Showing papers on "Electronic packaging published in 1990"

Advanced electronic packaging materials

Abstract: This proceeding contains papers on advanced electronic packaging materials. Included are the following topics: Optoelectronics, Polymers, Composites, Aluminum Nitride, and Metallization.

Packaging and interconnection of sensors

Abstract: Chip mounting methods, chip-substrate interconnection techniques, encapsulation processes, design methods and technologies for multi-chip systems must all be considered in microelectronic packaging. In the case of sensors, as well as the electrical contacts for signal outputs and power distribution, the input of the non-electrical measurement signals must be realized. Parts of the sensor are therefore in direct contact with environmental physical and chemical parameters which can degrade the reliability. Therefore the requirements for sensor packaging technologies are related to specific measurement problems. In general, sensor packaging has to deliver reliable, economical and application-oriented solutions by choosing optimal technologies and material combinations.

Electronic packaging in the 1990s: the perspective from Europe

Abstract: Aspects of electronic packaging for mainframe applications are reviewed. A new generation of microwiring boards has been introduced, based on Cu/polymer layers on a polyimide base or metal/polymer layers on a multilayer ceramic or silicon base for high-end technologies. Advanced multilayer printed circuit boards will fulfil the requirements for low-end applications for the late 90s. In order to satisfy the desired reduction in line delay by packaging components on both sides of large-size wiring substrates, wiring technology is being challenged by miniaturized line structures and increased wiring density. High circuit integration, associated with revolutionary developments in device technology, reduction in chip-feature size, and a packaging technology based on multichip modules, has led to a significant increase in power dissipation and related flux. >

Electronic packaging in the 1990s-a perspective from America

Abstract: The advanced packaging technologies that can be expected in the 1990s in high-performance systems are discussed in terms of chip connection, power distribution, heat removal, and thick- and thin-film wiring and package interconnections. The following topics are discussed in detail: (1) chip-level connection providing the required connections between the chip and the package; (2) power distribution to the chip and heat removal from the chip; (3) first-level packages providing all the necessary wiring, interconnections, and power distribution; (4) first-to-second level interconnections; and (5) second-level packages providing all the necessary wiring, connections, power distribution, and power supply connection. >

Electronic packaging in the 1990s-a perspective from Asia

Abstract: An overview of the present status and future trends in electronic packaging technologies is presented. Advanced modules packaged with these technologies are show in three major systems: switching systems, transmission systems, and computer systems. It is projected that high-speed digital switching modules will adopt multichip packaging because they can transmit high-speed pulses. In the latter half of the 90s, prototypes of optical switching modules will be implemented. In optical communication systems, a fine flip-chip interconnection technique using solder bumps will become indispensable for high-speed optical modules operating at over 20 GHz. As inductance corresponding to wire length degrades electrical characteristics, innovative packaging using impedance-matched film carriers will be developed for GaAs MMIC (microwave monolithic integrated circuit) modules in future microwave transmission systems. Multichip packaging will be widely used in computer systems because it provides higher packaging density, ensuring reduced interconnection delays. >

Apparatus (packaging machine) for the packaging of articles of differing size

Abstract: 1.1. Apparatus (packaging machine) for the packaging of articles of differing size. 2.1. In packaging technology, it is often necessary to solve the problem of producing packs of differing size on one and the same packaging machine. As a rule, adapting this to the different pack formats requires considerable conversion work. This in turn involves lengthy standstill phases of the packaging machine. 2.2. To make it easier for the packaging machine to be changed over to different pack formats, packaging mem-bers, especially folding members, critical for the packaging process are provided in the form of a plurality of, preferably two sets (40, 41). A particular set of packaging members is in the packaging position (43). A further (part) set is in an exchange position (44) for the exchange of individual or all packaging members for other formats. The format change is carried out in a simple way by bringing the set (40, 41) required for the particular size of the pack into the packaging position (43) as a result of a rotational or other movement. the standstill times of the packaging machine necessary for a format change are consequently minimal.

