Electronic packaging

About: Electronic packaging is a research topic. Over the lifetime, 3977 publications have been published within this topic receiving 48510 citations.

Methods and apparatus for balancing differences in thermal expansion in electronic packaging

Abstract: CTE differentials between chips and organic dielectric carriers, boards or other substrates to which the chips are attached are accommodated with a layer of a thermoplastic material, preferably a thermotropic polymer whose physical properties can be altered by extrusion or other physical processes, such as liquid crystalline polyesters, that modifies the CTE of at least one component of the package and thereby reduces CTE differentials. The material may be applied to the entire surface of a chip carrier, printed circuit or other substrate, or form an interior layer of a multi-layered structure. It may also be applied to selected regions or areas on the surface of a carrier or other substrate where adjustment is required.

Use of doped synthetic polymer materials for packaging of power electric assemblies for a liquid cooled module

Abstract: The invention is a doped synthetic polymer materials for packaging of power electric assemblies. The polymer provides electromagnetic interference (EMI) shielding using such materials as nickel, carbon fiber, aluminum or other such characteristic elements. The invention provides structural integrity for power electronic packaging, while reducing cost, size, weight and design flexibility over the prior art. The illustrated embodiment is a liquid cooled turbulent flow power electronic assembly.

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Abstract: Thermal metamaterials exhibit thermal properties that do not exist in nature but can be rationally designed to offer unique capabilities of controlling heat transfer. Recent advances have demonstrated successful manipulation of conductive heat transfer and led to novel heat guiding structures such as thermal cloaks, concentrators, etc. These advances imply new opportunities to guide heat transfer in complex systems and new packaging approaches as related to thermal management of electronics. Such aspects are important, as trends of electronics packaging toward higher power, higher density, and 2.5D/3D integration are making thermal management even more challenging. While conventional cooling solutions based on large thermal-conductivity materials as well as heat pipes and heat exchangers may dissipate the heat from a source to a sink in a uniform manner, thermal metamaterials could help dissipate the heat in a deterministic manner and avoid thermal crosstalk and local hot spots. This paper reviews recent advances of thermal metamaterials that are potentially relevant to electronics packaging. While providing an overview of the state-of-the-art and critical 2.5D/3D-integrated packaging challenges, this paper also discusses the implications of thermal metamaterials for the future of electronic packaging thermal management. Thermal metamaterials could provide a solution to nontrivial thermal management challenges. Future research will need to take on the new challenges in implementing the thermal metamaterial designs in high-performance heterogeneous packages to continue to advance the state-of-the-art in electronics packaging.

A water-tight packaging of MEMS electrostatic actuators for biomedical applications

Abstract: This paper presents a flip-chip based packaging technique for encapsulating MEMS electrostatic actuators for biomedical applications. High-performance electrostatic inchworm actuators are used to demonstrate the packaging technique. A wall structure is put around the actuator surrounding it completely but leaving a small clearance where the actuator shuttle can extend off the edge of the chip. A cap chip is fabricated separately, and flip-chipped onto the actuator. Au–Au thermal bonding technique is used to fix the cap. Finally, rendering the surfaces of the clearance hydrophobic prevents the water ingress when the actuator operates in water.

Parametric Study of Joint Height for a Medium-Voltage Planar Package

Abstract: Due to the thin structure used in planar packaging, the electric field intensity within the encapsulation is high, leading to degradation of the dielectric performance. To resolve this issue, a metal posts interconnected parallel plate structure (MPIPPS) is used to reduce the high electric field concentration in the power module. However, the high bonding joint in MPIPPS causes large thermo-mechanical stress within the solder layers. This paper proposes a methodology to optimize the joint height based on a trade-off between the thermo-mechanical performance and dielectric performance of the power module. The impact of the joint height on thermo-mechanical stress and dielectric performance of the module is investigated quantitatively using ANSYS and Maxwell simulations. The results show that using a 0.4 mm joint height and Nusil R-2188 encapsulation, the power module can achieve 3 kV breakdown voltage. Experimental results agree with the simulation results.