Topic
Electroless nickel plating
About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.
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Patent•
05 Mar 2003TL;DR: A flip chip package, apparatus and technique in which a ball grid array composed of a doped eutectic Pb/Sn solder composition is used as mentioned in this paper, which results in fewer fractured solder bonds and greater package reliability.
Abstract: A flip chip package, apparatus and technique in which a ball grid array composed of a doped eutectic Pb/Sn solder composition is used. The dopant in the Pb/Sn solder forms a compound or complex with the phosphorous residue from the electroless nickel plating process that is mixable with the Pb/Sn solder. The phosphorous containing compound or complex prevents degradation of the solder/under bump metallization bond associated with phosphorus residue. The interfacial solder/under bump metallization bond is thereby strengthened. This results in fewer fractured solder bonds and greater package reliability.
3 citations
Journal Article•
TL;DR: In this paper, an electroless plating process for plating gold on optical fiber in optical communication field is proposed, where the effects of pretreatment and activation process on the properties of gold plated optical fiber are discussed.
Abstract: An electroless plating process for plating gold on optical fiber in optical communication field is proposed. Through pretreatment, Pd-Ag activation, electroless nickel plating and gold electroplating, a gold plated optical fiber with high solderability and adhesion can be obtained, which can satisfy the requirements of optical communication. The effects of pretreatment and activation process on the properties of gold plated optical fiber are discussed.
3 citations
Patent•
30 Nov 2017
TL;DR: In this article, the authors proposed a system for preventing air and water pollution of a plating facility, which consists of at least one plating tank, at least two washing tanks, and a scrubber and a waste liquid treatment device.
Abstract: The present invention relates to a system for preventing air and water pollution of a plating facility. More specifically, an objective of the present invention is to recover nickel sulfate from electroless nickel plating waste liquid created in a surface treatment of an electronic part or the like to reuse nickel sulfate, efficiently adsorb heavy metals contained in the waste liquid to remove the heavy metals, and remove impure organic matter to reduce the harmful effects caused by harmful wastewater. The system for preventing air and water pollution of a plating facility comprises: at least one plating tank and at least one washing tank; a scrubber and a waste liquid treatment device to treat polluted air and waste liquid created in the plating tank and the washing tank; a wastewater treatment unit to treat waste liquid from which heavy metals have been adsorbed and removed by a heavy metal adsorption composition coated on a surface of a carrier installed in the waste liquid treatment device; and a nickel sulfate recovery device between the plating tank and the washing tank and the waste liquid treatment device. An oil, fat and organic matter removal processing device is installed between the nickel sulfate recovery device and the waste liquid treatment device.
3 citations
Patent•
15 Oct 1992
TL;DR: In this article, an electroless nickel plating bath was used to simplify the polishing of Ni-P film by adding a water-soluble lead compd. and water soluble antimony or bismuth compd as the electroless coating bath.
Abstract: PURPOSE: To simplify polishing of an Ni-P film by using an electroless nickel plating bath added with a water-soluble lead compd. and water-soluble antimony or bismuth compd. as the electroless nickel plating bath. CONSTITUTION: An aluminum or aluminum alloy substrate is subjected to a zinc substitution treatment. The substrate is thereafter subjected to electroless nickel plating. The plating bath prepd. by adding the water-soluble lead compd. and the water-soluble antimony or bismuth compd. into the plating bath for which hypophosphoric acid or its salt is used as a reducing agent, is used as the electroless nickel plating bath at this time. The substrate is subjected to surface polishing after the electroless nickel plating and further, a magnetic film, protective film, lubricating layer, etc., are formed thereon, by which the memory hard disk is produced. Since this Ni-P film is little in nodule in such a case, the polishing of the Ni-P film is simplified. The polishing for smoothing is omitted and only the texturing is needed in some cases. COPYRIGHT: (C)1994,JPO&Japio
3 citations
Journal Article•
TL;DR: In this article, a nouvelle methode de revetement des pieces de zinc coulees sous pression, le nickelage chimique, permet d'obtenir de bonnes caracteristiques for les pieces traitees.
Abstract: Description d'une nouvelle methode de revetement des pieces de zinc coulees sous pression: le nickelage chimique. Ce procede permet d'obtenir de bonnes caracteristiques pour les pieces traitees: resistance a l'usure et a la corrosion, adherence du revetement, durete, ... Comparaison avec les differentes methodes de plaquage couramment utilisees
3 citations