Electron-beam lithography

About: Electron-beam lithography is a research topic. Over the lifetime, 8982 publications have been published within this topic receiving 143325 citations. The topic is also known as: e-beam lithography.

Fundamentals of Electron Beam Exposure and Development

Abstract: Electron Beam Lithography (EBL) is a fundamental technique of nanofabrication, allowing not only the direct writing of structures down to sub-10 nm dimensions, but also enabling high volume nanoscale patterning technologies such as (DUV and EUV) optical lithography and nanoimprint lithography through the formation of masks and templates. This chapter summarizes the key principles of EBL and explores some of the complex interactions between relevant parameters and their effects on the quality of the resulting lithographic structures. The use of low energy exposure and cold development is discussed, along with their impacts on processing windows. Applications of EBL are explored for the fabrication of very small isolated bridge structures and for high density master masks for nanoimprint lithography. Strategies for using both positive and negative tone resists are explored.

Axonal guidance on patterned free-standing nanowire surfaces

Abstract: We demonstrate high-fidelity guidance of axons using rows of nanowires. The axons are prevented from crossing the rows, making it possible to guide and sort a large number of axons as opposed to when chemical patterns are used. Focal adhesion forms at the nanowires establishing a possible site of information transfer between the surface and the cells. Rows of gallium phosphide (GaP) nanowires were epitaxially grown on GaP(111) substrates in patterns defined by electron beam lithography.

Conducting polyanilines: Discharge layers for electron‐beam lithography

Abstract: This paper describes the use of electrically conducting polyanilines as discharge layers for electron‐beam (e‐beam) lithography. The emeraldine oxidation state polyaniline is a soluble material which can be doped by various cationic reagents, most commonly protonic acids, to afford conductivity on the order of 10° Ω−1 cm−1. The conducting polyanilines are incorporated as thin interlayers (2000 A) in a multilayer resist system consisting of a planarizing underlayer (2.8 μm) and the imaging resist (1.2 μm) on top. We find that various acid‐treated polyanilines eliminate charging during e‐beam patterning of the resist, i.e., zero pattern displacements are observed as compared to the case where a conducting interlayer is not incorporated into the resist system. In the latter case placement errors greater than 5 μm are observed as a result of charging. A minimum conductivity of 10−4 Ω−1 cm−1 is required for the polyaniline interlayers in order to observe zero pattern displacement. In addition, we have simplifi...

Site control of self-organized InAs dots on GaAs substrates by in situ electron-beam lithography and molecular-beam epitaxy

Abstract: We studied a site-control method for self-organized InAs quantum dots on GaAs substrates by a combination of in situ electron-beam (EB) lithography and molecular-beam epitaxy (MBE) using an ultrahigh-vacuum multichamber system. Small and shallow holes were patterned on a MBE-grown GaAs (001) surface by in situ EB writing and Cl2-gas etching. When more than a 1.4 monolayer of InAs was applied to the patterned surface, In(Ga)As dots were preferentially self-organized in the holes while dot formation around the holes was sufficiently suppressed. When we further increased the amount of InAs, the dots enlarged remarkably, presumably due to a stress-relaxation effect.