Electroless nickel plating

About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.

Effect of Na4P2O7·10H2O as complexing agent on deposition behavior and property of electroless Ni-P coating on ZK61M magnesium alloy

Abstract: The electroless Ni-P coating was prepared on ZK61M magnesium alloy by using Na4P2O710H2O as main complexing agent and NiSO46H2O as main salt in the electroless nickel plating solution. The effects of Na4P2O710H2O on deposition rate, growth progress and corrosion resistance of the Ni-P coating were investigated systematically in this study. The properties of the plating were characterized by the measurements including, scanning electronic microscope (SEM), energy dispersive spectrometer (EDS), x-ray diffraction (XRD), electrochemical polarization and immersion tests in 5% NaCl solution. The results showed that the initial uniform deposition of the plating on the HF-activated substrate was achieved by using Na4P2O710H2O as the main complexing agent. The deposition rate showed an obvious upward trend with the increment on the concentration of Na4P2O710H2O. It was worth noting that the content of phosphorus reached more than 7 wt% in Ni-P coating while the concentration of Na4P2O710H2O was higher than 40 g L−1. Most importantly, the plating with an obvious microcrystal structure had excellent corrosion resistance. Moreover, no corrosion on the surface was observed while the sample was immersed into 5% NaCl solution for 12 h. The self-corrosion potential of the Ni-P coating exceeded −0.5 V. The self-corrosion current could be reduced about 2 orders of magnitude comparing to magnesium alloy substrate.

Manufacture of insulating substrate with thin nickel layer

Abstract: PURPOSE:To manufacture an insulating plate with a metal layer without pinhole even if it is thin by forming a thin nickel layer on the uneven face of a metal foil support having the uneven face, laminating the thin layer with an insulating organic material to be integrated, and then selectively removing the support by etching. CONSTITUTION:A nickel layer formed by electroless nickel plating or the like on a metal foil support, such as a copper foil or the like having an uneven face is formed in a uniform thickness along the rough shape of the copper foil surface. Thus, after the copper foil formed with the nickel layer and resin are laminated, a thin nickel layer is transferred simultaneously with the uneven shape of the support to a substrate surface on which only the copper is removed by etching. The electroless plating provides less irregularity in the thickness of plating film according to the place, and scarcely generates a pinhole. Accordingly, the laminated plate with extrathin metal foil smaller than 5mum in thickness can be manufactured.

Polytetrafluoroethylene composite electroless nickel plating solution

Abstract: PURPOSE:To prolong a bath life and to enhance the appearance of a plating film to be formed. CONSTITUTION:After metal-aromatic hydrocarbon complex consisting of alkaline metal and/or alkaline earth metal and at least one aromatic hydrocabon of naphthalene, anthracene and phenanthrene is reacted with polytetrafluoroethylene, the reactant is reacted with an aromatic carboxyl acid compound having a halogen group and then the reactant is reacted with dicarboxylic acid imide to obtain surface-reformed polytetrafluoroethylene, which is dispersed in electroless nickel plating solution to prepare polytetrafluoroethylene composite electroless nickel plating solution.

Fabrication of Nickel Coating on Polyethylene Terephthalate Substrate Modified with Primer: Effect of Surface Roughness on Structural Properties of Plated Coating

Abstract: Fabrication of nickel coating on polyethylene terephthalate substrate via primer modification combined with PdCl2 activation and electroless nickel plating is researched. The effect of surface roughness on structural properties of the plated coating was investigated. The modified substrate could adsorb Sn2+ and Pd2+, which can catalyze the electroless nickel plating. Increasing the SiO2 content in the primer could enhance surface roughness of primer coating, adsorbed capacity of Sn2+ and Pd2+, crystallinity and adhesive force of nickel-plated coating. The nickel-plated film was compact, as SiO2 particles were uniformly dispersed and well bonded with nickel coating. When the average roughness was about 18 μm, the plated coating presented thickness of 2 μm, a low resistivity of 6.6 × 10−5 Ω cm and good adhesive strength of 5B. In addition, selective and flexible nickel patterns could be obtained successfully after laser etching.