scispace - formally typeset
Search or ask a question
Topic

Electroless nickel plating

About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.


Papers
More filters
Patent
11 May 1994
TL;DR: An electroless nickel/hypophosphite plating bath is provided employing acetic acid/acetate as a buffer and which is, as a result, capable of perpetual regeneration while avoiding the production of hazardous waste as discussed by the authors.
Abstract: An electroless nickel(EN)/hypophosphite plating bath is provided employing acetic acid/acetate as a buffer and which is, as a result, capable of perpetual regeneration while avoiding the production of hazardous waste. A regeneration process is provided to process the spent EN plating bath solution. A concentrated starter and replenishment solution is provided for ease of operation of the plating bath. The regeneration process employs a chelating ion exchange system to remove nickel cations from spent EN plating solution. Phosphites are then removed from the solution by precipitation. The nickel cations are removed from the ion exchange system by elution with hypophosphorous acid and the nickel concentration of the eluate adjusted by addition of nickel salt. The treated solution and adjusted eluate are combined, stabilizer added, and the volume of resulting solution reduced by evaporation to form the bath starter and replenishing solution.

12 citations

Proceedings ArticleDOI
09 Apr 2008
TL;DR: It is demonstrated that the integration of inkjetting with plating is an effective method to form high aspect patterns at the demand location.
Abstract: This paper reports on formation of high aspect micro patterns on low temperature co-fired ceramic (LTCC) substrates by integrating micro inkjetting with electroless plating. Micro inkjetting was realized by using an inkjetting printer that ejects ink droplets from a printhead. This printhead consists of a glass nozzle with a diameter of 50 mum and a piezoelectric transducer that is coated on the nozzle. The silver colloidal solution was inkjetted on a sintered CT800 ceramic substrate, followed by curing at 200degC for 60 minutes. As a result, the silver trace with a thickness of 200 nm was obtained. The substrate, with the ejected silver thin film as the seed layer, was then immersed into a preinitiator solution to coat a layer of palladium for enhancing the deposition of nickel. Electroless nickel plating was successfully conducted at a rate of 0.39 mum /min, and the thickness of traces was plated up to 84 mum. This study demonstrates that the integration of inkjetting with plating is an effective method to form high aspect patterns at the demand location.

12 citations

Patent
20 Jul 2011
TL;DR: In this paper, a method for treating a metal surface to reduce corrosion thereon and/or to increase the reflectance of the treated surface is proposed, which is useful for increasing the solderability of the metal surface in electronic packaging applications.
Abstract: A method for treating a metal surface to reduce corrosion thereon and/or to increase the reflectance of the treated surface, the method comprising a) plating a metal surface with an electroless nickel plating solution; and thereafter b) immersion plating silver on the electroless nickel plated surface, whereby corrosion of the metal surface is substantially prevented and/or the reflectance of the silver plated surface is substantially improved. The treating method is useful for increasing the solderability of the metal surface, for example, in electronic packaging applications.

12 citations

Patent
13 Jan 1992
TL;DR: In this article, a process for removing, from spent electroless metal plating bath solutions, accumulated byproducts and counter-ions that have deleterious effects on plating is described.
Abstract: A process for removing, from spent electroless metal plating bath solutions, accumulated byproducts and counter-ions that have deleterious effects on plating. The solution, or a portion thereof, is passed through a selected cation exchange resin bed in hydrogen form, the resin selected from strong acid cation exchangers and combinations of intermediate acid cation exchanges with strong acid cation exchanges. Sodium and nickel ions are sorbed in the selected cation exchanger, with little removal of other constituents. The remaining solution is subjected to sulfate removal through precipitation of calcium sulfate hemihydrate using, sequentially, CaO and then CaCO3. Phosphite removal from the solution is accomplished by the addition of MgO to form magnesium phosphite trihydrate. The washed precipitates of these steps can be safely discarded in nontoxic land fills, or used in various chemical industries. Finally, any remaining solution can be concentrated, adjusted for pH, and be ready for reuse. The plating metal can be removed from the exchanger with sulfuric acid or with the filtrate from the magnesium phosphite precipitation forming a sulfate of the plating metal for reuse. The process is illustrated as applied to processing electroless nickel plating baths.

12 citations

Journal ArticleDOI
TL;DR: Ozonated water treatment was studied as a replacement for conventional chromic acid etching of plating on ASA Resin in this paper, which achieved favorable adhesion without roughening the plastic's surface.
Abstract: In view of environmental concerns, ozonated water treatment was studied as a replacement for conventional chromic acid etching of plating on ASA Resin. Ozonated water treatment achieves favorable adhesion without roughening the plastic's surface. Chemical analysis and cross-sectional observations show the formation of polar groups on the surface of the treated resin. Catalytic palladium particles are dispersed and adsorbed into the treated resin surface layer after the catalyzing step. Nickel ions penetrate and scatter into the treated resin layer during electroless nickel plating. These observations prove that favorable adhesion can be attributed to the formation of a nanoscale reformed layer, which is completely different from the conventional anchor effect produced using chromic acid etching.

12 citations


Network Information
Related Topics (5)
Corrosion
152.8K papers, 1.9M citations
77% related
Coating
379.8K papers, 3.1M citations
76% related
Alloy
171.8K papers, 1.7M citations
74% related
Anode
139.4K papers, 2.1M citations
71% related
X-ray photoelectron spectroscopy
63.3K papers, 1.6M citations
71% related
Performance
Metrics
No. of papers in the topic in previous years
YearPapers
20233
202223
202124
202033
201957
201832