Electroless nickel plating

About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.

Electroless nickel plating method to object to be plated which has blind hole

Abstract: PROBLEM TO BE SOLVED: To provide an electroless nickel plating method which is capable of forming sufficient electroless nickel plating layers even within the blind holes of an object to be plated which has the blind holes SOLUTION: This method performs electroless nickel plating by immersing the object to be plated which has the blind holes into an electroless nickel plating liquid of a first stage and filling the blind holes with the electroless nickel plating liquid, then immersing the object to be plated in an electroless nickel plating liquid of a second stage in the state that the electroless nickel plating liquid remains in the blind holes, in which the electroless nickel plating liquid of the first stage contains a nickel compound at ≥015 mol/l and a pH buffering agent at ≥025 mol/l COPYRIGHT: (C)2002,JPO

Method for activating circuit surface of PCB (printed circuit board) to realize electroless nickel plating

Abstract: The invention provides a method for activating the circuit surface of a PCB (printed circuit board) to realize electroless nickel plating, and belongs to the field of PCB manufacturing. The method comprises the following steps: 1) preparing an activation solution according to the proportion that the concentration of a pH stabilizing agent is 1-100g/L, and the concentration of a reducing agent is 10-50g/L, wherein the pH stabilizing agent is one kind or several kinds of the following components: sodium hydroxide, potassium hydroxide, ammonium hydroxide, sodium acetate, ammonia chloride and the like; the reducing agent is one kind or several kinds of the following organic reducing agents: formaldehyde, acetaldehyde, glyoxylic acid, methyl alcohol, vitamin C, citric acid, glucose, hydrazine hydrate and the like; 2) pre-processing the PCB; 3) heating the activation solution to 25-100 DEG C, and then immersing the pre-processed PCB in the activation solution to be held for 10-180s; and 4) performing electroless nickel plating on the activated PCB in an electroless nickel plating solution. According to the method disclosed by the invention, noble metal palladium is not used during activation, so that the activation solution is high in stability, and the diffusion plating phenomenon does not occur; the production cost of the PCB is effectively reduced.

Manufacture of polishing fluid for electroless nickel plating film

Abstract: PURPOSE:To manufacture a polishing fluid which is excellent in the dispersion stability of alumina, has a good polishing effect even after long-term, and is suitable for polishing an electroless nickel plating film, especially an Ni-P film, on, e.g. a hard disc. CONSTITUTION:A polishing fluid for an electroless nickel plating film, is manufactured by dispersing alumina in water and adjusting the pH to 2.8 or lower with sulfuric acid to give an alumina dispersion, adding colloidal silica to the dispersion, and then adding nickel carbonate thereto to adjust the pH to 5 to 7.

Formation of electrode for semiconductor device

Abstract: PROBLEM TO BE SOLVED: To form the electrode of a semiconductor device having uniform and high quality by an electroless nickel plating method by cleaning exposed semiconductor surfaces, then adding a thickener into dilute hydrofluoric acid and aq. palladium chloride soln. and subjecting these surfaces to a catlyzation treatment. SOLUTION: For example, gum arabic is added as the thickener. The gum arabic acts as a palladium ion transfer suppressor. The palladium which is a catalyst is adhered by reaction rate determination and is uniformly formed regardless to pellet centers and the positions near glass boundaries. Nickel is similarly and extremely uniformly formed and consequently the nickel films having good quality and uniform film thicknesses may be obtd. More specifically, the semiconductor wafers 100 subjected to the cleaning of the exposed semiconductor surfaces are set on a wafer holder 60 and are immersed into the catalyst liquid 70 mixed with 0.1% gum arabic for 10 to 120 seconds at room tap. by oscillating the same. Quenching is thereafter executed in pure water within several seconds, by which electroless nickel plating is executed.

Low stress electroless nickel plating

Abstract: PROBLEM TO BE SOLVED: To solve the problem wherein it is impossible to convey a wafer by an air suction system and it is difficult to work the wafer in a succeeding process because of that when nickel plating is applied to a wafer, a nickel film shrinks, thus shrinkage stress is applied to an electrode part in a base material tightly stuck thereto to cause the warpage of the wafer SOLUTION: Molybdenum is added to an electroless nickel bath, and molybdenum is precipitated into a deposited nickel film, thus the generation of internal stress in the film is suppressed, and the warpage of a wafer can be stopped The stress is large after heat treatment compared with that in plating, but, by incorporating molybdenum into the nickel film, it is effective also on heat treatment COPYRIGHT: (C)2005,JPO&NCIPI