Showing papers on "Electron-beam lithography published in 1969"

Electron beam fabrication system and process for use thereof

Abstract: A SYSTEM FOR FABRICATION OF PATTERNS IS SUBSTRATES SUCH AS INTERGRATED CIRCUITS ON SILICON WAFERS, EMPLOYS A SCANNING ELECTRON MICROSCOPE TO PRODUCE A PHOTOCATHODE HAVING THE DESIRED SURFACE PATTERN THEREIN AND THE PHOTCATHODE IS THEN EMPLOYED TO PRODUCE REPLICATE PATTERNS ON A PLURALITY OF SUBSTRATES. THE PHOTOCATHODE PRODUCES A PATTERNED ELECTRON BEAM WHICH IMPINGES ON AN ELECTRON RESIST ON A SUBSTRATE TO PROVIDE FOR DIFFERENTIAL SOLUBILITY BETWEEN THE ELECTRON BEAM TTREATED ZND UNTREATED RESIST AREAS. REMOVING THE MORE SOLUBLE PORTION OF THE ELECTRON RESIST AFTER TREATMENT BY THE PHOTOCATHODE, EXPOSES THE SUBSTRATE SURFACE WHICH IS THEN ALTERED EITHER PHYSICALLY OR CHEMICALLY. ONE OR MORE HIGHLY PRECISE PATTERNS BOTH IN THEIR LOCATION AND CONFIGURATION, MAY BE PRODUCED ON THE SURFACE OF A SUBSTRATE BY APPLYING A SERIES OF SUCCESSIVE ELECTRON RESISTS TO THE SUBSTRATE AND USING A PLURALITY OF PHOTOCATHODES.

Multiple imaging charged particle beam exposure system

Abstract: An electron source illuminates a pattern mask having a desired aperture pattern therein. Electrons passing through the pattern mask impinge upon a mesh screen. A high-voltage electrical source is connected between the mesh screen and an electron-sensitive resist coated substrate to produce a strong electrical field therebetween. Each hole in the mesh screen acts as an electron lens for producing an image of the pattern mask on the electronsensitive resist, thus resulting in an array of exposed images on the electron-sensitive resist. Alternatively, an ion source may be used with an ion-sensitive resist coated substrate or ions may be implanted directly into a substrate.