salt thereof; and a component (c): hypophosphorous acid or the salt thereof. COPYRIGHT: (C)2007,JPO&INPIT
5 citations
TL;DR: In this paper, an electroless nickel plating bath with a hydrazine reducing agent has been investigated, which achieved a deposition rate of about 3μm/hr and superior bath stability as compared to previously reported bath.
Abstract: An electroless nickel plating bath with a hydrazine reducing agent has been investigated. An electroless nickel plating bath with a deposition rate of about 3μm/hr and superior bath stability as compared to previously reported bath has been developed. The new bath is a simple system consisting of glycine and boric acid in addition to nickel and hydrazine. The optimum plating conditions for the bath are in the range of 85-90°C at a pH of 12. The deposits obtained from the developed bath are black with a surface morphology that has a dendrite structure. Characteristics of deposits such as specific resistance and solderability were superior to those of conventional nickel-phosphorus deposits. Results confirmed that nickel was directly deposited on a copper substrate from an electroless nickel plating bath with a hydrazine reducing agent without an activation step in pretreatment.
5 citations
TL;DR: In this paper, the influence of sintering temperature and high pressure on Ni-P nanoparticles in Al2O3/Ni-P nanocomposites was investigated.
Abstract: The influence of sintering temperature and high pressure on Ni-P nanoparticles in Al2O3/Ni-P nanocomposites was investigated in this paper. The fine-grained alumina powder was covered with Ni-P nanoparticles of 20 – 50 nm size by electroless nickel plating. The material was sintered in temperatures from 900 to 1400oC using pressures above 5 GPa. It was found that sintering in such conditions give a possibility to maintain nanometrical size of Ni-P particles. In the case of 1400oC the metallic phase melts and non-uniform grain growth of ceramic was observed. Hot pressing at 900oC allowed for the metal to remain in solid state and ensured uniform microstructures of the nanocomposites, with uniform distribution of nanometrical Ni-P grains in the ceramic matrix. In this temperature the grain growth of the ceramic was not observed. The results are discussed in terms of technology for production of ceramic-metal composites for various applications.
5 citations
Patent•
17 Dec 2004
TL;DR: In this article, an electroless-plated nickel film having a phosphate coating on the surface is formed by immersing an article to be plated in a electroless nickel plating bath including a sulfur-containing compound for a predetermined period of time.
Abstract: PROBLEM TO BE SOLVED: To provide an electroless-plated nickel film having various improved properties such as initial sliding properties. SOLUTION: The electroless-plated nickel film having a phosphate coating on the surface is formed by immersing an article to be plated in an electroless nickel plating bath including a sulfur-containing compound for a predetermined period of time, and then contacting the electroless-plated nickel film with a phosphate solution to form the phosphate coating on the electroless-plated nickel film. The plated nickel-alloy film having the phosphate coating on the surface is also disclosed. COPYRIGHT: (C)2006,JPO&NCIPI
5 citations
Patent•
15 Jan 2003
TL;DR: In this article, a method for preparing the pretreatment solution for electroless nickel plating onto copper or copper alloy is characterized by previously mixing or reacting a silane coupling agent containing a functional group having a metal capturing ability in one molecule with a noble metal compound at the weight ratio satisfying the following coequality.
Abstract: PROBLEM TO BE SOLVED: To provide a pretreatment solution which can reduce frequency of making up a catalyst solution used for electroless nickel plating onto copper or copper alloy. SOLUTION: The method for preparing the pretreatment solution for electroless nickel plating onto copper or copper alloy is characterized by previously mixing or reacting a silane coupling agent containing a functional group having a metal capturing ability in one molecule with a noble metal compound at the weight ratio satisfying the following coequality; 1/10< a silane coupling agent/a noble metal compound <5/1.
5 citations