Topic
Electroless nickel plating
About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.
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TL;DR: In this paper, the authors showed that after carbon fiber T - 700 was plated by nickel, the absorbing properties were remarkably improved, and the material was less than - 5db in the X band and - 10 db in the Ku band when the distance was between 5mm and 8mm, and quality score is in 0.53wt % ~ 2.16 wt %.
Abstract: It is a way of preparing absorbing composite materials when nickel plating carbon fiber is arranged in epoxy matrix orthogonally. The results indicated that after carbon fiber T - 700 was plated by nickel, the absorbing properties were remarkably improved. In nickel plating carbon fiber/resin composite absorbing material, the distance and quality score of carbon fiber in the resin have important influence on absorbing properties. When the distance was between 5mm and 8mm, and quality score is in 0.53wt % ~ 2.16 wt %,we can get the absorbing material that was less than - 5db in the X band and - 10db in the Ku band.
2 citations
TL;DR: In this paper, the authors used activation solutions containing dimethyl amine borane (DMAB) for electroless nickel plating on copper substrates and found that the bonding strength of electroless gold plating was increased with increasing phosphorus contents in the nickel films.
Abstract: Generally, contact or terminal areas are coated with nickel as a barrier layer; subsequently, gold plating is performed to maintain reliability of electrical interconnection. Treatment using dilute solutions of palladium ions have been applied to initiate electroless nickel plating on copper substrates because copper has no catalytic action for the oxidation of hypophosphite. However, trace amounts of palladium ions may remain on the unwanted areas and extraneous nickel deposits are often observed. We confirmed that nickel films without extraneous deposits can be formed using the activation solutions containing dimethyl amine borane (DMAB). Bondability on the electrolessly deposited gold was greatly influenced by the phosphorus contents of the deposited nickel films as the underlayer. Bonding strength after electroless gold plating was increased with increasing phosphorus contents in the nickel films. Stabilizers in the electroless gold plating also influenced the bonding strength. Baths containing cupferron or potassium nickel cyanide as a stabilizer showed superior bondability. Gold deposits having strong orientation with Au(220) and Au(311) indicated high bond strength.
2 citations
TL;DR: In this article, the corrosion resistances of electroless nickel plating films, having different phosphorus contents from plating baths of the same compositions (but of different pH values), were measured by a few sorts of electrochemical methods and dissolution tests in solutions of IN-H2SO4, 5%-NaCl, and IN-NaOH.
Abstract: Phosphorus contents of nickel plating films obtained from electroless nickel plating baths containing various kinds of organic salts were determined.Corrosion resistances of electroless nickel plating films, having different phosphorus contents from plating baths of the same compositions (but of different pH values), were measured by a few sorts of electrochemical methods and dissolution tests in solutions of IN-H2SO4, 5%-NaCl, and IN-NaOH.As the results, the corrosion resistances of the plating films increased with the increase of phosphorus contents, but passivity effects were not found in each film containing phosphorus.
2 citations
Patent•
16 May 2014
TL;DR: In this article, a lead-free and cadmium-free electroless nickel plating solution was proposed, which includes a nickel metal salt for providing nickel ions for plating, a reducing agent for reducing the nickel ions and a complex forming agent for forming a complex with nickel ions, including carboxylic acid and alpha hydroxyl acid.
Abstract: The present invention provides a lead-free and cadmium-free electroless nickel plating solution that has eco-friendly and improved stability of a nickel plating solution and has excellent plating characteristics. The lead-free and cadmium-free electroless nickel plating solution according to an embodiment of the present invention comprises a nickel metal salt for providing nickel ions for plating; a reducing agent for reducing the nickel ions for plating; a complex forming agent for forming a complex with nickel ions for plating and including carboxylic acid and alpha hydroxyl acid; and a lead-free and cadmium-free metal stabilizer for inhibiting the reduction of the nickel ions for plating and including an metal element.
2 citations
Patent•
22 Dec 1984
TL;DR: In this paper, a machined light alloy casting is precision-machined to a prescribed size and is then washed with an org. solvent so that the cutting oil is removed as much as possible.
Abstract: PURPOSE:To prevent generation of dust from the surface of a machined light alloy casting by subjecting said casting to electroless nickel plating then subjecting the remaining cutting oil to a carbonization treatment. CONSTITUTION:A light alloy casting is precision-machined to a prescribed size and is then washed with an org. solvent so that the cutting oil is removed as much as possible. The casting is thereafter subjected to alkali washing to remove the dust failing to be removed and to washing. The casting surface is further etched to remove the deteriorated surface layer of the release agent and oxide film and the etched casting is washed. The surface is subjected to zinc replacement to form about 0.2-0.3mu zinc layer and is washed. Electroless nickel is plated about >=3mu thereon by electroless nickel plating to prevent the dislodging of the fine casting metal pieces and thereafter the casting is washed. A chromic acid soln. having a prescribed concn. is adjusted in pH and is heated to prepare a treating soln. in which the casting is dipped to dissolve and remove the cutting fluid in the blowholes failing to be removed by a carburization treatment. After the casting is washed, an ultrasonic wave is used in combination in hot water to remove thoroughly the chromic acid.
2 citations