Silicones with improved thermal conductivity for thermal management in electronic packaging

Abstract: The design, use, and application of thermal compounds in popular electronic packages are described. Typical properties of silicones are addressed, including the differences between thermally conductive silicone greases, gels, and adhesives. Recent trends in electronic-packaging thermal-management techniques are also covered. Specific attention is given to multi-chip modules utilizing thermal compounds for heat removal through the top of the flip chip. The key properties of highly thermally conductive materials are highlighted. These areas include the selection of filler type, filler packing, and total filler loading. The properties of a thermal compound developed for flip-chip application are explained in detail, and attention is given to how the above areas have been optimized in this product. It is concluded that the proper selection and use of thermally conductive silicones, as presently described, can greatly enhance the performance of many electronic packages. >

Electronic packaging and cooling system using superconductors for power distribution

Abstract: A board containing plural superconducting power planes, one for each required potential level, is used to distribute power to one or more semiconductor logic chips which, together with the board, are immersed in liquid nitrogen. Each chip is coupled thermally to a heat exchanger and is coupled electrically to the board through leads that minimize heat transfer from the chip to the board.

Polyimides for semiconductor applications

Abstract: A wide variety of polymeric materials are used in the manufacture of semiconductor devices. Examples include polymers for use as photoresists in microfabrication and epoxy moulding compounds used in electronic packaging.

Microwave packaging of optoelectronic components

Abstract: The design and performance characteristics of single-mode fiber-coupled laser and photodiode packages suitable for use in microwave RF or broadband transmission systems are discussed. The necessary packaging considerations to achieve laser and photodiode performance to 20 GHz are described. Mechanical, thermal, optical and microwave details of two laser packages and one photodiode package are given, and the optoelectronic characteristics of the packaged units are presented and discussed. It is shown that the intrinsic optoelectronic performance of the components is preserved to at least 20 GHz and that this performance is not affected by package design. >

Applications of high thermal conductivity composites to electronics and spacecraft thermal design

Abstract: Recently, high thermal conductivity continuous graphite fiber reinforced metal matrix composites (MMC's) have become available that can save much weight over present methods of heat conduction. These materials have two or three times higher thermal conductivity in the fiber direction than the pure metals when compared on a thermal conductivity to weight basis. Use of these materials for heat conduction purposes can result in weight savings of from 50 to 70 percent over structural aluminum. Another significant advantage is that these materials can be used without the plumbing and testing complexities that accompany the use of liquid heat pipes. A spinoff of this research was the development of other MMC's as electronic device heat sinks. These use particulates rather than fibers and are formulated to match the coefficient of thermal expansion of electronic substrates in order to alleviate thermally induced stresses. The development of both types of these materials as viable weight saving substitutes for traditional methods of thermal control for electronics packaging and also for spacecraft thermal control applications are the subject of this report.

Physical packaging and organization of the drift chamber electronics system for the Stanford Large Detector

Abstract: The logical organization, physical packaging, and operation of the drift chamber electronics for the Stanford Large Detector are described. The system processes signals from approximately 7000 drift wires and is unusual in that most electronic functions are packaged on printed circuit boards within the detector. The circuits reside on signal-processing motherboards, controller boards, signal-transition boards, power-distribution boards, and fiber-optics-to-electrical conversion boards. The interaction and interconnection of these boards with respect to signal and control flow are presented. >

Electronic packaging and interconnection

Abstract: Etat de l'art sur les materiaux composites, les ceramiques et polymeres utilises en circuits integres, circuits integres hybrides afin d'ameliorer leur packaging et le nombre de leur interconnexions

Polymers in electronics packaging

Abstract: Integrated circuit packaging affects component performance, price, and reliability. Molded plastic packaging is cost-efficient compared to other packaging processes, and offers both quality and reliability. In recent years, AT&T Microelectronics has made significant improvements in package quality through a closely monitored quality program. Rapidly evolving device technology will make new demands on packaging to accommodate increases in device speed, miniaturization, and power dissipation. Packaging and interconnection will continue as significant factors affecting further advances in system performance. AT&T's expertise in packaging sophisticated, high lead-count devices has been achieved by focused development efforts and a packaging research program. New materials and process technology help AT&T package development engineers realize advanced designs for customer needs. Several new packaging technologies — including multichip modules, tape-based packages, and optical interconnection — will emerge in years to come, and could radically change the nature of packaging. AT&T will meet its customers' needs in microelectronics packaging by staying at the forefront of packaging design, materials and process technology.

