Showing papers on "Electronic packaging published in 2010"
TL;DR: In this paper, a general analytical solution is used to study the whole temperature field of LED packaging substrate, this solution is based on the method of variable separation for thermal spreading resistances of eccentric heat sources on a rectangular flux channel.
147 citations
TL;DR: In this article, a high-temperature wirebond package for multichip phase-leg power module using SiC devices was designed, developed, fabricated, and tested.
Abstract: In order to take full advantage of SiC, a high-temperature wirebond package for multichip phase-leg power module using SiC devices was designed, developed, fabricated, and tested. The details of the material comparison and selection are described, thus culminating a feasible solution for high-temperature operation. A thermal cycling test with large temperature excursion (from -55°C to 250°C) was carried out to evaluate the thermomechanical reliability of the package. During the test, the substrate failed before other parts in 20 cycles. A sealing edge approach was proposed to improve the thermal reliability of the substrate. With the strengthening of the sealing material, the substrate, die-attachment, and wirebond assemblies exhibited satisfactoriness in the thermomechanical reliability tests. In order to evaluate the high-temperature operation ability of designed package, one prototype module was designed and fabricated. The high-temperature continuous power test shows that the package presented in this paper can perform well at 250°C junction temperature.
101 citations
TL;DR: In this paper, a phase-leg power module is packaged by a novel planar packaging technique for high-temperature (250°C) operation, where the nanosilver paste is chosen as the die-attach material as well as playing the key functions of electrically connecting the devices' pads.
Abstract: This paper presents the design, development, and testing of a phase-leg power module packaged by a novel planar packaging technique for high-temperature (250°C) operation. The nanosilver paste is chosen as the die-attach material as well as playing the key functions of electrically connecting the devices' pads. The electrical characteristics of the SiC-based power semiconductors, SiC JFETs, and SiC Schottky diodes have been measured and compared before and after packaging. No significant changes (<;5%) are found in the characteristics of all the devices. Prototype module is fabricated and operated up to 400 V, 1.4 kW at junction temperature of 250°C in the continuous power test. Thermomechanical robustness has also been investigated by passive thermal cycling of the module from -55°C to 250°C. Electrical and mechanical performances of the packaged module are characterized and considered to be reliable for at least 200 cycles.
90 citations
TL;DR: In this paper, an embedded chip integration technology that incorporates silicon housings and flexible Parylene-based microelectromechanical systems (MEMS) devices was presented, which demonstrated the functionality of the embedded chip using an RFID reader module in both air and saline, demonstrating successful power and data transmission through the MEMS coil.
Abstract: This paper presents an embedded chip integration technology that incorporates silicon housings and flexible Parylene-based microelectromechanical systems (MEMS) devices. Accelerated-lifetime soak testing is performed in saline at elevated temperatures to study the packaging performance of Parylene C thin films. Experimental results show that the silicon chip under test is well protected by Parylene, and the lifetime of Parylene-coated metal at body temperature (37°C) is more than 60 years, indicating that Parylene C is an excellent structural and packaging material for biomedical applications. To demonstrate the proposed packaging technology, a flexible MEMS radio-frequency (RF) coil has been integrated with an RF identification (RFID) circuit die. The coil has an inductance of 16 μH with two layers of metal completely encapsulated in Parylene C, which is microfabricated using a Parylene-metal-Parylene thin-film technology. The chip is a commercially available read-only RFID chip with a typical operating frequency of 125 kHz. The functionality of the embedded chip has been tested using an RFID reader module in both air and saline, demonstrating successful power and data transmission through the MEMS coil.
80 citations
TL;DR: In this paper, the authors highlight the prominent applications of ultra-thin chips, alerts to the related technological issues and compares the candidate enabling technologies and compare them with the existing technologies.
Abstract: Ultra-thin chip technology has potential to provide solutions for overcoming bottlenecks in silicon technology and for leading to new applications. This, however, requires new techniques in fabricating very thin wafers or chips, in applying them to device integration processes and in assembly and packaging. Therefore, ultra-thin chips and the related applications represent a new paradigm in silicon technology. The paper highlights the prominent applications of ultra-thin chips, alerts to the related technological issues and compares the candidate enabling technologies.
69 citations
01 Jan 2010
TL;DR: Nanomaterials for microelectronic and bio-packaging are discussed in this article, where the authors present a detailed review of the application of carbon nano-tubes (CNTs) and carbon nanicle-fibers (CNFs) as thermal interface materials for high-power Integrated Circuit (IC) Packages.
