Topic
Electroless nickel plating
About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.
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TL;DR: The oxidation of hypophosphite and phosphite in an aqueous solution by an ultraviolet (UV)/H2O2 process was studied and it was found that the process presented a wide range of applicable initial pH (5–11), which maximized the reaction rate.
Abstract: The oxidation of hypophosphite and phosphite in an aqueous solution by an ultraviolet (UV)/H2O2 process was studied in this work. The reactions were performed in a lab-scale batch photoreactor. The effect of different parameters such as H2O2 dosage, H2O2 feeding mode and the initial pH of the solution on the oxidation efficiency of the process was investigated. The results indicated that the UV/H2O2 process could effectively oxidize hypophosphite and phosphite in both synthesized and real wastewater. However, neither H2O2 nor UV alone was able to appreciably oxidize the hypophosphite or phosphite. The best way of feeding H2O2 was found to be ‘continuous feeding’, which maximized the reaction rate. It was also found that the process presented a wide range of applicable initial pH (5–11). When treating real rinse-wastewater, which was obtained from the electroless nickel plating industry, both hypophosphite and phosphite were completely oxidized within 60 min, and by extending by another 30 min, over 90% of...
22 citations
TL;DR: In this paper, a one-step process of covalent grafting of vinylpyridine groups on the surface of commercial Plexiglas® (polymethylmethacrylate) employing diazonium-based aqueous chemistry, without requiring any surface pretreatment step.
22 citations
TL;DR: In this article, a useful coating technology for electroless Ni-1.5wt%P has been developed, which can work normally for more than 5 turnovers with a plating rate of 20 μm/h.
Abstract: SUMMARYA useful coating technology for electroless Ni-1.5wt%P has been developed. The bath can work normally for more than 5 turnovers with a plating rate of 20 μm/h. In the as-deposited condition, Ni-1.5wt%P deposit is a supersaturated solid solution of P dissolved in a nanocrystalline Ni matrix with a grain size of several nanometers. The microstructure transformed into a larger grain size Ni matrix with dispersive Ni3P precipitates with increasing the heat treatment temperature. Ni-1.5wt%P deposit possesses as-deposited hardness and wear resistance superior to Ni-10.5wt%P deposit. The microhardness and wear resistance can be further improved by proper heat treatment. The optimum wear resistance of Ni-1.5wt%P deposit corresponds to its peak hardness (annealing at 375°C for 1 h), whereas for Ni-10.5wt%P deposit the optimum wear resistance is obtained after annealing at 650°C for 1 h. Ni-1.5wt%Ppossesses a corrosion resistance in NaOH solution superior to conventional medium and high phosphorus deposits, ...
22 citations
Patent•
22 Jun 2007
TL;DR: In this article, a flux contains resin having film forming ability, activator, solvent and at least one complex selected from silver complex and copper complex, which is used when soldering is performed onto a circuit having electroless nickel plating.
Abstract: A flux contains resin having film forming ability, activator, solvent and at least one complex selected from silver complex and copper complex. The flux is used when soldering is performed onto a circuit having electroless nickel plating or further having gold plating on the electroless nickel plating. Allowing a barrier layer of silver or copper to deposit on the surfaces of lands suppresses the diffusion of nickel into the melted solder alloy during soldering, and also prevents phosphorous concentration. This improves the bonding strength of soldering and suppresses the reduction deposition of silver and/or copper to portions other than circuit patterns.
22 citations
Patent•
25 Apr 2003
TL;DR: In this article, the authors proposed a method of producing a flexible printed circuit board where, even in the case electroless nickel plating is applied to both the faces of a polyimide resin film, the content of moisture remaining in the polyimides resin film is reduced, and also, the thickness of the electroless Nickel plated layer can be increased.
Abstract: PROBLEM TO BE SOLVED: To provide a method of producing a flexible printed circuit board where, even in the case electroless nickel plating is applied to both the faces of a polyimide resin film, the content of moisture remaining in the polyimide resin film is reduced, and also, the thickness of the electroless nickel plated layer can be increased. SOLUTION: First, a thin first nickel plated layer 2a is formed on both the faces of a polyimide resin film 1 by electroless nickel plating, and is thereafter dried. Next, a second nickel plated layer 2b is formed on the surface of the thin first nickel plated layer 2a by electroless nickel plating or nickel electroplating. Thereafter, a copper plated layer 3 for forming a circuit is formed on the surface of the second nickel plated layer 2b. COPYRIGHT: (C)2005,JPO&NCIPI
22 citations