Electroless nickel plating

About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.

Preparation of styrene-γ-methacryloxypropyltrimethoxysilane/Pd nanoparticles as ink for ink-jet printing technology and electroless nickel plating on glass

Abstract: This paper describes the development of a silane-based Pd catalyst used as activator to replace the traditional Pd/Sn colloid for electroless nickel deposition onto a glass substrate. In this study, a styrene-co-γ-methacryloxypropyltrimethoxysilane oligomer (St-MPS) is synthesized by free radical polymerization method in acetone aqueous solution with potassium persulfate as the initiator firstly. The St-MPS oligomer can be used to reduce and stabilize Pd nanoparticles on the one hand. On the other hand, the hydrolysis and condensation reactions taking place between the silane units in St-MPS co-oligomers and glass substrate promote the adhesion of St-MPS/Pd catalyst and the subsequent nickel deposition. The adhesion strength is also demonstrated being affected by pre-heat conditions and thickness of Ni coating. Based on our results, a Ni layer with a thickness of 8.51 µm is obtained after plating for 60 min. The ink based on St-MPS/Pd colloids is successfully inkjet printed onto a glass substrate. The formed palladium layer is subjected to electroless nickel plating, yielding well-defined nickel pattern.

Production of etching parts

Abstract: PROBLEM TO BE SOLVED: To provide process for producing etching parts (seal gaps, etc.), which are not formed with metal plating layers in half-etched regions. SOLUTION: The metal plating layer 12 and metal plating layer 13 of 0.5 to 2.0 μm in film thickness are formed by electroless nickel plating on both surfaces of a metallic base material 11 and a photoresist is applied thereon to form a photosensitive layer 14 and photosensitive layer 15 on the metal plating layer 12 and metal plating layer 13. Next, the photosensitive layer 14 on one surface is subjected to a patterning treatment to form resist patterns 14a. The metal plating layer 12 and metallic base material 11 are partly etched with the resist patterns 14a as a mask by which metal plating pattern layers 12a and apertures 16 are formed. Next, the resist patterns 14a and the photosensitive layer 15 are subjected to a peeling treatment and the prescribed positions of the apertures 16 are blanked, by which the etching parts 10 having the half- etched regions free of the metal plating layers at both ends of the metallic base material 11 are obtained.

Process for recovering nickel from spent electroless nickel plating solutions

Abstract: A process for recovering nickel from spent electroless nickel plating solutions by adjusting the pH of the solution to 10-10.5 with sodium hydroxide, adding ammonium hydroxide to obtain a pH of 11 of the solution, and heating the solution at 40°-50° C. while subjecting the solution to electrolysis to deposit nickel from the spent solution and separating the deposited nickel such that the spent solution may be safely discharged as effluent.

Electroless nickel plating bath using monoamine-type biodegradable chelating agent

Abstract: PURPOSE: To obtain a plating bath excellent in stability and capable of realizing an Ni plating having a high content of P at a high rate by incorporating a specified monoamine-type biodegradable chelating agent into an electroless Ni plating bath as an effective component. CONSTITUTION: At least one kind of the monoamine-type biodegradable chelating agent shown by the formula (where R is hydrogen or an unsubstituted or substituted hydrocarbonic group, R and R are hydrogen or an unsubstituted or substituted hydrocarbon group, R is hydrogen, -COOM-, -SO3 M or -PO3 M, and M is hydrogen, alkali metal or ammonium group) as a complexing agent is incorporated into an electroless Ni plating bath as the effective component. In this case, 0.2-30mols of the chelating agent is preferably used for 5-500mM of Ni ion, and the plating bath is preferably alkalized by NaOH, KOH or NH4 OH. Further, sodium hypophosphite is used as the reducing agent of the bath, and an Ni coating film having a high content of P is obtained at a high rate.

Methods for oxidizing hypophosphoric acid ion and phosphorous acid ion, method for cleaning electroless nickel plating waste liquid, and method for recycling phosphate

Abstract: PROBLEM TO BE SOLVED: To provide a method for cleaning an electroless nickel plating waste liquid and a method for recovering nickel and a phosphate and recycling them using simple apparatus by a low-cost and effective process by eliminating a problem in the conventional oxidation method for cleaning the electroless nickel plating waste liquid. SOLUTION: The method for cleaning an electroless nickel plating waste liquid comprises: a first step where nickel ions are separated from an electroless nickel plating waste liquid; a second step where hypophosphoric acid ions in a separate liquid obtained in the first step are oxidized into phosphorous acid ions by an oxidation catalyst; a third step where the phosphorous acid ions obtained in the second step are oxidized into orthophosphoric acid ions by an oxidation catalyst; and a fourth step where the orthophosphoric acid ions obtained in the third step are converted into a phosphate, which is subjected to filtering/separating, thus is cleaned into a waste liquid having a phosphorous concentration of ≤16 mg//l, and the phosphoric acid is recovered as a phosphate. COPYRIGHT: (C)2010,JPO&INPIT