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Electroless nickel plating

About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.


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Patent
13 Dec 1968
TL;DR: A SILICON SURFACE is prepared for ELECTROLESS NICKEL PLATING by ACTIVATION with an AQUEOUS HYDROFLUORIC ACID Solution CONTAINING from 1 E to 1 HUNDRED P.M. of Ionic gold as mentioned in this paper.
Abstract: A SILICON SURFACE IS PREPARED FOR ELECTROLESS NICKEL PLATING BY ACTIVATION WITH AN AQUEOUS HYDROFLUORIC ACID SOLUTION CONTAINING FROM ONE E TO ONE HUNDRED P.P.M. OF IONIC GOLD. SUBSEQUENT ELECTROLESS DEPOSITION OF NICKEL PROCEEDS MORE UNIFORMLY OVER THE ENTIRE SILICON SURFACE, AND RESULTS IN A MORE STABLE, TIGHTLY ADHERING NICKEL PLATE DUE TO THE IMPROVED ACTIVATION STEP. ADDITIONAL STABILITY AND EVEN MORE RELIABLE ADHESION IS OBTAINED BY A SUBSEQUENT SINTERING OF THE COMPOSITE STRUCTURE ABOVE THE GOLD-SILICON EUTECTIC TEMPERATURE TO ALLOY THE GOLD ACTIVATION FILM WITH THE SILICON. THE SINTERING STEP ISS THEN PREFERABLY FOLLOWED BY A SECOND ELECTROLESS NICKEL PLATING STEP TO BUILD A NICKEL CONTACT AREA OF INCREASED THICKNESS.

10 citations

Journal ArticleDOI
TL;DR: In this paper, a simple experimental apparatus based on a bipolar electrode configuration was set up, in order to tackle erosion-corrosion problems of materials of interest in the oil and gas field.
Abstract: In this research, a simple experimental apparatus based on a bipolar electrode (BPE) configuration was set up, in order to tackle erosion-corrosion problems of materials of interest in the oil and gas field. As a case study, the resistance to erosion and corrosion of carbon steel samples coated by Electroless Nickel Plating and by thermo-sprayed coating with the high velocity oxy fuel (HVOF) process was investigated. The main objective was to demonstrate if this simple, contactless technique could be applied to effectively discriminate the erosion-corrosion behavior of different materials in a vast range of experimental conditions. In fact, by means of polarization curves, visual inspection and morphological analysis by scanning electron microscope (SEM), the effects due to erosion-corrosion by solid particles, by fluid and those due to simple erosion were evaluated.

10 citations

Journal ArticleDOI
TL;DR: In this paper, the Ni(II)-citrate complexes can be removed by using chitosan as a sorbent, which can be used to remove Ni(2)-citrates from spent electroless nickel plating solutions.
Abstract: Spent electroless nickel plating solutions contain Ni(II)-citrate complexes which are hazardous to the environment. These complexes can be removed by using chitosan as a sorbent. Kinetic investigat...

10 citations

Journal ArticleDOI
TL;DR: In this article, a pre-metallization method by using an electroless plating of Ni on ZnS surface was proposed, and a low temperature joining by using a Sn63Pb37 solder was completed.
Abstract: ZnS has been widely used as a material for windows in optical systems. This is because it has a good transmittance in both mid-infrared and far-infrared bands, a stable chemical performance, a moderate linear thermal expansion coefficient and an adequate mechanical strength. ZnS windows need the so-called splice technology implementation to satisfy the integrity of large size applications or special surface structures. Traditional ZnS light windows are mechanically assembled with metal frames. However, the strength of the large-size ZnS formed by mechanical assembly is low. Consequently, an adequate joining technology is needed to overcome the low splice strength and improve the mechanical strength of the assembly. In this paper, we proposed a pre-metallization method by using an electroless plating of Ni on ZnS surface. Subsequently, a low temperature joining by using a Sn63Pb37 solder was completed. By a study of the process and the corresponding mechanism of the electroless nickel plating, a Ni–P layer with a controllable P content and thickness has been formed, and a smooth surface and a good combination with ZnS has been obtained. The microstructure of the Sn63Pb37 and Ni–P/ZnS was analyzed, and the phase composition and element distribution within the joint were determined. The influences of process parameters on the microstructures of the joints have been explored, including the brazing temperature, the time of thermal energy preservation and the thickness of the coating. Finally, the shear strengths of joints under different imposed parameters were optimized leading to the peak soldering temperature of 250 °C and the dwell at the peak of 1 min. The fractures were along Ni–P/ZnS ceramic interface, therefore, a successfully low temperature joining process on ZnS ceramics using Ni–P plating and Sn63Pb37 solder had been performed.

10 citations

Patent
03 Jul 2002
TL;DR: In this article, an improved process for producing a more uniform deposition of the nickel on the surface of a silicon solar cell comprising the steps of immersing the silicon solar cells into an activator solution comprising gold and a fluoride salt, and subsequently, the solar cell was sintered to produce a nickel silicide layer.
Abstract: An improved process for producing a more uniform deposition of the nickel on the surface of a silicon solar cell comprising the steps of immersing the silicon solar cell into an activator solution comprising gold and a fluoride salt, and subsequently immersing the solar cell into an electroless nickel plating solution. The process provides an improved deposition of nickel on the silicon solar cell, and produces a more uniform deposition of nickel as compared to the prior art. Subsequently to the nickel deposition step, the solar cell may be sintered to produce a nickel silicide layer.

10 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
20233
202223
202124
202033
201957
201832