Topic
Electroless nickel plating
About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.
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TL;DR: In this article, iminodiacetic acid-functionalized poly(glycidyl methacrylate)grafted carbon fibers (CCFs) were prepared by electrochemically mediated atom transfer radical polymerization (eATRP) for nano-nickel recovery from spent electroless nickel (EN) plating baths.
Abstract: In this work, iminodiacetic acid-functionalized poly(glycidyl methacrylate)grafted carbon fibers (CCFs) were prepared by electrochemically mediated atom transfer radical polymerization (eATRP) for nano-nickel recovery from spent electroless nickel (EN) plating baths. The adsorption behaviors of Ni2+ were investigated at CCFs in the spent EN plating baths. The adsorption kinetics perfectly fitted pseudo-second order model with a chemisorption process. The thermodynamic parameters suggested that adsorption was feasible, spontaneous, and endothermic. The adsorption maximum capacity was 0.908 mM g−1 under optimum conditions (pH 5.2, 50 °C and 40 min). The present materials were carefully characterized by the Fourier transform infrared spectroscopy, X-ray diffraction, field emission scanning electron microscope, and electrochemical techniques. Experimental results showed that CCFs were successfully prepared, which were efficient adsorbent and support for nano-nickel recovery from the spent EN plating baths.
20 citations
TL;DR: In this paper, four types of thin film coating were carried out on copper for electronic materials by the electroless plating method at a pH range from 3 to 9, and the coating performance was evaluated by electrochemical impedance spectroscopy and potentiodynamic polarization testing in a 3.5 wt.% NaCl solution.
20 citations
Patent•
14 Feb 1991
TL;DR: In this paper, the surface reformed synthetic resin material is constituted by depositing the complex of noble metal ions on a polymer formed by graft polymn. of the surface of the synthetic resin by a photopolymn. method, or further forming the electroless plating film on this surface.
Abstract: PURPOSE: To form a good electroless plating film by a photopolymn. operation without subjecting the surfaces of various kinds of synthetic resins to an etching pretreatment required in the prior technique. CONSTITUTION: This surface reformed synthetic resin material is constituted by depositing the complex of noble metal ions on a polymer formed by graft polymn. of the surface of the synthetic resin by a photopolymn. method, or further forming the electroless plating film on this surface. An example of the process is to bring a polypropylene resin into contact with an acetone soln. of acrylamide and bezonphenone and to irradiate the resin with a high-pressure mercury vapor lamp for 5 to 120 minutes and then to immerse the resin into an aq. palladium chloride soln. The resin is then immersed into an electroless nickel plating bath and is subjected to washing and drying treatments, by which the dense, uniform and firm plating film is formed. COPYRIGHT: (C)1992,JPO&Japio
20 citations
Patent•
28 May 2009TL;DR: In this article, an electroless nickel plating solution composition, a flexible printed circuit board and a manufacturing method thereof are presented. And more particularly, the authors present a manufacturing process capable of simultaneously satisfying plating characteristics respectively required for a pad unit and external connection units.
Abstract: The present invention relates to an electroless nickel plating solution composition, a flexible printed circuit board and a manufacturing method thereof, and more particularly, to an electroless nickel plating solution composition, a flexible printed circuit board and a manufacturing method thereof capable of simultaneously satisfying plating characteristics respectively required for a pad unit and external connection units of the flexible printed circuit board by forming a nickel plating layer having a vertical growth structure with the electroless nickel plating solution composition including a water-soluble nickel compound, a reducing agent, a complexing agent and a vertical growth inducer.
20 citations
TL;DR: In this article, the performance of the MS/EN/CrN composite coating was evaluated in the simulative working environment of a proton exchange membrane fuel cell (PEMFC) to test the electrical and corrosion properties of uncoated and coated samples.
20 citations