Topic
Electroless nickel plating
About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.
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TL;DR: In this article, an innovative and environmentally friendly procedure for electroless nickel plating on AZ91D magnesium alloy was studied and the composition of the alkaline and acidic fluoride-free baths and their plating process were investigated and discussed in detail.
33 citations
TL;DR: In this article, the co-deposition behavior and mechanism of nanodiamond with electrolessly plated nickel films was investigated, and the results indicated that the adsorbed Ni-complex precipitates the incorporation of nanoparticles into the nickel matrix.
33 citations
Patent•
05 Mar 1984TL;DR: In this paper, an improved aqueous electroless nickel plating bath and process for chemically depositing nickel on a substrate were described. But they did not consider the effect of supplemental organic and/or inorganic rate stabilizers.
Abstract: An improved aqueous electroless nickel plating bath and process for chemically depositing nickel on a substrate comprising an aqueous solution containing nickel ions, hypophosphite ions, a complexing agent, preferably a buffering agent and a wetting agent, and a small but effective amount of a sulfonium betaine compound sufficient to control the rate of nickel deposition and the concentration of phosphorus in the nickel deposit, preferably, in further combination with supplemental organic and/or inorganic rate stabilizers. The invention further contemplates a process for rejuvenating an electroless nickel bath which has been rendered inoperative due to the presence of excessive concentrations of supplemental stabilizing agents by the addition of a controlled effective amount of a sulfonium betaine compound sufficient to restore the bath to an operative plating condition.
33 citations
TL;DR: In this article, nano ZnO particles were synthesized by using an electrochemical technique and incorporated the particles into Ni-P plates, which resulted in improvement of metallurgical and corrosion resistance characteristics of the plates.
32 citations
Patent•
24 Feb 1986
TL;DR: An electroless nickel plating method and composition is disclosed wherein a soluble acetylenic compound is included within the plating bath in small amounts effective to improve the specularity of the nickel deposit without substantially decreasing the electroless plating rate of the bath as discussed by the authors.
Abstract: An electroless nickel plating method and composition is disclosed wherein a soluble acetylenic compound is included within the plating bath in small amounts effective to improve the specularity of the nickel deposit without substantially decreasing the electroless plating rate of the bath. The method and compositions of the invention are useful in producing mirror-bright electroless nickel coatings free of haze.
32 citations