Abstract: Nanomaterials for Microelectronic and Bio-packaging.- Nano-conductive Adhesives for Nano-electronics Interconnection.- Biomimetic Lotus Effect Surfaces for Nanopackaging.- Applications of Carbon Nanomaterials as Electrical Interconnects and Thermal Interface Materials.- Nanomaterials via NanoSpray Combustion Chemical Vapor Condensation, and Their Electronic Applications.- 1D Nanowire Electrode Materials for Power Sources of Microelectronics.- Mechanical Energy Harvesting Using Wurtzite Nanowires.- Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectronic Packaging.- to Nanoparticle-Based Integrated Passives.- Thermally Conductive Nanocomposites.- Physical Properties and Mechanical Behavior of Carbon Nano-tubes (CNTs) and Carbon Nano-fibers (CNFs) as Thermal Interface Materials (TIMs) for High-Power Integrated Circuit (IC) Packages: Review and Extension.- On-Chip Thermal Management and Hot-Spot Remediation.- Some Aspects of Microchannel Heat Transfer.- Nanoprobes for Live-Cell Gene Detection.- Packaging for Bio-micro-electro-mechanical Systems (BioMEMS) and Microfluidic Chips.- Packaging of Biomolecular and Chemical Microsensors.- Nanobiosensing Electronics and Nanochemistry for Biosensor Packaging.- Molecular Dynamics Applications in Packaging.- Nanoscale Deformation and Strain Analysis by AFM/DIC Technique.- Nano-Scale and Atomistic-Scale Modeling of Advanced Materials.
69 citations
TL;DR: In this article, the effects of moisture on the reliability of LEDs were investigated, where several high-power white LEDs were subjected to extremely moist conditions at different temperature points and different light-output regression rates were measured.
Abstract: Unless their reliability is no longer a concern, light-emitting diodes (LEDs) will be unable to be used for broader applications. One important factor in the operating environment of LEDs is moisture, which is always present if the packaging is not hermetically sealed. In order to investigate the effects of moisture on the reliability of LEDs, several high-power white LEDs were subjected to extremely moist conditions at different temperature points in this study. Different light-output regression rates were measured. Digital microscopy was used to observe moisture diffusion on the LED module. The results demonstrate that the light output of LEDs decreases as the environmental moisture changes. Moisture diffuses into the interfaces of the packaging material, which not only decreases light output but may also disable the LED module due to electronic failure.
65 citations
Proceedings Article•
01 Jan 2010TL;DR: The paper highlights the prominent applications of ultra-thin chips, alerts to the related technological issues and compares the candidate enabling technologies.
Abstract: Ultra-thin chip technology has potential to provide solutions for overcoming bottlenecks in silicon technology and for leading to new applications. This, however, requires new techniques in fabricating very thin wafers or chips, in applying them to device integration processes and in assembly and packaging. Therefore, ultra-thin chips and the related applications represent a new paradigm in silicon technology. The paper highlights the prominent applications of ultra-thin chips, alerts to the related technological issues and compares the candidate enabling technologies.
61 citations
TL;DR: To demonstrate the effectiveness of the C-TSV structure for wafer-level 3D integration, feasibility study of the implementation of the novel process and mechanics comparisons of these two 3D chip stacking structures under thermal loading through finite element (FE) stress simulation are made.
57 citations
01 Jun 2010
TL;DR: In this article, an assembly of chip-on-chip test vehicle with a micro bump pitch of 30 µm was demonstrated and the joint reliability was also evaluated, and the results of reliability test showed that the reliability of fine pitch solder micro bump interconnections was acceptable under mechanical and electrical evaluations.
