Topic
Electroless nickel plating
About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.
Papers published on a yearly basis
Papers
More filters
15 Dec 2007-Materials Science and Engineering A-structural Materials Properties Microstructure and Processing
TL;DR: In this article, the effect of plating time, size of powder and weight of powder on the deposition of Ni-P on graphite particles was studied and it was found that by a simple and controlled plating method a uniform and continuous layer of nickel could be deposited on the surface of graphite particle.
Abstract: Electroless deposition technique was used to coat Ni–P on graphite particles with high deposition rate and bath stability by activating the graphite powder in a furnace at 380 °C for 1 h. The effect of plating time, size of the powder and weight of the powder were studied. It was found that by a simple and controlled plating method a uniform and continuous layer of nickel could be deposited on the surface of graphite particles. Scanning electron microscopy images and EDS spectra before and after electroless nickel plating confirm that nickel is deposited on the surface of graphite particles. The rate of increase in weight percent nickel over graphite decreases with time and reaches a plateau. Further increase in weight is attained by plating the same powders in a fresh bath to obtain desired Ni–P alloy mass.
70 citations
TL;DR: In this article, the electroless nickel plating technique was used for making ohmic or rectifying contacts on porous silicon, and the results showed that the plated metal penetrates the pores and forms contact on an effective area, about 4.5 times the actual area of the sample.
Abstract: We have presented the electroless nickel plating technique as a preferred method for making ohmic or rectifying contacts on porous silicon. Nickel, plated by this technique, penetrates the pores and forms contact on an effective area, about 4.5 times the actual area of the sample. High‐temperature annealing of the plated metal produced excellent ohmic contacts with porous silicon formed on n‐type silicon. The properties of this contact are shown to be much superior to that of conventional evaporated and alloyed ohmic contacts made on p‐type porous silicon of identical characteristics. Contacts made under similar conditions by electroless nickel plating on p‐type porous silicon, on the other hand, showed good rectifying diode characteristics. The observed electrical properties of electroless nickel contacts are believed to be due to the presence of minute amounts of phosphorous with the plated metal.
69 citations
TL;DR: In this paper, the porosity of the plating coating was evaluated by the combination of corrodkote and filter paper, and the effects of plating solution on porosity were investigated through scanning electron microscopy (SEM) and electrochemical potentiodynamic polarization.
69 citations
TL;DR: In this article, tetraaminepalladium nanoparticles within polyelectrolyte multilayers of poly(allylamine hydrochloride) (PAH) and poly(acrylic acid) (PAA) were prepared as seeds for further growth by electroless nickel deposition.
Abstract: Palladium nanoparticles within polyelectrolyte multilayers of poly(allylamine hydrochloride) (PAH) and poly(acrylic acid) (PAA) were prepared as seeds for further growth by electroless nickel deposition. The seeds were generated by binding tetraaminepalladium from aqueous solution to PAA carboxylic acid functionalities in the polymer film and subsequent reduction. Nickel was electrolessly deposited on the small, 2-nm-diameter catalytic particles. By manipulation of the rate and duration of the electroless deposition, a nickel shell of arbitrary thickness could be grown; up to 14-nm-diameter particles were obtained. Elemental analyses showed that the composition of the electrolessly deposited material, nickel with several weight percent boron, was similar to that obtained from macroscopic surface electroless nickel plating. The electroless chemistry facilitated control over nanoparticle size independent of the process of nanoparticle nucleation and hence particle concentration.
63 citations
Patent•
13 Oct 1998TL;DR: In this paper, an electroless nickel plating solution of oxidation-reduction reacting type containing sulfur compound as a reaction promoter was used to form a nickel film containing phosphor and gold plated films on all aluminum electrodes of the semiconductor device.
Abstract: Electroless nickel plating and gold plating is performed on an aluminum electrode in order to construct a highly reliable electrode. The steps are: depositing zinc on the aluminum electrode with zincate treatment liquid containing sodium hydroxide and zinc oxide; immersing it in solution which is prepared by dissolving sodium hypophosphite as a reducing agent into de-ionized water, followed by addition of de-ionized water while adjusting for the pH of 9.0 to 12.0 with sodium hydroxide solution, so as to make a total volume of 1000 ml; nickel-plating the aluminum electrode of the semiconductor device by using electroless nickel plating solution of oxidation-reduction reacting type containing sulfur compound as a reaction promoter, under a condition of the pH at 4.0 to 6.8 and a temperature of 80 to 90° C.; electroless gold-plating by substitutional reaction type; and, electroless gold-plating by oxidation-reduction reacting type, so as to form a nickel film containing phosphor and gold plated films on all aluminum electrodes of the semiconductor device. In this way, a nickel plate film of good electrical conductivity and also a gold plate of a thick film on all aluminum electrodes of the semiconductor device are formed, without resulting in corrosion of the passivation film and the aluminum electrodes.
62 citations