Topic
Electroless nickel plating
About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.
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Patent•
09 Aug 1993TL;DR: In this article, a glass plate is provided with one or a few monolayers of silane, which are subsequently treated with an aqueous Pd sol which is stabilized with a water-soluble polymer, such as PVA and PVP.
Abstract: Using an electroless nickel bath, a black matrix (13) is provided between the colour filter patterns (7, 9, 11) on a passive plate for an LCD. For this purpose, a glass plate (1) is provided with one or a few monolayers of silane (3), which are subsequently treated with an aqueous Pd sol which is stabilized with a water-soluble polymer, such as PVA and PVP. In this treatment catalytic Pd nuclei (5) are formed which are capable of initiating electroless nickel plating from an electroless nickel bath which contains stabilizers.
4 citations
Patent•
07 Aug 2001
TL;DR: In this paper, the authors proposed a method to prevent deterioration in the wettability of solder and the generation of cracking or the like in a nickel plating film caused by the reduction of the purity of nickel in the film.
Abstract: PROBLEM TO BE SOLVED: To prevent deterioration in the wettability of solder and the generation of cracking or the like in a nickel plating film caused by the reduction of the purity of nickel in the film SOLUTION: This electroless nickel plating bath contains nickel salt as a metal feeding source consisting essentially of at least one kind of nickel acetate and nickel chloride, a reducing agent composed of hydrazine and at least one kind among saccharin, the salt thereof and formalin
4 citations
Patent•
27 Apr 2015
TL;DR: In this article, a connection terminal consisting of a terminal form of copper, an electroless nickel plating film 3 stacked on the terminal forms of copper and a substitution gold plating board was proposed to keep superior soldering connection reliability even after being left under an environment of 150°C for 1000 hours.
Abstract: PROBLEM TO BE SOLVED: To provide a connection terminal arranged to be able to keep superior soldering connection reliability just after a reflow process and even after being left under an environment of 150°C for 1000 hours; and a board for semiconductor chip mounting use.SOLUTION: A connection terminal comprises: a terminal form of copper; an electroless nickel plating film 3 stacked on the terminal form of copper; and an electroless palladium plating film 4 stacked on the electroless nickel plating film 3. The electroless nickel plating film 3 has a thickness of 0.005-0.3 μm, and a purity of 85-97 mass%. The connection terminal further comprises: a substitution gold plating film stacked on the electroless palladium plating film; and an electroless gold plating film stacked thereon. The electroless nickel plating film includes at least one of phosphorus, boron and nitrogen. The electroless palladium plating film has a thickness of 0.01-0.4 μm.
4 citations
Patent•
20 May 2008
TL;DR: In this paper, a method for soldering a magnesium alloy workpiece is described, which includes modifying a surface of the workpiece and performing a high phosphorous (7 to 12 wt % of P) electroless nickel plating process on the surface.
Abstract: A method for soldering a magnesium alloy workpiece is provided. The method includes providing a magnesium alloy workpiece; modifying a surface of the magnesium alloy workpiece; performing a high phosphorous (7 to 12 wt % of P) electroless nickel plating process on the surface of the magnesium alloy workpiece; preparing a solder flux for different lead-free tin alloy solder; and performing a tin soldering process to solder the magnesium alloy workpiece with the lead-free tin alloy solder containing its corresponding solder flux.
4 citations
Patent•
09 Aug 1979
TL;DR: In this paper, a part-formed conductor on nonconducting surface is activated by Pd and again activated by Au, then electrolessly Ni plated, thus providing well-adhered Ni plate layer regardless of substrate materials.
Abstract: PURPOSE:Partly formed conductor on nonconducting surface is activated by Pd and again activated by Au, then electrolessly Ni plated, thus providing well-adhered Ni plate layer regardless of substrate materials. CONSTITUTION:On a nonconductive substrate 1 such as alumina base ceramic plate or synthetic resin plate, W, Mo, Cu and other metal base paste is printed in the form of wiring pattern 2. For W and Mo, metal paste is fired together with ceramic substrate to be metallized. The printed substrate is immersed into Pd ion solution consisting of PdCl2, HCl and a small amount of EDTA for about 30 seconds to one minute. During the immesion, finely activated Pd 6 is formed on metal surfaces. Then the treated substrate is immersed in gold ion solution consisting of KAu(CN)4, NH4Cl and sodium citrate for about 30 seconds to 3 minutes to form activated Au 7 on Pd layer. Known method is used for Ni electroless plating to obtain Ni layer 3.
4 citations