Abstract: Recently, the three-dimensional chip stacking technology with fine pitch and high input/output interconnects has emerged due to the requirements of multi-function and high performance in electronic devices. When the electronic packaging technology develops toward the miniaturization trend, the reliability of interconnect with fine pitch and high density solder bump interconnections will become a critical issue in advanced 3D chip stacking technology. In this study, assembly of chip-on-chip test vehicle with a micro bump pitch of 30 µm was demonstrated and the joint reliability was also evaluated. The Si chip/carrier used in this study had more than 3000 micro bumps with Sn2.5Ag solder material. Ni/Cu under bump metallurgy layer (UBM) was selected on both the top and bottom chip. 3D chip stacking was achieved by thermo-bonding and subsequently underfill dispensing for fine gap filling was also conducted with different kinds of underfills. The temperature cycling test was performed on the chip-on-chip stacking module over 1000 cycles. In addition, with the joint size becoming small, the current for each solder bump carried continues to increase. This leads high current flowing in each individual joint. Therefore, electromigration has become a major reliability issue in microelectronic devices. In this study, electromigration in SnAg solder micro bump with a pitch of 30 μm was investigated under 0.12A at 135°C. Electromigration characteristics of fine pitch micro bump was discussed with the microstructure evolution of micro bump during current stressing. The assembly of 3D stacking chip using two layers of chip with fine pitch and lead-free interconnects was achieved in this study. The results of reliability test showed that the reliability of fine pitch solder micro bump interconnections was acceptable under mechanical and electrical evaluations.
01 Nov 2010
TL;DR: In this article, two basic switching cells, P-cell and N-cell, along with their implications in power electronic circuits, are introduced and a novel packaging method for power electronics modules is proposed.
Abstract: This paper introduces the concepts of two basic switching cells, P-cell and N-cell, along with their implications in power electronic circuits. The basic switching cells exist in almost every power electronic circuit. To take advantage of these structures, this paper proposes a novel packaging method for power electronics modules. The proposed packaging method uses the basic switching cells as the unit in a module, instead of traditional anti-parallel connection of active switch and diode. This rearrangement can reduce the stray inductance in the current commutation pass; therefore, the performance and reliability of the power device module and the power electronic system can be improved. A conventional phase leg module and a proposed module are modeled. Electromagnetic simulation is carried out to extract the stray inductance from the two modules. Switching behavior under different package parasitics is studied based on Saber simulation.
TL;DR: In this article, a wafer-level vacuum package is developed for micromachined thermoelectric infrared (IR) sensor, where an IR sensor wafer and a cap wafer are bonded together in a vacuum chamber using Au-Au thermocompression bonding, where the wafer not only protects the floating thermopile structure but also selects IR light for the sensor.
Abstract: In the trend towards low-cost, high-performance, and miniaturization, a wafer-level vacuum package is developed for micromachined thermoelectric infrared (IR) sensor. An IR sensor wafer and a cap wafer are bonded together in a vacuum chamber using Au-Au thermocompression bonding, where the cap wafer not only protects the floating thermopile structure but also selects IR light for the sensor. The device fabrication and Au-Au thermocompression hermetic bonding process as well as the packaged IR sensor characterization is presented in this paper. Experimental results show that the wafer-level vacuum packaged IR sensor has a four times higher responsivity and detectivity than the IR sensor with atmosphere pressure package, which confirms the IR performance improvement due to vacuum packaging. IR microscope image of the packaged device proved that the Au-Au thermocompression bonding process is compatible to the handling of fragile micromachined thermopile structure. Average leak rate and shear strength are, respectively, 3.9 × 10-9 atm cc/s and 16.709 Kgf, which shows that the Au-Au thermocompression hermetic bonding is suitable for the wafer-level vacuum packaging of micromachined thermoelectric IR sensor.
01 Aug 2010
TL;DR: Fan-out embedded wafer level packaging (eWLB) as discussed by the authors is an example to link front-end and packaging technology and offers additional freedom for interconnect design, which includes system on chip (SoC) integration and system in package (SiP) integration like side by side and stacking of devices.
Abstract: Silicon front-end and assembly and packaging technology more and more merge. In addition interconnect density reaches limits for advanced CMOS technology. In this paper we introduce the fan-out embedded wafer level packaging technology, which is an example to link front-end and packaging technology and offers additional freedom for interconnect design. We demonstrate capabilites for system integration of the eWLB technology, which includes system on chip (SoC) integration and system in package (SiP) integration like side by side and stacking of devices. We highlight the importance of understanding properties of new materials, which influence warpage or heat dissipation. We also show the excellent performance of the eWLB package for mm-wave applications.
TL;DR: In this paper, the authors describe the creation and characterization of monolithic arrays of miniature rectilinear ion traps (RIT) with common electronic packaging materials, and describe the fabrication process.
