Topic
Electroless nickel plating
About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.
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01 Jan 2010
TL;DR: In this article, the arrangement and chemical composition of these intermetallic phases were studied and discussed as function of the pre-treatment method of SiC particles, and they were added to an Al alloy powder to produce Al/SiC composite by compression and sintering.
Abstract: Electroless nickel (EN) plating was used to coat SiC particles, using three different pre-treatment methods (acidic pre-treatment, surface oxidation, palladium chloride activation). The acidic pre-treatment is able to activate the surface of the particles hardly. Consequently, the electroless nickel deposit formation is only particular. A coherent oxide layer is developed on the surface of the substrate after the surface oxidation. This ensures the homogeneous nickel nuclei formation after using the electroless nickel plating. Finally the palladium chloride activation creates homogeneous palladium nuclei on the surface of the silicon carbide particles. A coherent and continuous nickel layer is formed on the surface containing elemental palladium nuclei. The EN plated SiC particles were added to an Al alloy powder to produce Al/SiC composite by compression and sintering. During sintering (580°C 5h), the nickel coating of the silicon carbide particles and the matrix react with the formation of different Al-Ni phases. The arrangement and chemical composition of these intermetallic phases was studied and discussed in this paper as function of the pre-treatment method of SiC particles.
5 citations
TL;DR: In this article, a relatively low-temperature alkaline plating process was developed for electroless nickel (EN) plating on n-type (100) silicon wafers, and simple ethanol pretreatment of the substrate is practicable for obtaining an EN layer with a good adhesion strength of about 9.8 to 14.7 MPa.
Abstract: In the study of electroless nickel (EN) plating on n‐type (100) silicon wafers, a relatively low‐temperature alkaline plating process is developed. Further experiments show that simple ethanol pretreatment of the substrate is practicable for obtaining an EN layer with a good adhesion strength of about 9.8 to 14.7 MPa. Both sodium tungstate and sodium fluoride can be used to decrease the threshold plating temperature from near 80°C to 65°C. The phosphorous content of the as‐plated layer is slightly higher than 7 wt.%.
5 citations
Patent•
05 Jan 2011
TL;DR: In this article, a method of manufacturing a printed circuit board (PCB) and an external circuit board manufactured by the same method is described, which includes the following steps: (a) performing a solid boring operation to a copper foil surface of a cuprum-coated laminated board, pasting a dry film containing sensitizer to exposure and visualize, then etching and peeling the dry film so as to form a external circuit; (b) forming an insulation layer between circuits; (c) performing acid treatment and/or cleaning treatment to a region required
Abstract: The present invention relates to a method of manufacturing a printed circuit board (PCB) and a printed circuit board manufactured by said method The method includes the following steps: (a) performing a solid boring operation to a copper foil surface of a cuprum-coated laminated board, pasting a dry film containing sensitizer to exposure and visualize, then etching and peeling the dry film so as to form an external circuit; (b) forming an insulation layer between circuits; (c) performing acid treatment and/or cleaning treatment to a region required for surface treatment namely to the external circuit, so as to form an electroless nickle plating layer and/or gold plating layer, an electroless nickel plating layer and/or gold plating layer or tin plating layer; (d) coating the external circuit with the gold plating layer or the tin plating layer by using metal mask printing solder; (e) attaching a spot formation circuit on the solder coated on the external circuit by using an insert machine; (f) welding the spot formation circuit on the external circuit by using a spot welding machine to joint the spot formation circuit
5 citations
Patent•
04 Jul 2012TL;DR: In this paper, an aqueous plating bath composition for depositing a nickel phosphorous alloy having a phosphorous content in the range of to 12 wt-% was proposed.
Abstract: The present invention relates to an aqueous plating bath composition for depositing a nickel phosphorous alloy having a phosphorous content in the range of to 12 wt-% The plating bath comprises a sulfur-containing organic stabilizing agent
5 citations
01 Jun 2014
TL;DR: In this paper, Palladium-Copper inter-diffusion behavior was proven affected by flow rate variation of chemical solution during copper activation process, and several physical failure analysis approaches were used.
Abstract: Electroless Nickel deposition on Copper metallization required a thin Palladium layer (<; 5nm) as catalyst for Copper activation purpose. By using several physical failure analysis approaches, Palladium-Copper inter-diffusion behavior was proven affected by flow rate variation of chemical solution during Copper activation process.
5 citations