Topic
Electroless nickel plating
About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.
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TL;DR: In this paper, a double-nozzle gun was used to spray two different solutions containing the precursors onto the surface of a composite NiBP-graphite film and their corrosion and tribological properties were investigated.
Abstract: Purpose – This paper aims to coat ternary composite NiBP-graphite films by Dynamic Chemical Plating “DCP” technique with a growth rate of at least 5 μm/h, which makes this technique a worthy candidate for production of composite films. Electroless nickel plating method can be used to deposit nickel–phosphorous and nickel–boron coatings on metals or plastic surface. However, restrictions such as toxicity, short lifetime of the plating-bath and limited plating rate have limited applications of conventional electroless processes. Design/methodology/approach – DCP is an alternative for producing metallic deposits on non-conductive materials and can be considered as a modified electroless coating process. Using a double-nozzle gun, two different solutions containing the precursors are sprayed simultaneously and separately onto the surface. With this technique, NiBP-graphite films are fabricated and their corrosion and tribological properties are investigated. Findings – With a film thickness of 2 μm, tribologi...
11 citations
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TL;DR: In this article, direct electroless nickel plating onn-Si(100) wafers in alkaline solutions was demonstrated without any activation procedure in advance, and the effect of pH and temperature of the solutions on size of metal particles in deposits was examined, and also the element contents of deposits were analyzed by energy disperse spectroscopy (EDS).
Abstract: Direct electroless nickel plating onn-Si(100) wafers in alkaline solutions was demonstrated without any activation procedure in advance, the effect of pH and temperature of the solutions on size of metal particles in deposits was examined, and also the element contents of deposits were analyzed by energy disperse spectroscopy (EDS). The results indicated that the size of metal particles increases with increasing temperature or decreasing pH. The possible mechanism of nickel deposition onn-Si(100) was discussed in terms of semiconductor electrochemistry, and the formation of nickel seed crystal on Si was mainly attributed to the generation of atomic hydrogen by electron capture of water molecule from the semiconductor in alkaline solutions.
11 citations
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08 Apr 2010TL;DR: In this paper, a novel technique to selectively deposit nickel by electroless plating on gold seed layers using an oxygen-plasma activation step is presented, which enables the manufacturing of low-resistance vias for heterogeneous three-dimensional (3D) integration of MEMS but it is also a suitable technique for the fabrication of arbitrary shaped nickel-microstructures using chemically stable and cost-effective electroless nickel plating baths.
Abstract: This paper presents a novel technique to selectively deposit nickel by electroless plating on gold seed layers using an oxygen-plasma-activation step. No prior wet surface pre-treatments or metal oxide etches are required. This enables the manufacturing of low-resistance vias for heterogeneous three-dimensional (3D) integration of MEMS but it is also a suitable technique for the fabrication of arbitrary shaped nickel-microstructures using chemically stable and cost-effective electroless nickel plating baths.
10 citations
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14 Apr 1978
TL;DR: In this paper, the authors used alternate operative plating tanks of glass fiber reinforced urethane with polypropylene liners, and a third tank of cleaning fluid applied to the tank not being used.
Abstract: Electroless plating using alternate operative plating tanks of glass fiber reinforced urethane with polypropylene liners, and a third tank of cleaning fluid applied to the tank not being used.
10 citations
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TL;DR: In this article, homogeneous electroless nickel plating to sintered Bi-Te alloy was tested by the heat-shock test and it was shown to function as a barrier of the diffusion of impurities.
Abstract: In this letter homogeneous electroless nickel plating to sintered Bi-Te alloy was tested by the heat-shock test and it was shown to function as a barrier of the diffusion of impurities
10 citations