Topic
Electroless nickel plating
About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.
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TL;DR: A one-dimensional diffusion model is proposed to explain the dependence of the bath stability on the plating time under different bath loadings and an adsorption model was created to describe the temperature effect.
43 citations
TL;DR: In this article, a second-order response surface model with central composite design (CCD) has been used to take into account the effect of curvature in the predicted response.
43 citations
TL;DR: In this article, an electroless nickel plating and sol-gel combined technique was used to prepare the Ni-P/TiO2 composite film on sintered NdFeB permanent magnet.
Abstract: In this paper, an electroless nickel plating and sol–gel combined technique used to prepare the Ni-P/TiO2 composite film on sintered NdFeB permanent magnet is described and the composite film was characterized by X-ray diffraction (XRD), environmental scanning electron microscopy (ESEM), and energy dispersive X-ray spectrometer (EDX). The corrosion resistance of Ni-P/TiO2 film was studied by potentiodynamic polarization and electrochemical impedance spectroscopy (EIS) techniques. The self-corrosion current density (icorr) of Ni-P/TiO2 composite film is 2.38μA/cm2 in 0.5mol/L H2SO4 solution about 33% of that of Ni-P coating and 0.22μA/cm2 in 0.5mol/L NaCl solution about 14% of that of Ni-P coating, respectively. In 0.5mol/L H2SO4 and 0.5mol/L NaCl solutions, the polarization resistance (Rp) of the composite film is 12.5kΩ cm2 and 120kΩ cm2, about 1.6 and 2 times that of Ni-P coating, respectively. The results indicate that Ni-P/TiO2 composite film has a better corrosion resistance than Ni-P coating.
42 citations
TL;DR: In this paper, the effect of cupric (Cu2+) ion as an additive in the acidic electroless nickel plating bath on the characteristics of the resulting nickel−phosphorus (Ni−P) alloys was investigated mainly with X-ray diffraction, scanning electron microscopy, and energy-dispersive X -ray (EDX) spectrometry.
Abstract: The effect of cupric (Cu2+) ion as an additive in the acidic electroless nickel plating (ENP) bath on the characteristics of the resulting nickel−phosphorus (Ni−P) alloys was investigated mainly with X-ray diffraction, scanning electron microscopy, and energy-dispersive X-ray (EDX) spectrometry. Cupric ions in the acidic ENP bath using hypophosphite anions as reductants have been reported ambiguously as stabilizers or codeposit constituents. In this work, the critical concentration of added copper salts, CuSO4·5H2O, that starts to inhibit the ENP process was determined to be ca. 536 mg/L. In general, the deposition rate, surface morphology, and pit formation on the surface of as-deposits are significantly improved with Cu2+ addition at concentrations less than the critical value. The electroless nickel alloys were shown as a mixture of an amorphous deposit and a crystalline copper metal rather than as amorphous alloys alone.1,2 During the initial stage of the electroless plating process, the copper conten...
41 citations
TL;DR: This new heterogeneous Fenton-like process is promising for decomplexation and purification of electroless nickel plating wastewater as a sludge reduction technology.
41 citations