Topic
Electroless nickel plating
About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.
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TL;DR: In this article, pH values of the layer of solution adjacent to the Ni-P coating being deposited from solutions containing acetate, glycine, fluoride and other additions have been measured using a glass electrode located in the reaction zone.
Abstract: pH values of the layer of solution adjacent to the Ni-P coating being deposited from solutions containing acetate, glycine, fluoride and other additions have been measured using a glass electrode located in the reaction zone. It was found that the pH value at the surface may decrease by three units. It can be seen from data on the pH value at the surface that revision of some kinetic relationships established earlier is required. It is shown that acetate at low concentration levels has only a buffer effect and that ethylenediamine has an additional accelerating effect while glycine, citrate, malonate, lactate and succinate retard the nickel deposition process.
8 citations
Patent•
27 Mar 2008
TL;DR: In this paper, an element concentration analysis method of electroless nickel plating capable of performing accurate concentration analysis of a prescribed element such as lead or cadmium included in the plating by using a conventional device has been presented.
Abstract: PROBLEM TO BE SOLVED: To provide an element concentration analysis method of electroless nickel plating capable of performing accurate concentration analysis of a prescribed element such as lead or cadmium included in the electroless nickel plating by using a conventional device, which has been difficult hitherto. SOLUTION: The electroless nickel plating 2 is applied to a plate material 1, and part of the electroless nickel plating 2 is exfoliated by generating a crack thereon, and a sample for element concentration analysis is collected from the exfoliated part. The collected sample is dissolved into an acid solvent to generate sample solution 4, and the sample solution 4 is introduced into an inductively coupled plasma emission spectrometer 10 or an inductively coupled plasma mass spectrometer, to thereby perform concentration analysis of the sample in the sample solution 4, namely, a prescribed element such as lead or cadmium included in the electroless nickel plating 2. COPYRIGHT: (C)2008,JPO&INPIT
8 citations
Patent•
05 Nov 1997
TL;DR: In this paper, a substrate for mounting the semiconductors is constituted by forming an electroless nickel plating film on circuits consisting of metals, forming a electroless palladium plating on the electroless nithophosphorus alloy plating, and forming an electrical gold plating (EPGP) on the EPHP plating.
Abstract: PROBLEM TO BE SOLVED: To provide a substrate for mounting semiconductors having excellent joining strength of solder ball terminals and solder balls and a process for producing the same. SOLUTION: This substrate for mounting the semiconductors is constituted by forming an electroless nickel plating film on circuits consisting of metals, forming an electroless palladium plating film on the electroless nickel plating film and forming an electroless gold plating film on the electroless palladium plating film. The electroless nickel plating film is a nickel-phosphorus alloy plating film and a nickel-boron alloy film formed thereon. This process for producing the substrate for mounting the semiconductors consists in successively forming the electroless nickel-phosphorus alloy plating film, the electroless nickel-boron alloy plating film, the electroless palladium plating film and the electroless gold plating film on the circuits consisting of the metals. COPYRIGHT: (C)1999,JPO
8 citations
TL;DR: In this paper, the Ni plated Ti powder was characterised by scanning electron microscopy, energy dispersive spectrometer analysis and X-ray fluorescence, and it was found that a pure/uniform Ni layer may be deposited on the Ti powder particles.
Abstract: In this study, Ti powder (average size: 45 μm) was plated/coated by electroless Ni with hydrazine hydrate as reductant. The Ni plating was carried out at 85°C and pH 9–10. The influence of process parameters such as plating period as well as reductant concentration was investigated. The Ni plated Ti powder was characterised by scanning electron microscopy, energy dispersive spectrometer analysis and X-ray fluorescence. It is found that a pure/uniform Ni layer may be deposited on the Ti powder particles. The deposited mass increases as plating period/reductant concentration increases.
8 citations