Topic
Electroless nickel plating
About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.
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Patent•
16 Sep 1997
TL;DR: In this paper, an easier-to-use activator liquid was provided by solving the conventional problem of a narrow management range where the bridging and skipping of the activators hardly arises in a pretreating liquid for electroless nickel plating.
Abstract: PROBLEM TO BE SOLVED: To provide an easier-to-use activator liquid by solving the conventional problem of a narrow management range where the 'bridging' and 'skipping' of the activator liquid hardly arises in a pretreating liquid for electroless nickel plating. SOLUTION: The pretreating liquid for electroless nickel plating is so prepd. as to include chloride ions, palladium (II) ions and substitution accelerator and to assume acidity. One or more kind selected from hypophosphite, phosphite, hydrazine, hydroyxylamine, borane and formalin are used as the substitution accelerator. The acidity is specified to >=0.1N. Further, a compd. which forms a complex with palladium (II) ions, such as an ammonium salt or amines, may be added thereto.
4 citations
Patent•
06 Jan 2004
TL;DR: In this article, the problem of providing an electroless nickel plating liquid having desired bath stability even if a lead component was not incorporated therein, and to provide a method for producing a ceramic electronic component in which solder wettability can be improved by using the electroless Nickel Plating liquid.
Abstract: PROBLEM TO BE SOLVED: To provide an electroless nickel plating liquid having desired bath stability even if a lead component is not incorporated therein, and to provide a method for producing a ceramic electronic component in which solder wettability can be improved by using the electroless nickel plating liquid. SOLUTION: At least one or more kinds selected from indium compounds, barium compounds and tin compounds are incorporated into an electroless nickel plating liquid by 0.1 to 100 ppm in total expressed in terms of metallic elements. COPYRIGHT: (C)2005,JPO&NCIPI
4 citations
Patent•
22 Dec 1998
TL;DR: In this paper, an electroless gold plating layer 5 which is controlled 0.02 to 0.06 μm thick is applied to a surface layer on the layer 4. This layer is applied on a conductor pattern composed of copper by plating bath whose phosphorus concentration is controlled at 5 to 10 wt.
Abstract: PROBLEM TO BE SOLVED: To provide a circuit board of low cost, high reliability and high quality to composite junction by applying uniform and extremely thin gold plating to a surface of a board. SOLUTION: In a resin base circuit board 1, an electroless nickel plating layer 4 whose minimum thickness is 2 μm is applied on a conductor pattern 3 constituted of copper by plating bath whose phosphorus concentration is controlled at 5 to 10 wt.% as foundation plating. An electroless gold plating layer 5 which is controlled 0.02 to 0.06 μm thick is applied to a surface layer on the layer 4. COPYRIGHT: (C)2000,JPO
4 citations
Patent•
27 Oct 1998
TL;DR: In this article, the authors proposed an electroless nickel plating method to avoid the formation of the parts not forming a resist film on the surface of an org. substrate having conductor circuits.
Abstract: PROBLEM TO BE SOLVED: To provide an electroless nickel plating method that is a electroless nickel plating method of forming a resist film on the surface of an org. substrate having conductor circuits on the surface on the side having these conductor circuits, then immersing the substrate into an electroless nickel plating liquid to form nickel plating films, and that can avoid the formation of the parts not forming nickel plating films. SOLUTION: In this method for forming nickel plating films on the surfaces of the conductor circuits 11, the conductor circuits 11 are immersed into the first electroless nickel plating liquid 35 to form the first nickel plating film 30 on the surfaces of the conductor circuits 11 and thereafter, the conductor circuits are immersed into the second electroless nickel plating liquid 36 of the deposition rate of nickel higher than that of the first electroless nickel plating liquid 35, by which the second nickel plating films 31 are formed on the surfaces of the first nickel plating films 30.
4 citations
TL;DR: In this paper, the use of three different materials, 2-mercaptobenzimidazole, 2mC-2nothiazole, and thioglycolic acid, was investigated to improve the performance of electroless nickel-plating baths.
Abstract: The use of three different materials, 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, and thioglycolic acid, was investigated to improve the performance of electroless nickel-plating baths. By changing the concentrations of these materials, sample plates were coated. Optical microscope images were obtained by selecting representative coated plates. From the results of the investigations, the effects of these materials on electroless nickel plating were observed, and the most appropriate amounts of these materials for nickel plating were determined. Moreover, the nickel plating speed observed with the bath solution containing 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, and thioglycolic acid is higher than that in the case of traditional electroless plating baths, but the nickel consumption amount in the former case is lower. In order to minimize the waste water generated from electroless nickel-plating baths, we determined the lowest amounts of the chemicals that can be used for the concentrations reported in the literature.
4 citations