Topic
Electron backscatter diffraction
About: Electron backscatter diffraction is a research topic. Over the lifetime, 15184 publications have been published within this topic receiving 317847 citations. The topic is also known as: EBSD.
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TL;DR: In this paper, the dependence of metal silicide precipitate formation on grain boundary character and microstructure in multicrystalline silicon (mc-Si) was investigated using synchrotron-based analytical microprobe techniques, electron backscatter diffraction and defect etching.
Abstract: Synchrotron-based analytical microprobe techniques, electron backscatter diffraction, and defect etching are combined to determine the dependence of metal silicide precipitate formation on grain boundary character and microstructure in multicrystalline silicon (mc-Si). Metal silicide precipitate decoration is observed to increase with decreasing atomic coincidence within the grain boundary plane (increasing Σ values). A few low-Σ boundaries contain anomalously high metal precipitate concentrations, concomitant with heavy dislocation decoration. These results provide direct experimental evidence that the degree of interaction between metals and structural defects in mc-Si can vary as a function of microstructure, with implications for mc-Si device performance and processing.
139 citations
TL;DR: In this article, the misorientation distribution of the dynamically recrystallized grains was measured by electron backscatter diffraction (EBSD) and the results show that a portion of the grains from DRX satisfy the { 10 1 ¯ 2 } 〈 1 0 1 ¯ 1 ¯ 〉 twin orientation relationship and indicate that twinning plays an important role in DRX.
138 citations
TL;DR: In this paper, the authors proposed a new thermo-mechanical treatment route to activate the transformation-induced plasticity (TRIP) effect over a broad strain regime and refer to it as the spectral TRIP effect.
138 citations
TL;DR: In this paper, a new copper oxide superconductor with an onset tem-perature of 28 K was found in the Nd-Ce-Sr-Cu-O system.
Abstract: Recently, a new copper oxide superconductor with an onset tem-perature of 28 K was found in the Nd–Ce–Sr–Cu–O system1. The superconducting phase was identified by X-ray diffraction and electron microscopy2, and the metal-atom positions are identical with those in the K2NiF4 or Nd2CuO4 structure3, except for the order of the cations Nd(Ce) and Sr. Here we report the refinement of the crystal structure using neutron powder diffraction. We find that it comprises alternating slabs of the K2NiF4 and Nd2CuO4 structures, and that all the copper atoms are crystallographically identical, with oxygen in fivefold (square-pyramidal) coordination. In having only one kind of copper site, this new compound is structurally simpler than the other CuO5-bearing superconductors such as YBa2Cu3O7, and may therefore be particularly helpful in the effort to understand the origins of high-temperature superconductivity.
138 citations
25 Jan 2011-Materials Science and Engineering A-structural Materials Properties Microstructure and Processing
TL;DR: In this paper, a hot compression test of homogenized 7050 aluminum alloy was carried out on the Gleeble-1500 thermal simulation machine, and the associated microstructure was studied using electron back scattered diffraction technique and transmission electron microscopy.
Abstract: Hot compression tests of homogenized 7050 aluminum alloy were carried out on the Gleeble-1500 thermal simulation machine, and the associated microstructure was studied using electron back scattered diffraction technique and transmission electron microscopy. The results showed that the peak stress levels decreased with the increase of deformation temperatures or the decrease of strain rates, which can be represented by the Zener–Hollomon parameter in the exponent-type equation with the hot deformation activation energy of 160.3 kJ/mol. With the decrease of Z values, results showed a continuous decrease in very low angle boundaries, exhibiting a misorientation between 2° and 5°, associated to substructure, and a steady increase in the other higher angle boundaries, especially with the misorientation angles between 30° and 60°. And such an evolution is due to the increase of subgrain size with the decrease of Z values. At lower Z , the dislocations collected into more widely spaced and less dense tangles. As strain rose, the tangles reorganized into subgrains with walls that were more widely spaced and straighter; they had fewer, more regularly arranged dislocations. The main softening mechanism of homogenized 7050 aluminum alloy is dynamic recovery.
138 citations