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Electroless nickel plating

About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.


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Journal ArticleDOI
TL;DR: In this paper, a competition mechanism between two opposite actions, the adsorption from bulk solution by diffusion and the burying by nickel deposition, is used to explain the effect of as a catalytic inhibitor.
Abstract: With the advent of flip chip assembly, pads to be plated on printed circuit boards (PCBs) have shrunk dramatically to around . As a result, most commercial electroless nickel baths will fail to deposit nickel on such small micropads. In this paper, using a specially designed PCB layout, the effects of concentration and local environment are studied. A competition mechanism between two opposite actions, the adsorption from bulk solution by diffusion and the burying by nickel deposition, is used to explain the effect of as a catalytic inhibitor. On a constantly growing surface, the dynamic density of adsorbed is the net result of these two opposite actions. Using this competition mechanism, the skipping problem of micropads is attributed to the combined result of nonlinear diffusion and high concentration of in the bulk solution. This competition mechanism also gives a new explanation for the effect of potential pinning. In the case of potential pinning, galvanic effect by electrons flowing from one area to another only exists during the initial period of nickel deposition. Once it is started, nickel deposition on any area is maintained by the electroless process, and hence, is actually self‐supporting, By reducing the bulk concentration of to a lower range in a commercial bath, we have realized consistent nickel plating on micropads as fine as 50 μm in diameter. © 1999 The Electrochemical Society. All rights reserved.

38 citations

Journal ArticleDOI
TL;DR: In this paper, the initial deposition process of electroless nickel plating was investigated by combining a quartz crystal microbalance (QCM) method with microscopy, and four stages were noted: an induction period before the initiation of deposition, an acceleration period with an increase in the deposition rate, a deceleration period with a decrease in deposition rate and a stationary period at a constant deposition rate.

38 citations

Journal ArticleDOI
TL;DR: In this article, two mechanisms of phosphorus incorporation with nickel in electroless plating nickel are studied using X-ray fluorescence spectrometer (XRF) and cyclic voltammetry (CV).
Abstract: The two mechanisms of phosphorus incorporation with nickel in electroless plating nickel are studied using X-ray fluorescence spectrometer (XRF) and cyclic voltammetry (CV). The results of XRF and CV data on the effect ofsingle and double complexing agents on deposition rate and deposit composition indicate that nickel chelates can catalyze phosphorus generation, i.e., the mechanism of interface complex heterocatalysis on phosphorus incorporation with nickel. Furthermore, the choice principle to complexing agents for low-phosphorus electroless nickel bath was proposed based on it. Additionally, the direct mechanism of phosphorus generation can explain how single sodium hypophosphite can be reduced on nickel substrate on the CV curve. Finally, the optimal condition for low-phosphorus electroless nickel plating baths was determined. The experimental results support the explanation of the proposed mechanism.

38 citations

Journal ArticleDOI
TL;DR: In this paper, a simple electroless Ni-P plating process for preparing a conductive wood veneer has been developed, where activation was combined with electroless deposition in the plating solution.
Abstract: A new, simple electroless Ni–P plating process for preparing a conductive wood veneer has been developed. In this process, the activation was combined with electroless deposition in the plating solution. This provides a simple, environmentally friendly method, by which a Ni–P layer was successfully deposited on the surface of Manchurian ash veneer. It was observed by scanning electron microscopy that the deposited layer was uniform, compact and continuous. Results from energy-dispersive spectroscopy showed that a low-phosphorus layer was obtained, which contained about 4 wt.% phosphorus and 96 wt.% nickel. X-ray diffraction analysis indicated that the coating was crystalline. It is considered that the crystalline structure is related to the low-phosphorus content of the layer. Veneers plated with the crystalline Ni–P coating had good electrical conductivity, with a surface resistivity less than 200 mΩ/cm 2 and a firm adhesion of the Ni–P coating to the wood.

38 citations

Journal ArticleDOI
TL;DR: A novel method for the preparation of ink-jet printing ink with palladium (Pd) nanoparticles reduced by styrene (St) oligomers is presented in this article.

38 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
20233
202223
202124
202033
201957
201832