Corrosion criteria for electronic packaging. III. Corrosion by package family

Abstract: For pt.II see ibid., p.1098-104, Dec. 1990. The reaction path for catastrophic corrosion requires both condensed moisture and ionic contamination. It is shown here that package types ranging from hermetic ceramic to plastic cavity can be configured reliably as long as materials and assembly methods do not result in the presence of both condensed moisture and ionic contamination on the surface of the encased silicon chip. >

Current Status and Future Trends of Electronic Packaging in Automotive Applications

Abstract: Since the late 1970's the microcomputer has been introduced and rapidly expanded to various kinds of vehicle electronics applications. This technology has been utilized to provide automobiles which not only have higher performance but also run more smoothly and cleanly. Microcomputer technology has also entered vehicle entertainment systems such as TV, mobile phone, VCR, and many other applications. Vehicle electronic packaging problems have developed as a result of this rapid expansion in vehicle microcomputer usage. Such problems include; size limitations, wire harness weight, wire harness complexity, connector size, electronic module packaging, and numerous other problems. This paper provides historical packaging technology issues including system integration, hybrid IC module technology, and CAE reliability analysis for extreme conditions.

Recent charge-coupled device optimization results at Steward Observatory

Abstract: Recent research efforts aimed at optimizing charge-coupled devices (CCDs) after their manufacture to achieve maximum quantum efficiency, wide spectral bandpass, and excellent cosmetics and surface flatness are discussed. Results are presented of a new acid thinning agitation technique which produces very uniform, high-quality surfaces on large area square and rectangular CCDs and 4-in silicon wafers for back illuminated operation. A method of cleaning thinned CCDs before antireflection coating for increased quantum efficiency is also discussed. The results of initial experiments with a new packaging method to mount thinned CCDs while maintaining a very flat imaging surface are presented. This bump bonding mounting technique increases yield due to reduced handling and robust packaging and is expandable to tightly packed large area focal plane mosaics.

Ceramics and Glass-Ceramics in Electronic Packaging

Abstract: An overview of ceramic packaging as it evolved over the last two decades from dual-in-line packages to state-of-the-art multilayer multichip packages ispresented. IBM’s 69 layer glass-ceramic/copper multilayer multichip substrate with dielectric constant of 5.0, thermal expansion exactly matching silicon and exceptional dimensional control is summarized.

Electronic packaging and interconnection technology: state of the art and future developments

Abstract: The package bottleneck developing because of the inability to densely wire single-chip modules together on printed circuit boards is examined. It is stressed that the performance and cost of future electronic systems will strongly depend on the right choice for the packaging approach. Expected multichip-module failure mechanisms are discussed. Material requirements anticipated for future electronic packaging strategies are examined. These include wafer-scale integration, assembly of discrete packages on printed wiring boards, multichip-modules, and higher packaging levels. >

Package for protecting electronic devices against damage during transport

Abstract: A package for protecting electronic devices (3) from damage during transport is described which consists of a transport container (4) and hollow profile-type packaging elements (23) which can be fitted onto the device (3) to be packaged. Due to special shaping of the packaging elements, it is possible to make them from a chemical pulp material which is not very stable itself and guarantees a completely unproblematic disposal of the used packaging elements since the material is both inflammable and decomposable. Additionally, the special shaping allows the individual packaging elements to be nested, as a result of which they can be stored and transported in a particularly space-saving manner.

An overview of computer packaging architecture and electrical design

Abstract: A discussion of packaging architecture is presented to understand the requirement on the physical design of the single chip module (SCM), multichip module (MCM), printed circuit board (PCB), connector, and cable. They in turn establish the driving force for their electrical designs. The packaging architecture of midrange, mainframe, and workstation computer systems provides an insight into the requirements of the physical and electrical design of electronic packaging of the future. It is important to ensure the electrical signal fidelity throughout the interconnection to limit the switching noise and signal crosstalk, and to minimize the propagation delay due to packaging. Electrical design with these consideration for chip carrier, printed circuit boards, connector, and cables is described. >

An overview of electrical and mechanical aspects of electronic packaging

Abstract: An overview of electrical and mechanical aspects of electronic packaging as they pertain to midrange and high-end computer systems is presented. Continued advances in semiconductor technology and manufacturing tools have fueled the expectation for continued greater function, higher performance, and lower costs in electronic systems. To meet this expectation, parallel progress in electronic packaging technology is necessary to realize the benefits of the VLSI technology advancements. Electrical and mechanical aspects of the electronic packaging structure-from the increased circuits per chip to the physical design of the electronic packaging-and future directions in packaging evolution are discussed. Innovations in single-chip and multichip modules, as well as the driving forces from the electrical requirements to the need of the physical design to meet wiring and performance demands are considered. >