Topic
Electroless nickel plating
About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.
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Patent•
02 Feb 2012
TL;DR: In this article, the authors proposed a method for manufacturing a flaw-free electroless nickel plating film using an electroless plating process, which includes the steps of: forming an aluminum layer having a purity of 99.99% or more and a film thickness of 2.5 μm or more on a substrate by using a sputtering; and forming the electroless n-gram plating on the aluminum layer by using an electrical plating.
Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a flaw-free electroless nickel plating film.SOLUTION: The method for manufacturing an electroless nickel plating film includes the steps of: forming an aluminum layer having a purity of 99.99% or more and a film thickness of 2.5 μm or more on a substrate by using a sputtering; and forming the electroless nickel plating film on the aluminum layer by using an electroless plating. The method may further include a step of forming a titanium layer having a purity of 99.99% or more between the substrate and the aluminum layer.
3 citations
Patent•
16 Feb 2012
TL;DR: In this article, the authors provided a structure with an electroless Ni plating film generating no crack and few warpage, and a semiconductor wafer with no warpage when forming a UBM by electroless plating.
Abstract: PROBLEM TO BE SOLVED: To provide a structure with an electroless Ni plating film generating no crack and few warpage, a semiconductor wafer generating no crack in the Ni plating film and few warpage when forming a UBM in a semiconductor wafer by electroless plating, and a production method thereof.SOLUTION: A structure with an Ni plating film formed on a substrate with electroless Ni plating is provided: wherein, the Ni plating film is formed with electroless Ni plating with which a columnar crystalline Ni plating film is formed, and with electroless Ni plating with which an amorphous Ni plating film is formed; and, after the columnar crystalline Ni plating film is formed to 50-90% of the total film thickness of the Ni plating film, the amorphous Ni plating film is formed on the columnar crystalline Ni plating film to 10-50% of the total film thickness of the Ni plating film. A semiconductor wafer is also provided which has a structure in which the Ni plating film is formed on electrode surfaces of the substrate.
3 citations
Patent•
18 Nov 2004
TL;DR: In this paper, a plating method for a die for injection molding comprising of beryllium copper stock is proposed, which is the treatment of applying plating to the surface of a die.
Abstract: PROBLEM TO BE SOLVED: To provide a plating method capable of obtaining a die for injection molding having a satisfactory molded face free from roughness and further having a long service life in a plating method for a die for injection molding comprising a stock consisting essentially of beryllium copper SOLUTION: The plating method is the treatment of applying plating, eg, to the surface of a die for injection molding consisting of beryllium copper as the stock In the method, successively to degreasing treatment 1, electrolytic activation treatment 2 is performed, then, nickel strike plating treatment 3 and mat nickel plating treatment 4 are performed, further, amorphous electroless nickel plating treatment 5 and passivation treatment 6 are performed, and finally, posttreatment 7 such as water washing treatment, pure hot water washing and drying is performed By the plating treatment, the die for injection molding free from surface roughness, reduced in the change of dimensions and having a long die life can be obtained COPYRIGHT: (C)2005,JPO&NCIPI
3 citations
Patent•
22 Dec 1986
TL;DR: In this article, an amorphous metallic film is formed on the inner surface of a heat exchanger tube of a Cu or a Cu alloy to prevent the corrosion of a inner surface contacting with a corrosive medium such as seawater or hot water.
Abstract: PURPOSE:To improve the corrosion resistance of a Cu or Cu alloy tube without deteriorating the heat transfer characteristics by forming an amorphous metallic film on the inner surface of the tube contacting with a corrosive medium. CONSTITUTION:An amorphous metallic film is formed on the inner surface of a heat exchanger tube of Cu or a Cu alloy to prevent the corrosion of the inner surface contacting with a corrosive medium such as seawater or hot water. The amorphous metallic film is a film of Ni-P, Ni-B or Ni-P-B formed by electroless nickel plating or a film of Fe-Cr-P, Fe-Cr-B or other alloy formed by electroplating. The amorphous metallic film maintains stably the amorphous state up to about 200-300 deg.C with slight deterioration in the heat transfer characteristics of the tube. When the tube is used in piping for supplying hot water, the bluing of water or other trouble can be prevented.
3 citations
Patent•
07 Aug 1985
TL;DR: In this paper, an amine salt with sodium boron hydride in a specific solvent was used to obtain the titled compound useful as a reducing agent for electroless nickel plating in high yield.
Abstract: PURPOSE:To obtain the titled compound useful as a reducing agent for electroless nickel plating in high yield, by reacting an amine salt with sodium boron hydride in a specific solvent, treating the reaction product simply after the reaction. CONSTITUTION:Diethylene glycol dimethyl ether or ethylene glycol diethyl ether is mixed with an amine salt, and reacted with sodium boron hydride or potassium boron hydride. After the reaction is over, a solvent is distilled away from the reaction product.
3 citations