Topic
Electroless nickel plating
About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.
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TL;DR: In this article, a facile electroless plating strategy to obtain nickel coatings on copper substrates was designed to simplify the plating baths and procedure, which contained only nickel sulfate and ammonia.
Abstract: A facile electroless plating strategy to obtain nickel coatings on copper substrates was designed to simplify the plating baths and procedure. The plating baths contained only nickel sulfate and ammonia. The aluminium connected to the copper substrates served as the electron source for nickel deposition. The nickel coatings obtained via this approach were tested and proved to possess excellent anticorrosion behavior.
18 citations
TL;DR: In this paper, the authors report a facile, effective and feasible strategy to synthesis of Ni5P4 nanosheets/nanoparticles structure on carbon cloth, which was fabricated by electroless nickel plating and then straightforward thermal phosphidation treatment with NaH2PO2 as phosphorus source.
18 citations
Patent•
28 Jul 1986TL;DR: In this article, a method of applying nickel directly to a non-activated tungsten surface was disclosed, in which the tundsten surface is immersed in an aqueous electroless nickel plating bath containing a water-soluble nickel salt; ethylenediaminetetraacetic acid; hydrazine; and monoethanolamine.
Abstract: A method of applying nickel directly to a non-activated tungsten surface is disclosed, in which the tungsten surface is immersed in an aqueous electroless nickel plating bath containing a water-soluble nickel salt; ethylenediaminetetraacetic acid; hydrazine; and monoethanolamine for a period of time sufficient to deposit a layer of nickel on the tungsten surface.
18 citations
Patent•
21 Sep 2004
TL;DR: A pad structure of a wiring board is defined in this article, which is composed of a multi-plated layer comprising a metal layer (10) formed as a part of the conductive pattern and constituting the main body of the bump, a phosphorus-containing nickel layer (12) formed by electroless nickel plating and directly contacting with said metal layer, a copper layer (14) being formed on said nickel layer, having a thickness less than that of the nickel layer and a noble metal layer of the noble metal.
Abstract: A pad structure (40) of a wiring board being provided on a conductive pattern of the board and having a solder bump (20) mounted thereon, which is composed of a multi-plated layer comprising a metal layer (10) being formed as a part of the conductive pattern and constituting the main body of the bump, a phosphorus-containing nickel layer (12) being formed by electroless nickel plating and directly contacting with said metal layer, a copper layer (14) being formed on said nickel layer by electroless copper plating and having a thickness less than that of the nickel layer and a noble metal layer (16) being formed on said copper layer by electroless plating of the noble metal. The above pad structure of a wiring board allows, in a pad having a phosphorus-containing nickel layer, the improvement of the tensile strength of a solder member mounted thereon, such as a solder ball, or an external member soldered.
18 citations
TL;DR: Multi-doped LiFePO 4 /C is prepared by using spent electroless nickel plating solution as a raw material in this article, which provides source materials of phosphorus, carbon, nickel and other dopants for preparing multidoped LIFePO4 /C.
18 citations