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Electroless nickel plating

About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.


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Patent
30 May 2011
TL;DR: In this paper, a method was proposed to provide a method of forming a metal film pattern having excellent adhesion reliability and precision on a resin base material efficiently by using a low concentration metal ion solution.
Abstract: PROBLEM TO BE SOLVED: To provide a method of forming a metal film pattern having excellent adhesion reliability and precision on a resin base material efficiently by using a low concentration metal ion solution.SOLUTION: A resin base material having a metal film pattern is produced by a method including the following steps (a)-(e). (a) A step for printing a pattern of a latent image agent on the surface of the resin base material, (b) a step for generating a metal salt by bringing a solution containing metal ions into contact with a part where the latent image agent is printed, (c) a step for reducing the metal salt by bringing it into contact with an acid processing liquid containing a reductant, (d) a step for forming an electroless nickel plating film at a part where the latent image agent is printed, and (e) a step for making the electroless nickel plating film precipitate on the surface of the nickel plating film.

3 citations

Patent
19 Feb 2009
TL;DR: In this paper, a method for manufacturing a magnetic steel component as regards magnetic steel that is used in the construction of aircraft and industrial components generally including solenoids and electric motors was proposed.
Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a magnetic steel component as regards magnetic steel that is used in the construction of aircraft and industrial components generally including solenoids and electric motors SOLUTION: An electroless nickel plating is formed on a substrate 10 that includes magnetic steel A thermal cycle is thereafter performed at a temperature that is sufficiently high to sinter the electroless nickel plating and thereby form a densified plating 16 on the substrate 10 According to one embodiment, the thermal cycle includes a solid state diffusion sintering process wherein the substrate 10 and the densified plating 16 are heated to a temperature of at least about 1,300°F (about 704°C) but below the melting temperature of the electroless nickel plating According to another embodiment, the thermal cycle includes a transient liquid phase sintering process wherein the substrate 10 and the densified plating 16 are heated at least to the melting temperature of the electroless nickel plating COPYRIGHT: (C)2009,JPO&INPIT

3 citations

Patent
20 Jan 2005
TL;DR: In this article, an electroless nickel plating layer 8 on the surface of an injection mold is added to ensure the high processability required for injection molding of a resin of every kind.
Abstract: PROBLEM TO BE SOLVED: To provide an injection mold used for injection-molding of a resin of every kind and having high processability, and also to provide its manufacturing method SOLUTION: The processability to the molding surface 3a of a mold 3 is enhanced by forming an electroless nickel plating layer 8 on the surface of the injection mold 2 Hardness required for injection molding is ensured in the electroless nickel plating layer 8 by further applying heat treatment to the electroless nickel plating layer 8 at a temperation higher than a heating temperature in injection molding COPYRIGHT: (C)2005,JPO&NCIPI

3 citations

Patent
12 Feb 1993
TL;DR: In this paper, the authors proposed to obtain the electromagnetic wave shield performance through few steps by applying coating on the surface side of plastic product that is necessary to be plated after applying activation processing on the products entirely to form a catalyzer layer and bringing the entire products into contact with an electroless plating solution so that the metallic plating film may be precipitated on the non-coated section.
Abstract: PURPOSE:To efficiently obtain the electromagnetic wave shield performance through few steps by applying coating on the surface side of plastic product that is necessary to be plated after applying activation processing on the products entirely to form a catalyzer layer and bringing the entire products into contact with an electroless plating solution so that the metallic plating film may be precipitated on the non-coated section CONSTITUTION:A housing parts 11 is immersed entirely in a catalyzer form a tin- paradium colloid-based catalyzer layer 21 wholely over a front surface 11a and a rear surface 11b Next, while the surface 11b, etc, are left for plating processing as they are, the surface 11a unnecessary to be plated is mainly applied with outer coating to form a coating film 13 Then the parts 11 is entirely immersed in an electroless copper plating bath to be applied with electroless plating, so that the electroless copper plating film 23 is selectively formed only on the surface 11b using the layer 21 remaining only on the surface 11b as a core The parts 11 is further immersed in an electroless nickel plating bath to precipitate and form an electroless nickel plating film 25 for the rust preventive film of the film 23

3 citations

Patent
28 Aug 2002
Abstract: PROBLEM TO BE SOLVED: To easily reutilize produced waste at a low cost. SOLUTION: The electroless nickel plating method is performed with a plating solution 100 using nickel hypophosphite as a nickel source 101, and using at least two kinds selected from nickel hypophosphite, sodium hypophosphite and hypophosphorous acid as a reducing agent. In this method, a part of the plating solution 100 in a plating tank 20 is extracted into a first treatment tank 11, and at least one kind selected from calcium hydroxide and calcium carbonate is added to the inside of the first treatment tank 11. The produced precipitated calcium phosphite 105 is separated and removed from the plating solution 100 by a solid-liquid separator 14. After that, the plating solution 100 is controlled by a second treatment tank 15, and is then returned to the inside of the plating tank 20, so that the concentration of phosphorous ions produced in the plating solution 100 within the plating tank 20 is held within a fixed range.

3 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
20233
202223
202124
202033
201957
201832