Abstract: This paper reports the creation and characterization of monolithic arrays of miniature rectilinear ion traps (RIT) with common electronic packaging materials. Miniature ion traps benefit from a lower operating voltage as their dimensions decrease. Their integration into circuit board materials facilitates smaller and more integrated sensor systems. Arrays of ion traps provide a larger ion trap storage volume to increase sensitivity lost from size reduction. A new technique, integrating stereolithography-produced ion traps on planar rigid substrates, makes possible the 3-D isolation techniques for more complex monolithic structures. A description of the fabrication process is included. Performance-limiting metrics of the mass analyzer, such as geometrical and electrical deviations, are analyzed to determine their magnitudes for design improvement. The integration of the array with the PCB replaces complex wiring schemes with traces routed within existing multilayer substrates. The substrate can serve as the integration platform for an entire mass spectrometer in a package.
TL;DR: In this paper, the inkjet printing of a dielectric layer as part of an assembling process for a semiconductor device was evaluated, and three different polymer solutions were tested.
TL;DR: In this article, a fully packaged acoustic power receiver is introduced, which can provide electronic energy to other implanted devices by receiving an external acoustic wave generated from the skin surface of the subcutaneous tissue.
Abstract: Fully packaged acoustic power receivers are introduced. They can provide electronic energy to other implanted devices by receiving an external acoustic wave generated from the skin surface of the subcutaneous tissue. Piezoelectric ceramics make the internal devices of the receivers, and they are directly charged, converting pressure into an extractable electrical energy. Moreover, cohesive gel is used to package the internal devices, and the packages are biocompatible and sufficiently soft to absorb the incident wave that is generated at the skin surface. Additionally, the effects of the shape of the scattering package and ratio of the stiffness of the package to that of the tissue are considered in designing the receivers. The dominant frequencies and the energy efficiency of the receivers are measured in the very streaky pork, which is used to simulate human subcutaneous tissue. The results indicate that the spherical packaging is preferable to the cubic packaging when buried in the muscular layer. The maximum efficiency of the power transmission is found to be -48.2 dB, using the spherical package in the muscular layer of the streaky pork.
TL;DR: In this article, a simple and low-cost SU-8 based wafer-level vacuum packaging method which is CMOS and MEMS compatible is presented, which is based on optical inspection and SEM images used in order to measure the package lid bending and probe the encapsulation sealing.
TL;DR: The development mechanism was analyzed through the simulation calculations by combining different material properties modeling and geometries, and the results showed comprehensive consideration of the materials and the packaging design are essential to control the warpage.
08 Apr 2010
TL;DR: In this article, the authors present a versatile sub-mTorr vacuum packaging approach for high performance dynamic MEMS, which takes advantage of processing steps and materials used throughout the MEMS industry while providing maximum flexibility for changes in die size and layout.
Abstract: This paper presents a versatile sub-mTorr vacuum packaging approach ideally suited for R&D of high performance dynamic MEMS. The procedure takes advantage of processing steps and materials used throughout the MEMS industry while providing maximum flexibility for changes in die size and layout. Prototypes of a new tuning fork gyroscope concept optimized to minimize substrate energy dissipation were packaged using the presented techniques and experimentally characterized to determine the sealed vacuum level. The combination of high-Q mechanical design with the packaging process resulted in a stable quality factor of greater than 91,000.
22 Nov 2010
TL;DR: FanFan-Out Wafer Level Packaging has arrived in the industry as mentioned in this paper, the driving factors for the implementation of this packaging technology are the low packaging and test cost, the excellent electrical and thermal performance, the ability to work with increasing interconnect density on chip side and the potential for integration of functionality.
Abstract: Fan-Out Wafer Level Packaging has arrived in the industry. The driving factors for the implementation of this packaging technology are the low packaging and test cost, the excellent electrical and thermal performance, the ability to work with increasing interconnect density on chip side and the potential for Integration of functionality. The increasing demand for new and more advanced electronic products with superior functionality and performance is driving the integration of functionality for future packaging technologies.
TL;DR: The paper covers in more detail how advances in both semiconductor content and power advanced wafer level package design and materials have co-enabled significant advances in power device capability during recent years.
07 Jun 2010
TL;DR: This paper presents a new technology to connect electronic modules with textile circuits in a cost efficient and reliable way using non-conductive thermoplastic polyurethane adhesive, and demonstrates how sensors for body monitoring can benefit from it.
