Topic
Electroless nickel plating
About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.
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26 Mar 1990
TL;DR: In this paper, the surface of a metallic base material applied with underlying nickel plating is subjected to nickel plate plating by the use of a nickel bath contg. ammonium ions.
Abstract: PURPOSE:To produce an electrode having low hydrogen overvoltge and excellent durability and corrosion resistance, by subjecting the surface of a metallic base material applied with underlying nickel plating to nickel plating by the use of a nickel bath contg. sulfur. CONSTITUTION:Underlying nickel plating is applied on the surface of a metallic base material by using a nickel plating bath contg. ammonium ions and further nickel plating is applied thereon by using a nickel plating bath contg. sulfur. The plating bath for said underlying plating contains soluble nickel salt such as nickel chloride and ammonium salt, and the concn. of the ammonium ions therein is required to be >=0.05mol concn. The plating bath contg. sulfur contains soluble nickel salt, and soluble sulfur-contg. compds. such as salts of oxo acids having <=5 oxidation number of sulfur like thiourea, thiocyanate, sulfite or the like. It is possible to obtain underlying nickel plating of good adhesion by applying copper plating or electroless nickel plating beforehand on the metallic base material.
3 citations
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18 Apr 1995
TL;DR: In this article, the authors propose to produce mechanism parts capable of securely operating over a long period by successively laminating an electroless nickel plating substrate and a ceramic layer at least on either contact face of mechanism parts mechanically connected and mutually contacted rotatably and slidingly.
Abstract: PURPOSE:To produce mechanism parts capable of securely operating over a long period by successively laminating an electroless nickel plating substrate and a ceramic layer at least on either contact face of mechanism parts mechanically connected and mutually contacted rotatably and slidingly. CONSTITUTION:A substrate 21 is formed on parts 20 such as a roller and a pawl by electroless Ni-B plating treatment, and its hardness is increased by heat treatment. Next, a ceramic film 22 of TiC or the like is formed on the substrate 21 by a physical deposition method or the like. Thus, the mechanism parts sufficiently withstanding even if being used for a part subjected to high bearing pressure over a long period can be obtd.
3 citations
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TL;DR: In this paper, an electroless technique was developed for the deposition of nickel in this laboratory, where a nickel salt is reduced on the surface being coated, usually iron or steel, by sodium hypophosphite.
Abstract: Following the method of Brenner and Riddell, an ‘electroless’ technique has been developed for the deposition of nickel in this laboratory. In this technique a nickel salt is reduced on the surface being coated, usually iron or steel, by sodium hypophosphite. In contrast with displacement plating, the surface itself does not enter directly into the reaction. Under proper conditions, nickel is an effective catalyst for the reduction and this auto-catalytic effect permits the formation of coatings several mils thick, provided the hypophosphite and nickel salt in the bath are periodically replenished. Rates of deposition as high as 0·008 in. per hour have been obtained. The deposition can be made on both metals and insulators. Electroless nickel is superior in several respects to the conventional electro-deposit and, in addition, has the distinct advantage that the deposit is uniform in thickness on all surfaces to which the solution is freely accessible.A brief report is given here of the mechanism ...
3 citations
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TL;DR: In this article, the effect of the ZnO sol concentration, annealing temperature and the number of the spin-coating layers on the crystal structure, film morphology and photoelectric performance were also studied.
3 citations
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04 Nov 1994
TL;DR: In this paper, the skipping phenomenon in electroless nickel plating step due to the decline in palladium catalyst activity and the Au plating bridge phenomenon in the plating process can be avoided.
Abstract: PURPOSE:To avoid Au bridge over circuits by a method wherein after electroless nickel plating step, a copper surface is processed with an aqueous solution having a specific pH adjusted by surfactant and a buffer solution, and plated with gold by metal replacement. CONSTITUTION:A material having copper surface is processed with an aqueous solution composed mainly of a water-soluble palladium salt and an inorganic salt before electroless nickel plated. Next, said material is processed with an aqueous surfactant solution whose pH is adjusted to 8-9 by a buffer solution, and plated with gold by metal replacement. Through these procedures, the skipping phenomenon in electroless nickel plating step due to the decline in palladium catalyst activity and the Au plating bridge phenomenon in the plating step can be avoided.
3 citations