Topic
Electroless nickel plating
About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.
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TL;DR: In this article, the performance of cotton-like CNTs/(Ni-P)/S composites with different Ni-P alloy contents are studied. And the results show that, in the cottonlike composites, CNT can effectively improve the electrical conductivity of positive electrode materials, and the Ni-p alloy on CNT introduces strong polar adsorption and alleviates the "shuttle effect".
4 citations
Patent•
24 Aug 1985
TL;DR: In this article, a core material is plated in an electroless nickel plating soln. contg. or org. core material with nickel and silver to form tough plating.
Abstract: PURPOSE:To obtain an inexpensive substitute for silver powder by successively plating a slurrified inorg. or org. core material with nickel and silver to form tough plating. CONSTITUTION:A slurrified inorg. or org. core material is plated in an electroless nickel plating soln. contg. alkali hypophosphite or alkali borohydride as a reducing agent. An electroless silver plating soln. made of an aqueous soln. contg. silver alkali cyanide, a reducing agent and alkali hydroxide is added to a slurry of the nickel plated core material to form silver plating. Thus, a silver plated composition having nickel plating contg. P or B on the inorg. or org. core material and silver plating on the nickel plating is obtd.
4 citations
Patent•
29 Apr 2010
TL;DR: In this article, the authors present novel metal coatings containing Nickel and Silica-particles of 10 - 400 nm size as defined in the specification, and workpieces containing such coatings; electroless nickel plating baths suitable for producing such coats; and processes for manufacturing such plating bath and coatings / workpieces.
Abstract: The present invention provides novel metal coatings containing Nickel and Silica-particles of 10 - 400 nm size as defined in the specification; workpieces containing such coatings; electroless nickel plating baths suitable for producing such coatings and workpieces; processes for manufacturing such plating baths and coatings / workpieces.
4 citations
TL;DR: In this paper, the preparation of conductive resin particles (5 to 10μm in diameter) by electroless nickel plating and the surface morphology of nickel film were investigated.
Abstract: Demand for mechanical solderless chip connection methods using anisotropic conductive particles has increased in the field of electronic devises. In this study, the preparation of conductive resin particles (5 to 10μm in diameter) by electroless nickel plating and the surface morphology of nickel film were investigated. Since the surface area of particles are much larger than in a bulk substrate, a batch-type electroless plating bath is unstable. Therefore, we applied the continuous dropping method to improve the stability of the Electroless nickel plating. The surface morphology of the deposited nickel was greatly influenced by the complexing agent used, the bath temperatrue and solution pH. Uniform deposits on the particles were obtained at pH 5 by using ammonium acetate as the complexing agent. In contrast, extraneous deposits were recognized at pH 5 when using sodium tartrate as the complexing agent and in baths at pH6. This extraneous deposition could be decreased by lowering the bath temperature.
4 citations
Patent•
06 Sep 1983
TL;DR: In this article, a resin film (e.g., polyester) is etched with an aqueous solution of NaOH or KOH to effect the swelling and dissolution of low-crystallinity molecules.
Abstract: PURPOSE:To form a closely deposited metal coating on a resin film, by etching the resin film with an alkali solution and then with a specified mixed acid solution and subjecting the resin to electroless plating. CONSTITUTION:A resin film (e.g., polyester) is etched with an alkali solution (e.g., an aqueous solution of NaOH or KOH) to effect the swelling and dissolution of low-crystallinity molecules. Then, the resin is etched with a chromic acid/ sulfuric acid mixed solution (preferably, a solution containing above 50g/l, preferably 50-300g/l of CrO3 and 50-300cc/l of 18N sulfuric acid) to form suitable surface irregularities and then the resin is subjected to electroless plating (e.g., electroless nickel plating). It is possible to deposit a metal coating closely on the resin film and to obtain a metal-coated resin film excellent in mechanical strength and heat resistance.
4 citations