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Electroless nickel plating

About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.


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Patent
09 Dec 1997
TL;DR: In this paper, an etching soln is obtained by dissolving a palladium compound and a chelating agent contg. ammonium radical in an aq. soln. of sulfuric acid.
Abstract: PROBLEM TO BE SOLVED: To provide an etching soln. and an activation treating soln. of pH11 to 13 improving the adhesiveness of selective electroless nickel plating to aluminum. SOLUTION: This activation treating soln. is obtained by dissolving a palladium compound and a chelating agent contg. ammonium radical in an aq. soln. of an inorganic base in which pH is adjusted. The palladium compound can be selected from among PdCl2 , PdSO4 and Pd(NO3 )2 , the chelating agent can be selected from among NH4 OH, NH4 Cl, (NH4 )2 CO3 and NH4 HCO3 , and the inorganic base can be selected from KOH and NaOH. The etching soln. is obtained by dissolving a palladium compound or zinc compound in an aq. soln. of sulfuric acid. The palladium compound can be selected from among PdCl2 , PdSO4 , Pd(NO3 ) and (NH4 )2 PdCl4 , and the zinc compound an be selected from ZnCl2 and ZnSO4 .

4 citations

Patent
27 Apr 2001
TL;DR: In this article, a plating metal layer is formed on the surface of the first resin layer and the inner wall of the non-through hole, and then an etching resist layer is created by etching.
Abstract: PROBLEM TO BE SOLVED: To provide a material for build-up wiring board, and a production method of printed wiring board, in which fine pattern wiring is facilitated while utilizing the conventional characteristics and abnormal deposition of electroless nickel plating and electroless gold plating is eliminated. SOLUTION: On the surface of a metal foil, a first resin layer containing no filler is provided under the state of stage C or B and a second resin layer containing a filler is provided thereon in stage B or A to produce a material for build-up wiring board. The second resin layer of the build-up wiring board is placed directly on the surface of an inner layer board and hot pressed integrally. Subsequently, a metal foil is removed and a part for connecting an inner layer circuit electrically with a circuit formed on the surface of the first resin layer is irradiated with laser thus making a non-through hole reaching the inner layer circuit. Thereafter, a plating metal layer is formed on the surface of the first resin layer and the inner wall of the non-through hole, an etching resist layer is formed on the surface of the plating metal layer and then the unnecessary plating metal layer is removed by etching.

4 citations

Journal Article
Rutao Liu, C. Gao, S. Hua, J. Yang, Y. Lu 
TL;DR: In this article, a new method, using mono-wavelength, was developed to determine the concentration of Fe(III) in an electroless nickel plating solution during the plating process when plating iron sheet.
Abstract: Experiment has proved that iron can be dissolved in an acidic electroless nickel (EN) plating solution during the plating process when plating iron sheet. The influence of nickel sulfate, organic acids, sodium hypophosphite, pH and temperature on the absorption of Fe(III) was investigated. A new method, using mono-wavelength, to determine the concentration of Fe(III) was developed. Fe(II) was oxidized to Fe(III) to determine the total iron in the range 0.02 to 19.42 mg/L with recovery of more than 96.6 percent. Results confirmed that this method is easy, uses simple instruments, is quick and offers high accuracy in the process of measurement. This method can be applied to rapid determination of total iron in EN solutions, as well as determining whether the substrate is completely covered by Ni-P alloy if iron sheets are used.

4 citations

Patent
26 Feb 1993
TL;DR: In this paper, the authors proposed to keep a high Q even in high temperature and high humidity by overlapping a corrosion resistant metallic layer onto a chemical plating copper layer on a dielectric ceramic and heat-treating the layers.
Abstract: PURPOSE:To keep a high Q even in a high temperature and high humidity by overlapping a corrosion resistant metallic layer onto a chemical plating copper layer on a dielectric ceramic and heat-treating the layers. CONSTITUTION:A ceramic compact forming a copper coating film on it, is immersed in a nickel sulfate based electroless nickel plating liquid to form an Ni film having about 0.5mum thickness, and the heat treatment at temperature of 60-600 deg.C, preferably 300 deg.C for 30 minutes, is applied to it. Then, bottom face of the ceramic is ground and an electrode layer is formed to the other face. By such constitution a high Q is maintained even in high temperature and high humidity.

4 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
20233
202223
202124
202033
201957
201832