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Electroless nickel plating

About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.


Papers
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Journal ArticleDOI
TL;DR: In this paper, a commercially available process of electroless nickel plating with co-deposited diamond powders was applied to a steel substrate as an intermediate layer prior to diamond deposition by MPECVD.

14 citations

Proceedings ArticleDOI
08 Dec 1998
TL;DR: In this article, the effects of the period and the number of times of the zincation process on the mechanical strength of the electroless nickel deposits are investigated, through studies of surface morphology and transformation during pretreatment.
Abstract: One of the methods used for flip chip mounting is by solder bumping that utilizes Ni/Au under-bump metallurgy. Electroless nickel plating has been preferred over conventional electroplating due to its simplicity, good control, and reproducibility. Experiments are carried out to determine the optimum aluminum surface conditions for nickel adhesion, through studies of surface morphology and transformation during pretreatment. Zincation baths are used to condition the aluminum surfaces for nickel plating. The effects of the period and the number of times of the zincation process on the mechanical strength of the electroless nickel deposits are investigated. From SEM and AFM characterization, transitions of zinc grain size and surface roughness are observed. Grains are large with distinct grain boundaries for immersion time of 5 s, but decrease in size and lose their characteristic shapes as the zincation time increases. A double zincation produces a more compact deposit with smaller size grains compared to single zincation. Length of immersion time during the second zincation also affects the physical properties such as shear strength after 1 hr of electroless nickel plating on the 80 /spl mu/m/spl times/80 /spl mu/m Al bond-pads of a commercial bare microchip. The elemental composition transitions of the zinc deposits formed by different zincation times and bath compositions are also investigated using SEM-EDX and XPS.

13 citations

Journal ArticleDOI
TL;DR: In this paper, the effects of electroless Ni plating on the interaction between molten aluminium and carbon fibers were investigated to investigate the fabrication of woven carbon fiber-reinforced Al-matrix composites by liquid processing.

13 citations

Journal ArticleDOI
TL;DR: In this article, the plating bath pH effect on the light absorption properties of the black surface after blackening process and at the same time maintain the characteristic of protective coating to protect the substrate from corrosion.

13 citations

Patent
06 Jul 1971
TL;DR: In this paper, an ELECTROLESS NICKEL PLATING SOLUTION ESPECIALLY formulated for nicksel plating ALUMINUM ALLOYS is presented.
Abstract: THE SUBJECT MATTER OF THIS INVENTION IS AN ELECTROLESS NICKEL PLATING SOLUTION ESPECIALLY FORMULATED FOR NICKEL PLATING ALUMINUM ALLOYS, ALUMINUM IS A DIFFICULT METAL TO PLATE FROM AN ELECTROLESS BATH BECAUSE ALUMINUM IS ACTIVE AND DEPOSITION OVER ALUMINUM TAKES PLACE AT A RAPID RATE. AS A RESULT, THERE IS EXCESSIVE GASSING AT THE ALUMINUM INTERFACE RESULTING IN MIGRATION OF SMUT PARTICLES FROM THE ALUMINUM SURFACES INTO THE PLATING BATH. THESE PARTICLES ACT AS NUCLEI FOR DEPOSITION OF NICKEL RESULTING IN SPONTANEOUS DECOMPOSITION (TRIGGERING) OF THE BATH AND LOSSS THEREOF, AS WELL AS PLATE-OUT ON WALLS OF THE PLATING TANK, RACKS AND THE LIKE. THE INVENTION OVERCOMES THESE DIFFICULTIES BY ADDITION OF AN UNSATURATED CARBOXYLIC ACID TO THE SOLUTION ALONE OR PREFERABLY IN COMBINATION WITH A SECOND STABILIZER. THE ACID ACTS TO SUPPRESS THE RATE OF DEPOSITION OVER ALUMINUM DECREASING GAS EVOLUTION AND MIGRATION OF SMUT INTO THE SOLUTION. AS A RESULT, TRIGGERING OF THE SOLUTION IS RETARDED.

13 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
20233
202223
202124
202033
201957
201832