Electroless nickel plating

About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.

High pure aluminum alloy chemical nickel-plating activated liquid and activating technique thereof

Abstract: The invention provides high purity aluminum alloy electroless nickel plating activation solution, which uses water as solvent, per liter of solution comprises 10-40g phosphoric acid, 2-10g boric acid, 5-30g acetic acid, 2-6g thiourea, 10-25g ammonium sulfate, 10-30g trisodium phosphate and 15-40g ammonium bifluoride. The technological process of the process of treating the surface of aluminum alloy using the high purity aluminum alloy electroless nickel plating activation solution comprises degreasing, obtained cleaning surface, activation and subsequent processing, after the aluminum alloy which is needed to be activated is degreased and discharged form the cleaning surface, the aluminum alloy which is socked in 20-55 DEG C is put in the high purity aluminum alloy electroless nickel plating activation solution for 30-300 seconds, a layer of thin sand face which has excellent attachment is capable of being formed on the surface of an aluminum matrix, and a coating with excellent adhesion is capable of being obtained on the thin sand surface.

Roll for rolling process and its manufacture

Abstract: PURPOSE:To manufacture a roll having a high flatness and wear resistance for a rolling process by thermally spraying carbide cermet on the treated surface of a roll and performing electroless nickel plating with a Ni-P alloy on the sprayed layer. CONSTITUTION:The roll surface is treated by a usual method such as grid blasting to remove foreign matter and to give ruggedness. The surface after the treatment is subjected to thermal spraying with metal carbides such as WC, CrC, TiC and a carbide cermet consisting of Co, Ni or their alloys. Electroless nickel plating is performed on the sprayed layer with a NiP alloy. After that, as necessary, the plating layer is heat treated at a temp. of >=200 deg.C for 0.1hr. Hence, the rolling roll having good wear resistance, flatness enough to scarcely flaw a rolled stock, and a long service life is obtained.

Surface treatment agent, article surface-treated therewith and method of nickel plating using the agent

Abstract: A surface treatment agent which comprises a liquid prepared by mixing or reacting a noble metal compound with a silane coupling agent having a functional group capable of capturing a metal in the molecule thereof; and the surface treatment agent further comprising an oxidizing agent, which has improved stability. The surface treatment agent allows the reduction of the make-up frequency for a catalyst liquid for use in, for example, an electroless nickel plating on copper or a copper alloy, and is improved in stability, and further improves the wettability of a surface, in particular, of a metal.

Characterization of the Contamination Factor of Electroless Ni Plating Solutions on the ENIG Process

Abstract: The electroless nickel immersion gold process often produces defects, such as pinholes and black pads that can cause brittle fractures at the interface between the solder and metal pad. Contamination in electroless Ni plating solutions with increasing metal turn over (MTO) is believed to be one of the causes of the formation of surface defects. MTO means indirectly Ni bath life, with ‘‘0 MTO’’ indicating a freshly plating bath and ‘‘2 MTO’’ an aged plating bath, which is supplemented twice with the initial amount of metallic salts and the reducing agent. In this study, surface defects on the Ni-plated layer were investigated to understand the correlation between the MTO solutions and defect factors by solder resist (SR) dissolution. The characteristics of the contaminated MTO solutions were analyzed by total organic carbon and liquid chromatography mass spectrometry (LC-MS). LC-MS detected the component (melamine) of the hardener of the SR at 2.14 ppm in the 2 MTO, and 2.52 ppm in the 2.5 MTO solutions. Electroless nickel plating was conducted in a 0 MTO solution with hardener addition. Pinholes were observed in solutions containing more than 2 ppm of a hardener. In particular, the content of phosphorus in the defective area was higher than that in the non-defective area. Consequently, as the MTO solution increased, the hardener was dissolved in the Ni solution, which caused defects in the nickel surface layer, such as pinholes and black pads.

Thick-film formation in electroless gold plating

Abstract: PROBLEM TO BE SOLVED: To solve a problem of a thick-film formation of a gold plating film in a short time and the problem of fin flaws of nickel by applying a nickel plating using an electroless nickel plating soln containing an inorg sulfur compd as a gold plating pretreatment of a circuit pattern for an electronic substrate SOLUTION: An electroless gold plating is executed after applying nickel plating by using an electroless plating soln to which thiosulfate, dithionate, polythionate or dithionite having S-S sulfur bond are added The addition of the compd having S-S sulfur bond is 001-100mg/l, especially preferably 05-50mg/l, and the plating is executed by a conventional method Further, at the time of the elecroless gold plating after nickel plating with this plating soln, the plating is executed by using a plating bath containing gold cyanate as a starting material of the gold and having a pH of 4-9 COPYRIGHT: (C)1997,JPO