scispace - formally typeset
Search or ask a question
Topic

Electron-beam lithography

About: Electron-beam lithography is a research topic. Over the lifetime, 8982 publications have been published within this topic receiving 143325 citations. The topic is also known as: e-beam lithography.


Papers
More filters
Journal ArticleDOI
TL;DR: In this article, a novel 3D fabrication process has been proposed by utilizing the proximity effect of electron beam lithography (EBL) to create 3D microstructures on negative photoresists as the primary molds, which are subsequently transferred to their corresponding negative molds using nanoimprinting lithography and to form the final replicas by either electroforming or polymer spin casting to reduce cost.
Abstract: Recently, with the advancement in bio-MEMS and micro optoelectromechanical systems (MOEMS), 3D microstructures have become increasingly important and efficient fabrication processes are currently being sought. In this paper, a novel 3D fabrication process has been proposed by utilizing the proximity effect of electron beam lithography (EBL) to create 3D microstructures on negative photoresists as the primary molds, which are subsequently transferred to their corresponding negative molds using nanoimprinting lithography (NIL), and to form the final replicas by either electroforming or polymer spin casting to reduce cost. The effect of electron backscattering on the 3D topography is firstly investigated and the relationship among the spatial distribution of electron beam irradiation, the spot size and the dosage level of irradiation is experimentally characterized in SU-8 to establish a dosage kernel distribution function. A mathematical procedure based on linear operation of this kernel function is then proposed to mimic the EBL fabrication process. The subsequent experiments indicate that the predicted surface profiles agree with the experimental results to large extent and the proposed mathematical operations are valid for the purpose of designing the fabrication process. Finally, the SU-8 primary molds are transferred to NEB to form secondary molds via the nanoimprinting process. It shows that the nanoimprinting process can essentially reproduce the shape and geometry of the primary molds. However, due to the nature of polymer-to-polymer contact printing, the elastic restitution of materials induces a slight deviation of the final device size and a further study should be made in the future to minimize such types of error. Although the above problems are reported, nevertheless, the primary experimental results indicate that this proposed fabrication process is capable of creating 3D shape microstructure in the order of 1 µm and should be useful for related optical-, bio- and RF-MEMS applications.

45 citations

Journal ArticleDOI
TL;DR: In this paper, the c-axis resistance as a function of temperature and currentvoltage characteristics of terahertz (THz) emitting mesas with lateral sizes ranging from 30 × 300 to 100 × 300µm2 was investigated.
Abstract: Recently, we experimentally demonstrated that rectangular mesa structures of intrinsic Josephson junctions (IJJ) in Bi2Sr2CaCu2O8+d (Bi2212) can be used as a compact solid-state generator of continuous, coherent and polarized terahertz (THz) radiation In the present work, we will exhibit tall mesas (over 600 junctions) which were fabricated using UV lithography, e-beam lithography with photoresist and e-beam lithography with a Ti selective etching technique We will present measurements of the c-axis resistance as a function of temperature and of current–voltage characteristics of THz emitting mesas with lateral sizes ranging from 30 × 300 to 100 × 300 µm2 Furthermore, we will discuss the dependence of the characteristics of the mesa structures on the oxygen doping level of the Bi2212 crystals We will also experimentally show that the voltage–frequency relation of the ac Josephson effect has to match the cavity resonance for successful emission

45 citations

Book ChapterDOI
01 Jan 1999
TL;DR: Despite the extraordinary success of current techniques for microfabrication, new techniques are needed as mentioned in this paper for large scale, high volume processing, and other considerations such as capital and processing costs, waste management, environmental concerns, and the degree of perfection of the final structures may also force the development of new methods for micro fabrication.
Abstract: Despite the extraordinary success of current techniques for microfabrication, new techniques are needed. One reason is scale: optically based lithography is reaching the lower limits for the size of features it can produce (˜100 nm). Another is efficiency: methods such as electron beam lithography are presently linear processes and will require significant development if they are to be used for large scale, high volume processing. Other considerations such as capital and processing costs, waste management, environmental concerns, and the degree of perfection of the final structures may also force the development of new methods for microfabrication.

45 citations

Journal ArticleDOI
TL;DR: In this paper, Newman et al. showed that the pinhole densities in 14.3 and 22.3 nm spin-cast poly(methylmethacrylate) films are only a few per cm2.
Abstract: Ultrathin (14–22 nm) poly(methylmethacrylate) (PMMA) films prepared by both spin casting and Langmuir–Blodgett (LB) techniques and novolac films prepared by spin casting have been explored as high‐resolution electron beam resists. One‐eighth micron lines‐and‐spaces patterns (equal to the smallest beam diameter available) have been achieved by using a Perkin Elmer MEBES I pattern generation system as the exposure tool, and the definition of 45‐nm features has recently been achieved by using a high‐resolution electron beam lithography system. [J. H. Newman, K. E. Williams, and R. F. W. Pease, J. Vac. Sci. Technol. B 5, 88 (1987)]. The etch resistance of such films is sufficiently good to allow patterning of a chromium film suitable for photomask fabrication. The most surprising result has been that the pinhole densities in 14.3‐nm LB PMMA film and 22‐nm spin‐cast novolac film are only a few per cm2, considerably lower than the density in spin‐cast PMMA films of comparable thicknesses.

45 citations

Journal ArticleDOI
TL;DR: In this paper, the use of e-beam lithography as an alternative to optical lithography for the fabrication of critical features in the thin-film head is described, where the unique geometry of the head structure, the low density of critical head features on the wafer, and the relatively low wafer volume requirements for thin-filtered heads are discussed.
Abstract: Magnetic recording areal densities using magnetoresistive (MR) head technology are increasing at annual rates in excess of 60% per year and in some applications as great as 100% per year. Today, the critical features of the thin-film head can be patterned with the same optical lithography techniques used by the semiconductor industry. However, with the assumption that areal density increases in magnetic recording are maintained, within the next rive years, thin-film head lithography requirements will exceed semiconductor roadmap projections. This paper describes the use of e-beam lithography as an alternative to optical lithography for the fabrication of critical features in the thin-film head. In particular, the unique geometry of the head structure, the low density of critical head features on the wafer, and the relatively low wafer volume requirements for thin-film heads allow e-beam lithography to become a viable manufacturing alternative for thin-film head fabrication. More important, e-beam lithography is ideally suited for producing thin-film head structures at a development level prior to the optimization of manufacturable optical processing.

45 citations


Network Information
Related Topics (5)
Thin film
275.5K papers, 4.5M citations
91% related
Silicon
196K papers, 3M citations
90% related
Photoluminescence
83.4K papers, 1.8M citations
87% related
Quantum dot
76.7K papers, 1.9M citations
87% related
Band gap
86.8K papers, 2.2M citations
86% related
Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202384
2022163
2021108
2020161
2019174
2018204