Abstract: This paper presents a new technology to connect electronic modules with textile circuits in a cost efficient and reliable way. Non-conductive thermoplastic polyurethane adhesive is applied to bond a test module onto the fabric with different types of conductive circuits. The adhesive is melted at a high temperature and mechanically fixed by subsequent cooling. The technology even allows contacting isolated conductors without having to remove the isolation in a separate step. Extensive temperature cycling, wash cycling and humidity tests have been carried out and it has been shown that the assembly is reliable under textile typical stress. At the end the paper demonstrates how sensors for body monitoring can benefit from this new technology.
01 Dec 2010-Microsystem Technologies-micro-and Nanosystems-information Storage and Processing Systems
TL;DR: In this paper, a flip-chip-based encapsulation technique for encapsulating MEMS electrostatic actuators for biomedical applications is presented, where a wall structure is put around the actuator surrounding it completely but leaving a small clearance where the actuators shuttle can extend off the edge of the chip.
Abstract: This paper presents a flip-chip based packaging technique for encapsulating MEMS electrostatic actuators for biomedical applications. High-performance electrostatic inchworm actuators are used to demonstrate the packaging technique. A wall structure is put around the actuator surrounding it completely but leaving a small clearance where the actuator shuttle can extend off the edge of the chip. A cap chip is fabricated separately, and flip-chipped onto the actuator. Au–Au thermal bonding technique is used to fix the cap. Finally, rendering the surfaces of the clearance hydrophobic prevents the water ingress when the actuator operates in water.
TL;DR: In this article, the authors proposed a methodology to optimize the joint height based on a trade-off between the thermo-mechanical performance and dielectric performance of the power module.
Abstract: Due to the thin structure used in planar packaging, the electric field intensity within the encapsulation is high, leading to degradation of the dielectric performance. To resolve this issue, a metal posts interconnected parallel plate structure (MPIPPS) is used to reduce the high electric field concentration in the power module. However, the high bonding joint in MPIPPS causes large thermo-mechanical stress within the solder layers. This paper proposes a methodology to optimize the joint height based on a trade-off between the thermo-mechanical performance and dielectric performance of the power module. The impact of the joint height on thermo-mechanical stress and dielectric performance of the module is investigated quantitatively using ANSYS and Maxwell simulations. The results show that using a 0.4 mm joint height and Nusil R-2188 encapsulation, the power module can achieve 3 kV breakdown voltage. Experimental results agree with the simulation results.
23 Sep 2010
TL;DR: In this paper, three different cooling models for light emitting diode (LED) packaging, which include the heatsink model, the fan model and the TEC, thermal interface material (TIM), were evaluated.
Abstract: Active heat dissipation method plays a vital role in thermal management of high power light emitting diode (LED) packaging. As a new cooling device, thermoelectric cooler (TEC) is applied in electronic packaging, for which the extensively applied devices are the heatsink and the fan by now. In order to evaluate the cooling performance of the heatsink and TEC, three different cooling models for light emitting diode (LED) packaging, which include the heatsink model, the heatsink and fan model and the TEC, heatsink and fan model, are established and their thermal performance of packaging are investigated in present study. Junction temperatures of the chip are measured by experimental measurement method, the thermal resistances of TEC, thermal interface material (TIM) and heatsink are analyzed by thermal resistance network method in the situation of different chip power, different TEC input current and different wind speed caused by the fan. The optimal input currents of TEC in different conditions are analyzed. Based on the cooling performance of the different models, the critical chip power is 35 W between the TEC method and the heatsink method at the same time the junction temperature is 40 °C. For optimizing the TEC, it's necessary to reduce the thermal resistance of TEC as same as improve its cooling capacity because the thermal resistance of TEC plays a major role in the total resistance of LED package.
Patent•
15 Sep 2010
TL;DR: In this paper, a high heat-conducting copper-based composite material and a preparation method belonging to the technical field of electronic packaging materials are described. But the preparation method is not described.
Abstract: The invention relates to a high heat-conducting copper-based composite material and a preparation method thereof, belonging to the technical field of electronic packaging materials. The copper-based composite material consists of 50-80 percent by volume of electroplated diamond particles and 20-50 percent by volume of copper. The electroplated diamond particles and a caking agent are mixed according to the volume ratio of 1:1-4:1 and are produced into a diamond prefabricated part by using an injection forming process of the prefabricated part; and a copper matrix is directly placed on the diamond prefabricated part or is melt and poured on the diamond prefabricated part to be produced into the high heat-conducting copper-based composite material by using a pressure infiltration process. The copper-based composite material has higher heat conductivity ratio than that of an aluminum-based composite material; by plating the surface of diamond, the interface bonding of the matrix copper and the diamond can be improved and the interface heat resistance can be reduced; in addition, the material has low density and small thermal expansion coefficient and meets the requirement for light quality of packaging materials.
