Topic
Electroless nickel plating
About: Electroless nickel plating is a research topic. Over the lifetime, 1593 publications have been published within this topic receiving 14940 citations.
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TL;DR: In this article, a non-enzymatic glucose sensor is constructed by using nickel hydroxide (Ni(OH)2) modified silicon microchannel plates (MCP) as the sensing materials.
8 citations
TL;DR: In this article, the catalytic activity of palladium particles prepared upon thermal decomposition of Langmuir−Blodgett films of tris(4,4‘-diisopropyldibenzylideneacetone)palladium(0) (1) on polymeric supports was investigated.
Abstract: The catalytic activity of palladium particles prepared upon thermal decomposition of Langmuir−Blodgett films of tris(4,4‘-diisopropyldibenzylideneacetone)palladium(0) (1) on polymeric supports was investigated. As the catalytic process, the palladium-catalyzed electroless nickel plating was studied. Influences on the nickel plating due to different palladium concentrations on the substrate were studied. It was found that a minimum substrate coverage with four palladium atoms per square nanometer is sufficient to cause homogeneous nickel plating. The presence of a higher palladium concentration has no further effect on the catalytic activity. The influence of a variation of the annealing time of the LB films on the nickel plating was also investigated. Short annealing times favor palladium cluster formation, while long annealing times lead to larger metallic palladium particles (see part 1 of this study). It was found that short annealing times leading to the clusters do not cause a significant catalytic a...
8 citations
Patent•
10 Apr 2003
TL;DR: In this paper, a method for extracting and recovering nickel from a nickel-containing aqueous solution such as used electroless nickel plating solution is proposed. But this method requires the extraction of the nickel from an organic solvent containing β-hydroxyoxime-based extracting agent and acidic organic phosphorus compound.
Abstract: PROBLEM TO BE SOLVED: To provide a method for efficiently extracting and recovering nickel from a nickel-containing aqueous solution such as used electroless nickel plating solution. SOLUTION: Nickel is recovered by bringing an organic solvent containing β-hydroxyoxime-based extracting agent and acidic organic phosphorus compound into contact with the nickel-containing aqueous solution and extracting the nickel into the organic solvent phase. COPYRIGHT: (C)2005,JPO&NCIPI
8 citations
TL;DR: In this article, the best process of electroless nickel (EN) plating on AZ91D magnesium alloy and the performance of EN plating coating was investigated through single factor test and orthogonal test and the plating rate and porosity were analyzed.
Abstract: Purpose
The purpose of the investigation was to research the best process of electroless nickel (EN) plating on AZ91D magnesium alloy and the performance of EN plating coating.
Design/methodology/approach
Through single factor test and orthogonal test, EN plating on AZ91D magnesium alloy was researched. The plating rate and porosity were analyzed. The coating appearance of EN plating coating and magnesium alloy substrate was evaluated. The electrochemical properties of EN plating coating and substrate were researched using electrochemical workstation, and their compositions and structure were examined using X-ray diffraction and scanning electron microscopy.
Findings
The results made by combination of experimental and orthogonal test showed that the best formula of EN plating was 8.8 g·L−1 nickel ion, 25 g·L−1 lactic acid, 28 g·L−1 reducing agent, 1.8 ml·L−1 corrosion inhibitor, 1 mg·L−1 stabilizer, temperature at 85°C and pH value at 5.5. The plating was uniform, dense and with no cracks. The electrochemical tests showed that the corrosion resistance of EN plating was better than that of magnesium alloy substrate.
Originality/value
The results indicated that the corrosion resistance of magnesium alloy improved markedly after EN plating at the best formula and the plating covered magnesium alloy completely.
8 citations
Patent•
21 May 1993
TL;DR: Stabilized electroless nickel plating baths employing a hypophosphite reducing agent and conducted under electroless plating conditions which are treated to remove and control phosphite anions by the addition of lithium hydroxide to form insoluble dilithium phosphite readily recoverable from the bath on a batch or continuous basis as discussed by the authors.
Abstract: Stabilized electroless nickel plating baths employing a hypophosphite reducing agent and conducted under electroless plating conditions which are treated to remove and control phosphite anions by the addition of lithium hydroxide to form insoluble dilithium phosphite readily recoverable from the bath on a batch or continuous basis.
8 citations