Topic
Electroless nickel plating
About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.
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TL;DR: In this paper, a hypophosphite-based conventional electroless nickel plating solution at ambient temperature under laser irradiation was used for selective deposition of NiP alloy thin film on p-type silicon.
12 citations
Patent•
17 Jul 2014
TL;DR: In this article, an electroless nickel plating solution and a method of using the same is described and the use of the sulfonated compound brightener results in a bright electroless Nickel deposit on various substrates having a high gloss value.
Abstract: An electroless nickel plating solution and a method of using the same is described. The electroless nickel plating solution comprises (i) a source of nickel ions; (ii) a reducing agent; (iii) one or more complexing agents; (iv) one or more bath stabilizers; (v) a brightener, said brightener comprising a sulfonated compound having sulfonic acid or sulfonate groups; and (vi) optionally, one or more additional additives. The use of the sulfonated compound brightener results in a bright electroless nickel deposit on various substrates having a high gloss value.
12 citations
Patent•
08 Dec 2000
TL;DR: In this paper, an electroless nickel plating liquid which suppresses the production of deposits to be a cause for changing the properties of the plating fluid after being prepared, during storage or during plating operation, maintains excellent liquid stability for a long time and has excellent corrosion resistance and wettability of solder of Nickel plating films.
Abstract: PROBLEM TO BE SOLVED: To provide an electroless nickel plating liquid which suppresses the production of deposits to be a cause for changing the properties of the plating liquid after being prepared, during storage or during plating operation, maintains excellent liquid stability for a long time and has excellent corrosion resistance and wettability of solder of nickel plating films. SOLUTION: This electroless nickel plating liquid contains metal elements having >=2 kinds of valence at a pH 3 to 8.
12 citations
TL;DR: In this article, the effect of different Ni interlayers prepared by electronickelling (EN), electroless nickel plating (ENP) and plasma sprayed nickel (PSN) methods on the interfacial microstructure and bonding properties of the Al/Mg bimetal was systematically investigated.
12 citations
Patent•
30 Aug 1993
TL;DR: In this paper, a method for forming a gold conductor pattern by electroless plating which has excellent bondability of a gold wire and a low manufacturing cost was proposed. But the method was not suitable for the case of printed wiring boards.
Abstract: PURPOSE: To provide a bonding pad for a printed wiring board and a method for forming a gold conductor pattern by electroless plating which has excellent bondability of a gold wire and a low manufacturing cost. CONSTITUTION: An area unnecessary for gold plating of a conductor pattern 4 formed on a surface of a board 2 is coated with a solder resist 6. An amorphous first electroless nickel film 7 is formed on the pattern 4 not coated with the resist 6 by electroless nickel plating. Then, a crystalline second electroless nickel film 8 containing 3-8% of phosphorus content is formed on a surface of the film 7 by electroless nickel plating. Thereafter, an electroless gold plating film 9 is formed on a surface of the film 8 by electroless gold plating in which substitution reaction is the main reaction. COPYRIGHT: (C)1995,JPO
12 citations