Electroless nickel plating

About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.

A manufacturing method of anode tap for secondary battery

Abstract: PURPOSE: A method for manufacturing a positive electrode terminal for a secondary battery is provided to a positive electrode terminal with excellent weldability, solderability and corrosion resistance and to perform work using roll to roll plating equipment. CONSTITUTION: A method for manufacturing a positive electrode terminal for a secondary battery comprises the steps of: masking at least, one end of an aluminum electrode and a polymer film at an aluminum positive electrode tab for a secondary battery in which the polymer film is welded to the aluminum electrode; successively separating and removing a coating layer and a smut present on the AI surface of the aluminum positive tab and then covering a zincate coating on the AI surface of the AI positive electrode tab; treating 10% ofsodium sulfate, nitric acid, sulfuric acid or their mixture with an aqueous solution at room temperature to 50°C for 5-60 seconds to strip the zincate and again forming the zincate film on the AI surface; forming an electroless nickel plating film with more than 0.5 μm and less than 3 μm on the zincate film; and covering an anti-oxidation film on the electroless nickel plating film and removing the masking.

Data-Based Modeling of Electroless Nickel Plating

Abstract: This work connects the neocybernetic theory of elastic systems to modeling of a complex industrial process. It turns out that using simple mathematics combined with multilinear tools leads to linear models that can be used for monitoring and control. As an application example, electroless nickel plating is studied.

Method for manufacturing package substrate using a electroless ni plating

Abstract: Disclosed is a method of fabricating a package substrate using electroless nickel plating. The method includes preparing a base substrate, on which an internal layer circuit pattern is formed through a predetermined masking process; forming an insulating layer on the base substrate to achieve interlayer electric insulation; forming a first via hole through the insulating layer to achieve interlayer electric connection; forming a seed layer on the insulating layer through which the first via hole is formed; and forming an external layer circuit pattern on the seed layer through the other predetermined masking process. The seed layer is partially or selectively flash etched so as to prevent via open and undercut formed at the external layer circuit pattern.

Initiation of electroless nickel plating on copper, palladium-activated copper, gold, and platinum

Abstract: The catalytic activity of copper, palladium-activated copper, gold, and platinum for electro-oxidation of hypophosphite and electroless nickel plating was investigated in an ammoniacal solution of pH 8.8 at 50/sup 0/C by potential measurements and linear sweep voltammetry from -0.3 to -0.92V vs. SCE. Early stages of nickel plating on copper-palladium substrates were studied by scanning electron microscopy in conjunction with EDAX. It was found that palladium-activated copper and gold were catalytically active in the entire range of potentials examined; copper was active below -0.6 platinum was not active at all. Small amounts of electrolytically deposited nickel considerably increased the electro-oxidation rate of hypophosphite on copper, gold, and palladium. TEM examinations showed that activation of copper in a PdCl/sub 2//HCl solution resulted in the deposition of palladium in the form of separate patches. Electroless nickel deposition on copper substrates with separate palladium spots took place on copper and palladium independently of each other. The deposition on palladium was faster than that on copper. It was concluded that the activation of copper substrates around palladium spots occurred solely through a spontaneous potential shift, induced by electro-oxidation of hypophosphite on the palladium spots. It was suggested that small amounts of one metal synergisticallymore » enhanced the catalytic activity of the other metals.« less

Metallic microstructures by electroplating on polymers : an alternative to LIGA technique

Abstract: In this paper, a new technique of obtaining nickel electroplated layers on polymethylmethacrylate (PMMA) is presented. It consists of four steps. 1. Conditioning . Strongly oxidizing acid mixtures are used for providing roughness on the surface by generating suitable sites for chemical bonding of subsequently applied metals. 2. Nucleation . Using an acidic solution of a mixture of a palladium salt together with a tin salt it can be obtained an adsorbed film on PMMA’s surface that is reduced to metallic form. 3. Electroless nickel plating . This step transforms PMMA into a conductive surface and builds up metal only to provide sufficient conductivity for electroplating. This is achieved in a classical hypophosphite electroless nickel solution. 4. Nickel electroplating . Metallic microstructures are finally obtained by growing up, at the desired thickness, nickel layers on the thin electroless ones, using a standard sulphamate bath for rapid electroforming. This method of obtaining nickel electroplated microstructures was developed to replace the classical Lithographie, Galvanoformung, Abformung (LIGA) technique (mainly to avoid the use of the costly synchrotron system).