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Showing papers on "Electronic packaging published in 1979"


Proceedings ArticleDOI
01 Apr 1979
TL;DR: In this paper, the results of an extensive program to characterize the long-term performance of high-density circuitry on glass-reinforced epoxy substrates are presented, and the nature of the wearout mechanism is described.
Abstract: This paper reviews the results of an extensive program to characterize the long-term performance of high density circuitry on glass-reinforced epoxy substrates. The data reveal potentially serious limitations in existing materials. The nature of the wearout mechanism will be described, and data on temperature, humidity, and voltage dependence will be reviewed.

54 citations


Journal ArticleDOI
TL;DR: In this article, typical semiconductor, ceramic packaging materials, and typical commercial raw materials used in formulating ceramic packaging material were analyzed for alpha-particle-emission characteristics and for trace uranium and thorium contents.
Abstract: Typical semiconductor, ceramic packaging materials, and typical commercial raw materials used in formulating ceramic packaging materials were analyzed for alpha-particle-emission characteristics and for trace uranium and thorium contents. Results indicate the possibilities of achieving low alpha-particle-emitting ceramic substrates, covers, and sealants.

11 citations


Proceedings ArticleDOI
01 Jan 1979

11 citations


Journal ArticleDOI
TL;DR: The BELLPAC∗ system as mentioned in this paper is a family of electronic packaging modules being used in the physical design of more than 40 new Bell Laboratories-developed systems, consisting of a set of circuit packs, connectors (both circuit pack and backplane), and shelf hardware.
Abstract: The BELLPAC∗ system is a family of electronic packaging modules being used in the physical design of more than 40 new Bell Laboratories-developed systems. The BELLPAC system consists of a set of circuit packs, connectors (both circuit pack and backplane), and shelf hardware. A range of circuit pack sizes and interconnection densities is provided to match system packaging needs. Present elements include circuit pack connectors with pin-outs ranging from 50 to 300, circuit pack sizes ranging from 30 to 100 square inches, and circuit pack technologies ranging from simple, low-density, epoxy glass for epoxy-coated metal) circuits up to fine-line multilayer boards. In this paper, we review the physical design of the BELLPAC system. We also describe the large body of design and manufacturing support information available to system development organizations using BELLPAC hardware.

9 citations



Journal ArticleDOI
TL;DR: The Navy's Standard Electronic Modules (SEM) program is the sole triservice coordinated module standardization program within the Department of Defense (DoD), which is structured to provide system designers with a flexible set of electronic functions and packaging hardware for the design and production of military electronic equipment as mentioned in this paper.
Abstract: The Navy's Standard Electronic Modules (SEM) program is the sole triservice coordinated module standardization program within the Department of Defense (DoD). The program is structured to provide system designers with a flexible set of electronic functions and packaging hardware for the design and production of military electronic equipment. SEM has demonstrated that a standardization program with appropriate quality assurance controls can provide a significant increase in equipment reliability. Following a brief overview citing some of the accomplishments of the program, the packaging technology aspects of the program are detailed. Packaging aspects addressed include mechanical definition, thermal definition, and recent evolutionary changes. A discussion of current SEM packaging development efforts follows. Finally, SEM-related avionics packaging development efforts are described.

2 citations


ReportDOI
24 Jan 1979
TL;DR: In this paper, the feasibility of fabricating flexible thin-film circuits while planar, and then folding or rolling the circuits to conform to packaging constraints was investigated, which would significantly increase microcircuit packing density and offer a new dimension to the thinfilm circuit engineer.
Abstract: : The feasibility of fabricating flexible thin-film circuits while planar, and then folding or rolling the circuits to conform to packaging constraints was investigated. This approach would significantly increase microcircuit packing density and offer a new dimension to the thin-film circuit engineer. The flexible substrate used was the polyimide film, Kapton; identical circuits were also fabricated on borosilicate glass substrates for comparison. The conductor-resistor arrays used a new material system (copper/Kanthal) offering low cost, low temperature coefficient resistors, and a simple fabrication process. The flexible thin-film resistors were found to show very small resistor value changes when flexed (average about 0.2% for 1-cm radius of curvature), and resistor temperature coefficients comparable to those on glass substrates. This work suggests that flexible thin-film substrates may help solve complex thin-film microcircuit packaging problems. (Author)

Journal ArticleDOI
D. Hayes1
TL;DR: The single chip bubble memory packages are currently in production of Texas Instruments and the mechanical configuration of the packages and some of the assembly techniques are discussed in this paper, where thermal characteristics and magnetic shielding characteristics are discussed.
Abstract: Single chip bubble memory packages are currently in production of Texas Instruments. The mechanical configuration of the packages and some of the assembly techniques will be shown in this paper. Thermal characteristics and magnetic shielding characteristics will be discussed to indicate the type of testing that is required to design an acceptable package. Finally environmental test results will be presented.