Showing papers on "Electronic packaging published in 1982"

Electronic packaging module utilizing phase-change conductive cooling

Abstract: Each individual module includes a sealed chamber containing the electronic components being cooled, the liquid cooling medium, and at least one minature evaporator. The evaporator's outer surface area is in direct contact with the cooling medium, so as to maintain it at a desired temperature. Preferably, in order to minimize the weight associated with the liquid cooling medium and in order to compensate for its coefficient termal expansion and the associated internal pressure variation, the chamber may be packed with resilient spheres that will displace a substantial quantity of the cooling medium without a corresponding increase in its effective viscosity (and thus without any substantial effect on the liquid's capability of transferring heat from the components to the evaporator by means of thermal convection currents). The mechanical, electrical and refrigerant connections between the module and the other assemblies of the avionics system are such that the individual module may be readily removed and replaced thereby further enchancing the overall maintainability of the system. An expansion bladder vented to the external environment may also be provided within the chamber.