Electroless nickel plating

About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.

Etching agent for electroless plated thin nickel film

Abstract: PURPOSE:To dissolve and remove only a thin nickel film while inhibiting the erosion and blackening of the pattern of a copper circuit by adding free chlorine ions and a palladium sequestering agent such as oxime to an etching agent contg. an acid and hydrogen peroxide as principal components. CONSTITUTION:An etching agent consisting of about 0.1-50wt% of >=1 kind of acid selected from sulfuric acid, nitric acid and phosphoric acid, about 0.1-50% H2O2, about 2-20,000ppm free Cl and >= about 10ppm Pd sequestering agent dissolves only Ni while inhibiting Pd used as a surface activator in electroless nickel plating reaction from entering an etching soln. together with Ni and eroding a copper pattern or forming a black film on the surface of the pattern. The free Cl is obtd. by adding a chloride such as NaCl. As the Pd sequestering agent >=1 kind of compound selected from oximes, naphthol, amine, phenanthroline, quinaldinic acid, EDTA, benzotriazoles, etc. is used.

Composite sintered sliding material

Abstract: PROBLEM TO BE SOLVED: To improve the mechanical properties of a material while its slidability caused by a solid lubricant is maintained by composing it of a sintered body composed of copper series base material particles and solid lubricant particles subjected to electroless nickel plating. SOLUTION: As the copper series base material particles, e.g., the ones composed of, by weight, 88 to 92% copper powder and 12 to 8% tin powder can be used. As the solid lubricant particles, e.g., molybdenum disulfide or graphite can be used. As for the electroless nickel plating coating uniformly formed on the surface of the solid lubricant particles, its comps. is composed of about 88 to 97% Ni and about 12 to 3% P. Furthermore, relating to the solid lubricant particles, the weight ratio of the solid lubricant components to the plating coating components is preferably regulated to 1:(0.2 to 1.5). The production of the sliding material is executed by compacting a mixture obtd., e.g. by mixing copper powder, tin powder and the solid lubricant particles and sintering this at a sintering temp. of about 800 to 1100K in a reducing atmosphere. COPYRIGHT: (C)1999,JPO

Method for treating aged electroless nickel plating solution

Abstract: PROBLEM TO BE SOLVED: To provide a treatment method capable of efficiently separating and removing Ni ions, a phosphite component and organic acids by a simple operation from an aged electroless Ni plating solution. SOLUTION: This treatment method comprises a process 1 in which Ni ions in an aged solution are separated and recovered as Ni metal through an electroless plating reaction caused by bringing an aged electroless Ni plating solution into contact with Ni powder, a process 2 in which the separated host solution in the process 1 is brought into contact with a chelate resin to absorb and separate residual Ni ions, a process 3 in which a dissolved phosphite component is separated and recovered as Ca phosphite by reacting gypsum or mineral acid and hydrated lime with the separated solution in the process 2, a process 4 in which the residual phosphite component is oxidized and decomposed in the presence of an oxidant into a phosphoric acid component and separated and recovered as Ca phosphate by a reaction with a Ca salt, and a process 5 in which organic substances in the separated solution in the process 4 are removed by an activated sludge process.

Fabrication of Microbump on Aluminum by Electroless Nickel Plating

Abstract: Chip bumping for flip chip and tape automated bonding (TAB) assembly has become increasingly important in microelectronic devices. Several methods using vapor deposition followed by electrolytic deposition to form bumps on a spattered aluminum electrode have been reported. The metallization process can be simplified by use of the electroless plating process. Generally the zincate process is used for electroless nickel plating on aluminum substrate. However, the process can not be applied to the metallization of fine circuits, pads or microbumps with photoresists because photoresist are attacked by the highly alkaline zincate solution. Accordingly, electroless nickel plating on aluminum substrate by methods other than the zincate process have been investigated. As a result, straight-walled bumps of up to approximately 20μm in height and between 20μm to 80μm in cubic area can be formed without damege to the photoresist by nickel displacement followed by electroless plating. In addition, nickel bumps can be more uniformly fabricated on an aluminum substrate initially accelerated with DMAB and followed by electroless nickel plating.

Electroless nickel deposition on fraxinus mandshurica veneer modified with apths for emi shielding

Abstract: Electroless nickel deposition was carried out on Fraxinus mandshurica veneers for EMI shielding under a new activation process. In the process, Pd(II) was absorbed on the surface of veneers modified with γ-aminopropyltrihydroxysilane (APTHS) obtained from the hydrolysis of γ-aminopropyltriethoxysilane (APTES). After the reduction, electroless plating was successfully initiated, and Ni-P coating was deposited on the veneers. The activation process and resulting coating were characterized by XPS, SEM-EDS, and XRD. The metal deposition, surface resistivity, and electromagnetic shielding effectiveness were measured. XPS analysis proved that Pd(II) was bonded to the amino group of APTHS and reduced to Pd(0). The coating was continuous, uniform, and compact. It consisted of 97.4 wt% nickel and 2.6 wt% phosphorus. XRD analysis showed that the coating was crystalline, which was related to the low phosphorus content. The plated Fraxinus mandshurica veneers exhibit good electro-conductivity with surface resistivity of 0.21Ω•cm-2 and higher electromagnetic shielding effectiveness of over 50dB in frequencies from 10 MHz to 1.5 GHz.