Topic
Electroless nickel plating
About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.
Papers published on a yearly basis
Papers
More filters
Journal Article•
TL;DR: An energy-efficient process for the rejuvenation and recycling of chemicals used in electroless nickel plating has been developed in this article, which eliminates the discharge of hazardous wastes normally associated with electroless plating, and it will improve plating quality and speed while significantly reducing costs.
Abstract: An energy-efficient process* for the rejuvenation and recycling of chemicals used in electroless nickel plating has been developed. The process eliminates the discharge of hazardous wastes normally associated with electroless plating, and it will improve plating quality and speed while significantly reducing costs. Undesirable by-products are removed from the plating process in forms that are environmentally safe so that they can be used as fertilizers or disposed of in sanitary landfills
8 citations
TL;DR: In this article, the effect of halide ions (F−, Cl−, Br, I−) on nickel deposition in acidic electroless nickel plating baths was investigated and the results could not fully be explained using mixedpotential theory.
Abstract: The effect of halide ions (F−, Cl−, Br, I−) on nickel deposition in acidic electroless nickel plating baths is investigated. Halide ions were found to have a significant effect on the nickel deposition and the results could not fully be explained using mixed-potential theory. A correlation between the stability constants of halide ions with palladium (ii) ions and the plating rate is proposed to explain the observations. Various parameters, such as the activation energy, deposit microstructure and phosphorus contents of the plating bath in the presence of various halide ions, were also studied.
8 citations
01 Jun 1999
TL;DR: In this article, the authors used a scanning electron microscope (SEM) to investigate the interdiffusion behavior of the solder bump constituents within the solder bumps. But they did not find any penetration of Cu during reflow when the thickness of the electroless nickel plating is only 1.8 µm.
Abstract: 63Sn-37Pb solder bump was produced on Al terminal of Si. The bump pad dimension is 100 /spl mu/m/spl times/100 /spl mu/m while the pitch size is 250 /spl mu/m. The bump pattern contains 20/spl times/20 bumps. The UBM (under bump metallurgy) consists of Cu/electroless Ni. Cu was sputter deposited on Al film. The solder bump was electroplated on the electroless nickel followed by reflow at 210/spl deg/C or 250/spl deg/C. The reflow was conducted for 1, 5, and 10 cycles. Intermetallic compounds Ni/sub 3/Sn/sub 2/, Ni/sub 3/Sn/sub 4/, and Ni/sub 4/Sn were formed between electroless nickel plating and solder when reflowed at 250/spl deg/C. The interdiffusion behavior of the solder bump constituents within the solder bump was investigated by scanning electronmicroscope (SEM). Cu was found to penetrate the electroless nickel during reflow when the thickness of the electroless nickel plating is only 1.8 /spl mu/m. No penetration of Cu occurs through a 10 /spl mu/m electroless nickel during reflow. Sn and Al were not found to diffuse through the electroless nickel during reflow even for 1.8 /spl mu/m of electroless nickel plating. The shearing strength of the solder bump reflowed at 210/spl deg/C is 53.5/spl plusmn/3.3 g/bump while the shearing strength is 62.9/spl plusmn/2.8 g/bump when reflowed at 250/spl deg/C. The fracture after shearing test occurs within the solder. Repeating reflow tends to lower the shearing strength of the bump. The shearing strength of the bump becomes 37.6/spl plusmn/6.0 g/bump after ten cycles of reflow.
8 citations
Patent•
08 Jul 2015
TL;DR: In this paper, a manufacturing method of highly purified nickel sulfate can extract 99% or more purity nickel from nickel and cobalt mixed hydroxide under a continuous process including recycling, minimizing use of an organic solvent and discharge of waste water, and also recovering a cobalt component.
Abstract: The present invention relates to a manufacturing method of nickel sulfate used for a cathode material of the secondary battery, industrial nickel plating, electroless nickel plating, etc More particularly, the manufacturing method of highly purified nickel sulfate can extract 99% or more purity nickel from nickel and cobalt mixed hydroxide under a continuous process including recycling, minimize use of an organic solvent and discharge of waste water, and also can recover a cobalt component By using the present invention, nickel hydroxide and cobalt hydroxide through one-step leaching process consisting of an atmospheric pressure heating reaction tank are effectively ionized, thereby minimizing autoclaving equipment and operational time for manufacturing nickel sulfate and cobalt sulfate In addition, process costs can be remarkably reduced since selectivity of a reactor and a pipe material is wider Furthermore, the leaching process is simplified as one-step of the atmospheric pressure heating reaction tank, thus erosion, corrosion, damage, etc are relatively suppressed compared to the conventional two-step leaching process consisting of an atmospheric pressure heating reaction tank and an autoclaving reaction tank, additionally, energy costs consumed for manufacturing and operational time for processing are reduced, thus an effect of increasing the manufacturing efficiency of the nickel sulfate and cobalt sulfate is expected
8 citations
TL;DR: In this article, three different high performance composite polymers, with PTFE filling, are investigated experimentally regarding their applicability in dry rolling/sliding contacts against steel counterparts.
8 citations