Electroless nickel plating

About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.

High speed additive circuit process

Abstract: A HIGH SPEED ADDITIVE CIRCUIT PROCESS FOR MANUFACTURE OF CIRCUIT LINES UPON A POLYESTER OR POLYIMIDE SUBSTRATE, INCLUDING THROUGH-HOLES THEREIN, COMPRISING THE STEPS OF CLEANING, SENSITIZING, ACTIVATING, PRINTING A NEGATIVE FACSIMILE, OF THE FINAL DESIRED PATTERN OVER THE ACTIVATED SURFACE, HEAT SETTING, ELECTROLESS NICKEL PLATING, CURING, AND FINAL CONDUCTIVE COATING BY FLOW SOLDERING. ONLY ONE STEP MAY EXCEED ONE MINUTE IN TIME. TEMPERATURES AND TIME AT TEMPERATURE DETAILS ARE INCLUDED. CONDUCTIVE LINES AS FINE AS 2 MILS WIDE ON 4 MIL CENTERS MAY BE MADE BY THIS PROCESS.

Solvent extraction of nickel ions from electroless nickel plating wastewater using synergistic green binary mixture of D2EHPA-octanol system

Abstract: A study on the synergistic green solvent extraction of nickel ions from real electroless nickel plating wastewater using an organic phase containing a binary mixtures of Di (2-ethylhexyl) phosphoric acid (D2EHPA) and octanol in palm oil was conducted. The effects of diluent composition, synergist, carrier and stripping agent types and its concentrations were experimentally investigated and the optimum conditions were determined. Results revealed that both D2EHPA and octanol acted as a carrier and synergist, respectively. A significant synergistic effect occurred when the octanol helped destroy the dimer structure of D2EHPA for cation exchange mechanism with nickel ions, hence improving the nickel ions extraction up to 90% with the maximum distribution ratio of 8.8 under optimum condition of 0.7M D2EHPA and 15% (v/v) octanol in palm oil. Afterwards, the stripping experiment showed that nickel ions could be recovered from the loaded mixture of carrier using 1.0M nitric acid solutions. Besides, the slope analysis method showed that the nickel ions were extracted from weak acidic electroplating feed solution as nickel-D2EHPA-octanol complex and recovered as nickel nitrate complex in the stripping phase. Thus, it can be concluded that the green synergistic formulation containing binary mixtures of D2EHPA-octanol system is one of the promising approaches as well as a green and efficient separation method for nickel ions extraction from the real electroless nickel plating wastewater.

Preparation and Characterization of Electroless Ni-P and Ni-P-Si3N4 Composite Coatings

Abstract: SUMMARYThe present work pertains to the study of electroless Ni-P and Ni-P-Si3N4 composite coatings. The deposits are obtained from a proprietary high phosphorus electroless nickel plating bath, comprising nickel sulphate, sodium hypophosphite, complexing agents and stabilizers. The maximum weight percent of Si3N4 incorporated in the electroless deposit is obtained at a concentration of 10 g/l in the bath. The electroless Ni-P deposits having 0%, 2.01%, 5.81% and 8.10% of Si3N4, respectively, obtained from baths containing 0, 2, 5 and 10 g/l of Si3N4, are characterized by optical microscopy, XRD and TEM. Hardness is found to increase with the incorporation of Si3N4 at all heat treatment temperatures studied. Also hardness increases with an increase in weight percent of Si3N4 incorporated in the deposit. The analyses of the composite coatings by XRD and TEM reveal that the inclusion of Si3N4 particles does not change the amorphous nature of the Ni-P matrix.

The application of electrochemical methods to the study of the electroless nickel deposition from hypophosphite solutions

Abstract: The rotating disk electrode has been used for the study of the electroless nickel plating from an acid bath strongly buffered by acetate. The variations of the mixed potential with the temperature have been investigated, and explained by means of polarization curves. These latter present an anodic peak which is typical of the electroless nickel deposition. The polarization resistance measurements allow a direct determination of the plating rate. All these experiments, related to mechanical measurements of plating rate, show the important inhibitor effect of the dissolved oxygen on the deposition reaction. The preliminary study of the faradaic impedance of the metal-electrolyte interface shows that the deposit occurs with not less than two heterogeneous steps, involving an adsorbed intermediate species, which could be NiOHads.