Topic
Electroless nickel plating
About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.
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TL;DR: In this paper, Ni-P coatings were deposited through electroless nickel plating in the presence and absence of ultrasound and the simultaneous synthesis of ZnO nanoparticle and its deposition under ultrasound were also carried out on the surface of Ni−P layer prepared by the classical method.
25 citations
TL;DR: In this article, the growth mechanism of Ni layers and the surface morphologies and composition of initial SiC powders were analyzed by field emission scanning electron microscopy (FE-SEM) and energy dispersion spectrometry.
25 citations
TL;DR: In this article, an optical fiber covered with a metal film except for an aperture at the apex of the fiber is used for scanning near field optical microscopy (NFO microscopy).
Abstract: The electroless plating method has played an important role as an indispensable metallization technology for miniaturization of electronic components. This investigation discusses selective metallization on the fine area (nanometer size) by electroless plating. The experimental purpose is to fabricate a probe which is used for scanning near‐field optical microscopy. The probe (cone angle 20°, probe size 4 μm) is comprised of an optical fiber covered with a metal film except for an aperture at the apex of the fiber. Nickel‐plated probes with an aperture of 100 nm were fabricated by optimization of the plating conditions (dissolved oxygen concentration, bath temperature, and bath pH) and the addition of a catalytic poison into the plating bath. © 2000 The Electrochemical Society. All rights reserved.
25 citations
Patent•
23 Sep 1991
TL;DR: In this paper, an inorganic acid solution for catalyzing the initiation of electroless nickel plating on copper substrates was proposed. But this solution is not suitable for use in the electronics industry, such as the production of electroless gold tabs or surface mount pads on printed circuit boards.
Abstract: This invention relates to electroless nickel plating of metals which are normally noncatalytic for electroless nickel initiation. It is especially useful in the electronics industry, including production of electroless nickel/electroless gold tabs or surface mount pads on printed circuit boards, and for use in electroless nickel plating over copper for radiofrequency interference shielding. More particularly, it comprises alkali halide salt solutions of a palladium salt with another Group VIII precious metal salt in an inorganic acid solution for effectively and completely catalyzing the initiation of electroless nickel plating on copper substrates.
25 citations
18 Nov 2009
TL;DR: In this paper, the results of a seed and plate technology, based on electroless nickel plating on industrial substrates, were presented, and the evaluation of the laser ablation + nickel process on high efficiency structures has delivered FF over 80%.
Abstract: This paper presents the results of a seed and plate technology, based on electroless nickel plating on industrial substrates. Through the photoassisted surface activation of the cells homogeneous NiP coatings, about 30-50 nm thick have been deposited. The combination of this step with inkjet masking and etching has been compared with laser ablation and with standard screen printed cells on industrial solar cells. An improvement of 0.5% absolute in efficiency has been achieved thanks to the use of nickel contacts. The advantages and disadvantages of each structuring process are introduced. The evaluation of the laser ablation + nickel process on high efficiency structures has delivered FF over 80%.
25 citations