Electroless nickel plating

About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.

Comparative investigation of different types of nickel foam samples for application in supercapacitors and other electrochemical devices

Abstract: Nickel foam is widely used as a current lead/current collector and the basis of nickel hydroxide electrodes for various electrochemical devices – batteries, hybrid supercapacitors, devices for electrocatalytic oxidation of organic substances. The characteristics of commercial samples of nickel foam produced by Novomet-Perm (Russian Federation) obtained by electroless and then electrochemical nickel plating and Linyi Gelon LIB Co Ltd (China) obtained by electroless nickel plating were studied. The nature of passivity was determined by forming model samples of electrochemical and electroless nickel on a steel base. For the passive sample, activation was carried out by applying a layer of electrochemical nickel from an impact nickel plating solution. Activated, non-activated samples of nickel foam, as well as model samples, were studied by the methods of cyclic voltammetry and galvanostatic charge-discharge cycling in the supercapacitor mode. Comparative analysis of Chinese-made and Russian-made nickel foam samples showed significant passivity of the former – in cyclic voltammetry, the activity was 4.8 times lower, with galvanostatic charge-discharge cycling – 2.59 times lower. It was suggested that high passivity was determined by the fact that the sample consisted of Ni-P or Ni-B alloy. This assumption was proved by the method of natural simulation. The electrochemical activity of electroless nickel was 1.25 times lower than that of electrochemical nickel (according to cyclic voltammetry data) and 1.58 times lower (according to galvanostatic cycling data). For the first time, Chinese-made nickel foam (electroless nickel) was activated by applying a layer of electrochemical nickel from an impact nickel electrolyte. The high activation efficiency was shown as follows – on the cyclic curve, the specific current of the anodic peak increased 8.71 times, and with galvanostatic cycling, the increase in specific capacity was from 1.73 times (at i=120 mA/cm2) to 4.84 times (at i=20 mA/cm2)

High-efficiency and environmental-protection recovery method of nickel in spent electroless nickel plating bath

Abstract: The invention discloses a high-efficiency and environmental-protection recovery method of nickel in spent electroless nickel plating bath A low-temperature vacuum evaporation and concentration device is used for evaporating and concentrating electroplating aging liquid; generated steam is condensed to serve as cleaning water; the concentrated electroplating aging liquid is fed into a photoelectric catalysis device; through ultraviolet catalysis and electrochemical oxidation effects, organic pollutants in waste water are removed; and meanwhile, nickel ions in the waste water are transferred to a cathode under the effect of an external electric field, and are reduced to metallic nickel at the cathode The method can realize recovery of the metallic nickel in the spent electroless nickel plating bath, reduces the environmental pollution caused by the electroplating aging liquid, largely reduces the operation energy consumption and the economic cost, and is excellent in environmental benefit and economic benefit

Etching method for transparent conductive film

Abstract: PURPOSE:To obtain patterns of transparent conductive films having good quality without polluting environment by plating a metallic layer on a transparent conductive film of SnO2 or In2O3 formed on a substrate then etching the same by using an acid soln CONSTITUTION:A transparent conductive film of SnO2 is formed over the entire surface of a glass substrate 1 by a CVD method or the like Thereafter, the film is patterned with a photoresist agent to form resist films 3 on the required parts of the film 2 Further, the films are baked for about 20min at about 100 degC, and then dipped in an electroless nickel plating soln to plate a nickel layer 4 on the unnecessary parts With about 4mol hydrochloric acid as an etching soln 6, the substrate is etched to remove the SnO2 of the unnecessary parts together with the Ni layer 4 The resist films 3 are stripped with a prescribed stripping soln 7 for resist, whereby the transparent conductive films patterned as display electrodes are obtained on the substrate 1

A new mechanism for the influence of electroplating and electroless plating on ferroelectric components

Abstract: Electroplating and electroless plating are applied in the processing of ferroelectric components and they often have some negative influence on the properties of the components. Based on the results of some experiments with ferroelectric multilayer ceramic capacitors and ferroelectric ceramic semiconducting thermistors, a new mechanism for the influence of electroplating and electroless plating on ferroelectric components is proposed and discussed. According to the mechanism oxygen vacancy and free electron are formed in ferroelectric components at room-temperature by the reduction reaction of absorbed hydrogen atoms generated in electrochemical processes. Leakage current increase in ferroelectric multilayer ceramic capacitors failed in electroplating can be satisfactorily explained by the conduction of free electrons, and the weakening of the PTCR (positive temperature coefficient of resistance) effect in ferroelectric ceramic semiconducting thermistors after electroless nickel plating can be at...