Topic
Electron backscatter diffraction
About: Electron backscatter diffraction is a research topic. Over the lifetime, 15184 publications have been published within this topic receiving 317847 citations. The topic is also known as: EBSD.
Papers published on a yearly basis
Papers
More filters
TL;DR: In this paper, the microstructure, texture, and deformation behavior of a carbon nanotube reinforced aluminum composite via electron backscatter diffraction, X-ray diffraction (XRD), scanning and transmission electron microscopy was characterized.
150 citations
TL;DR: In this paper, transmission Kikuchi diffraction (TKD) is combined with energy dispersive X-ray spectroscopy (EDS) to provide complementary chemical information, while a standard forescatter detector system can be used to generate dark field and oriented dark field images.
150 citations
TL;DR: In this paper, the role of β grain growth on variant selection during β→α phase transformation has been investigated in Ti-6 Al-4 V with and without 0.4% yttrium addition.
150 citations
TL;DR: In this article, a characterization protocol based on the electron backscatter diffraction technique has been developed to identify the combination of microstructural features within crack initiation sites and surrounding neighborhoods that leads to the transition from initiation to early small crack growth.
150 citations
05 Jan 2017-Materials Science and Engineering A-structural Materials Properties Microstructure and Processing
TL;DR: In this paper, high temperature tensile and electron backscatter diffraction (EBSD) techniques were combined to perform a systematic investigation for the hot deformation behavior and microstructure evolution of the Ti55 alloy.
Abstract: High temperature tensile and electron backscatter diffraction (EBSD) techniques were combined to perform a systematic investigation for the hot deformation behavior and microstructure evolution of the Ti55 alloy Under temperatures ranging from 885 to 935 °C and stain rates of 83×10−4 s−1−133×10−2 s−1, all the flow curves of the Ti55 alloy exhibit similar behaviors: after reaching the peak flow stress, the curves enter into a softening stage and then remain a steady level, where the maximum superplastic elongation of 987% indicates good superplasticity Detailed microstructure characterizations under different deformation stages show that the grain aspect ratios decrease greatly and the fractions of high angle boundaries (>15°) increase rapidly at the softening stage These observations are attributed to the dynamic recrystallization, in which low angle grain boundaries (
149 citations