Topic
Electron backscatter diffraction
About: Electron backscatter diffraction is a research topic. Over the lifetime, 15184 publications have been published within this topic receiving 317847 citations. The topic is also known as: EBSD.
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TL;DR: In this article, the authors investigated the role of three basic mechanisms, namely oriented nucleation, growth, and recrystallization twinning, in the initial stages of recrystization texture development in this low stacking fault energy alloy.
105 citations
25 Nov 2005-Materials Science and Engineering A-structural Materials Properties Microstructure and Processing
TL;DR: In this article, the mechanisms of microstructural evolution in copper subjected to equal channel angular pressing (ECAP) have been investigated after successive passes, where the first few passes are the most efficient in grain refinement while the microstructure becomes gradually more equiaxed as the number of passes increases.
Abstract: The mechanisms of microstructural evolution in copper subjected to equal channel angular pressing (ECAP) have been investigated after successive passes. The first few passes are the most efficient in grain refinement while the microstructure becomes gradually more equiaxed as the number of passes increases. The texture evolution is discussed based on electron back scattered diffraction (EBSD) results. These experimental results are interpreted in terms of a preliminary model with four successive stages: homogeneous dislocation distribution; elongated sub-cell formation; elongated subgrain formation; break-up of subgrains into equiaxed units; sharpening of grain boundaries and final equiaxed ultrafine structure.
105 citations
TL;DR: In this paper, a micro-laser aided additive manufacturing (micro-LAAM) was successfully implemented on nickel-base superalloy IN100, which is known to have poor weldability due to weld liquation cracking in the heat-affected zone (HAZ) and strain age cracking.
105 citations
TL;DR: In this paper, the texture of electroplated Cu lines of 0.375, 0.5 and 1.5 μm widths with Ta and TiN barrier layers was analyzed using x-ray pole figure and electron backscatter diffraction (EBSD) techniques.
Abstract: The texture of electroplated Cu lines of 0.375, 0.5 and 1.5 μm widths with Ta and TiN barrier layers was analyzed using x-ray pole figure and electron backscatter diffraction (EBSD) techniques. Both techniques indicate a strong (111) fiber texture relative to the bottom surface of the trench for samples with a Ta barrier layer and a 400 °C, 30 min, postelectroplating anneal. Samples with a TiN barrier and no anneal exhibit a weak (111) texture. For both barrier layers the quality of the texture, as measured by (111) peak intensity, fraction of randomly oriented grains and (111) peak width, degrades with decreasing linewidth. EBSD data also indicate (111) texture relative to the sidewalls of the trench in samples with a Ta barrier and postelectroplating anneal. Electromigration tests at 300 °C of 0.36 μm damascene Cu lines with the same process conditions show that samples with very weak (111) texture have median time to failures that exceed those of the strongly textured Cu lines. These results indicate t...
105 citations
TL;DR: In this paper, the form factor observed in seven orders of diffraction was used to show the existence of a two-layer wall structure, with a narrower mesopore than previously assumed, and much void space in the walls.
Abstract: Synchrotron X-ray diffraction patterns for highly crystalline MCM-41 a mesoporous silicate molecular sieve are presented. The form factor observed in seven orders of diffraction is used to show the existence of a two-layer wall structure, with a narrower mesopore than previously assumed, and much void space in the walls.
104 citations