Topic
Electron-beam lithography
About: Electron-beam lithography is a research topic. Over the lifetime, 8982 publications have been published within this topic receiving 143325 citations. The topic is also known as: e-beam lithography.
Papers published on a yearly basis
Papers
More filters
•
28 Jul 1978TL;DR: In this paper, a method of grain-orienting the crystal structure of a layer of semiconductor material by application of a raster scanning electron beam to a layer which has been previously formed on a substrate, such as by sputter-plasma film deposition, is described.
Abstract: A method of grain-orienting the crystal structure of a layer of semiconductor material by application of a raster scanning electron beam to a layer of polycrystalline semiconductor material which has been previously formed on a substrate, such as by sputter-plasma film deposition. The method comprises electron beam lithography computer-applied to the crystal growth and orientation of a polycrystalline thin sheet of silicon or other semiconductor material.
35 citations
••
30 Jan 1991TL;DR: In this article, the use of numerically controlled E-beam-based NPL techniques for fabricating both monolithic micromachines and micro-components for use in larger systems.
Abstract: The authors present specific nonplanar lithographic (NPL) techniques for use in fabricating both monolithic micromachines and microcomponents for use in larger systems. The emphasis is on the use of numerically controlled E-beam-based lithography, with the resist exposed over nonplanar surfaces. Previously, nonplanar, optical-mask-based approaches have been used to fabricate devices such as wobble motor rotors, but with less success than the NPL techniques due to depth-of-field problems. The specific focus is on etching cylindrically shaped metal structures which are either (1) homogeneous or (2) layered by successive deposition, masking, and etching. Structures on the order of 80 to 500 microns in diameter have been constructed of either solid metals or sputtered thin metallic layers on quartz shafts. A number of either deep or shallow patterns have been fabricated on and through the structures, with promising results. Examples include helices, longitudinal lines, holes, notches, flexures, barbs, alphanumeric characters, and electrostatic field emitting patterns for use in wobble motors. Efforts are now proceeding toward generating complete systems, including transducers and actuators for industrial and medical applications. >
35 citations
••
TL;DR: In this article, the authors describe direct porous silicon patterning based on electron-beam induced carbon deposition used as a mask against pore formation on Si under ideal conditions the C-deposits act as a negative resist to suppress completely and selectively the formation of light emitting porous Si at treated locations.
35 citations
••
TL;DR: In this paper, the authors describe the fabrication of four-level zone plates made of gold and nickel, whose total thickness is 2.1 μm and 4.0 μm, respectively, at the first diffraction order and at 7 keV x-ray energy.
Abstract: X-ray microscopy is a research area in which enormous progress has been made in the last years. The advent of third-generation synchrotons, together with the progress made in the fabrication of new optical devices, such as zone plate, are the two main factors that have influenced the interest around microscopy science. The article will treat the fabrication, by means, exclusively, of electron-beam lithography, of high-efficiency zone plates for x rays in the energy range of hard x rays. We were able to fabricate four-level zone plates made of gold and nickel, whose total thickness is 2.1 μm for gold, and 4.0 μm for nickel. The resolution, of the last level, is equal to 0.5 μm. These zone plates have experimental efficiency of about 38% in the case of gold, and 55% in the case of nickel, at the first diffraction order and at 7 keV x-ray energy. To our knowledge, the nickel zone plates have the highest efficiency ever obtained at x-ray wavelengths.
35 citations
••
TL;DR: In this article, a novel process for the fabrication of 3D patterns with both vertical and inclined profiles in close vicinity on the same substrate was presented, using dose-modulated electron-beam lithography (EBL) in polymeric resist combined with a thermal annealing (reflow) post-treatment at a moderate temperature.
35 citations