TL;DR: In this paper, a novel solder bump inspection system has been developed using laser ultrasound and interferometer techniques, which has been successfully applied to detect solder bump defects including missing, misaligned, open, and cracked solder bumps in flip chip packages, chip scale packages and land grid arrays.
Abstract: Microelectronics packaging technology has evolved from through-hole and bulk configuration to surface-mount and small-profile ones. In surface mount packaging, such as flip chips, chip scale packages, and ball grid arrays, chips/packages are attached to the substrates/printed wiring board (PWB) using solder bump interconnections. Solder bumps hidden between the chips/packages and the substrate/board are no longer visible for inspection. A novel solder bump inspection system has been developed using laser ultrasound and interferometer techniques. This system has been successfully applied to detect solder bump defects including missing, misaligned, open, and cracked solder bumps in flip chip packages, chip scale packages and land grid arrays. The system uses a pulsed Nd:YAG laser to induce ultrasound in the thermoelastic regime and the transient out-of-plane displacement response in nanometer scale on the package surface is measured using the interferometer technique. In this paper, wavelet analysis of laser ultrasound signals is presented and compared to previous signal processing methods, such as error ratio and correlation coefficient. The results show that wavelet analysis increases measurement sensitivity for inspecting solder bumps in electronic packages. Laser ultrasound inspection results are also compared to X-ray results. In particular, this paper discusses defect detection for a 6.35 mm × 6.35 mm × 0.6 mm PB18 flip chip package and flip chip package (?SiMAF?) with 24 lead-free solder bumps. These two types of flip chip specimens are both nonunderfilled.
08 Apr 2010
TL;DR: In this article, a fully-complemented 2D ultrasonic transducer array is integrated using TSV with under-bump metallization (UBM) stack for solder bumping.
Abstract: The successful packaging and electronics integration of large 2D array devices with small pitch-sizes, such as fully populated 2D ultrasonic transducer arrays, require a flexible, simple, and reliable integration approach. One example for such electronics integration is based on through silicon vias (TSVs) with under-bump metallization (UBM) stack for solder bumping. In this paper, we demonstrate such an approach by successfully integrating a fully populated 2D ultrasonic transducer array. Our integration is based on a previously reported TSV technology (trench-frame technology), based on trench-isolated interconnects with supporting frame. We successfully combined the trench-frame technology with a simple UBM preparation technique - electro plating or chemical plating techniques with passivation layers for UBM pad definition are not required. Our results show high shear strength (26.5g) of the UBM, which is essential for successful flip-chip bonding. The yield of the interconnections is 100% with excellent solder-ball-height uniformity (σ = 0.9 µm). As demonstrated in this paper, this allows for a large-scale assembly of a tiled array by using an interposer. A design guideline for finer element-pitch design was developed suggesting that fusion bonding strength and the length of pillars are the main design parameters.
01 Dec 2010
TL;DR: In this article, the authors summarize recent advances in isotropically conductive adhesive (ICA) technology and discuss how the electrical and reliability properties of ICAs can be engineered for electronic packaging applications.
Abstract: As one of the promising lead-free interconnection materials, electrically conductive adhesive (ECA) has made considerable advances in recent years. Compared to metal solder, ECAs offer numerous advantages, such as environmental friendliness (elimination of lead usage and flux cleaning), mild processing conditions, fewer processing steps (reducing processing cost), low stress on the substrates and fine pitch capability. However, ECAs have some challenging issues, such as lower electrical and thermal conductivities compared to solder joints, conductivity fatigue in reliability tests, limited current carrying capability, poor impact performance, etc. To meet specific applications required for emerging electronic packaging technologies, worldwide research efforts have been devoted to improving the performance of ECAs, such as electrical and mechanical properties and the reliability under various conditions. Here, we summarize recent advances in isotropically conductive adhesive (ICA) technology. We mainly discuss how the electrical and reliability properties of ICAs can be engineered for electronic packaging applications.