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Electronic packaging

About: Electronic packaging is a research topic. Over the lifetime, 3977 publications have been published within this topic receiving 48510 citations.


Papers
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Proceedings ArticleDOI
01 Jan 2005
TL;DR: In this article, the benefits of using diamond for power electronic switch can be illustrated by a new figure of merit, which is that diamond has the most interesting and extreme thermal, dielectric and electronic properties of semiconductors.
Abstract: Diamond has the most interesting and extreme thermal, dielectric and electronic properties of semiconductors. The benefits of using diamond for power electronic switch can be illustrated by a new figure of merit. The exploration of possible device applications for this material has been motivated by the significant advances in growth and electronic technologies of diamond. Our studies are focused on two specific problems of power electronic: thermal management and high voltage switching. Indeed, diamond exhibits a unique combination of the highest electric breakdown field and thermal conduction that make it a potential candidate for power electronic packaging. Moreover, recent improvements in single crystal diamond growth have resulted in films with very high carrier mobility and high electric breakdown field that present a new interest for high power switches

20 citations

Journal ArticleDOI
TL;DR: In this article, a design process in the form of a flow chart that implements these methods in concrete design problems is presented, which results in three packaging concepts, namely lead frame converter, printed circuit board embedded converter, and heat conductor converter.
Abstract: In the previous work, a way to improve packaging of power electronic converters by increasing integration level and using multifunctional construction parts is presented. The quantities intended to evaluate integration level and volumetric utilization in power converters are introduced. Based on these values, a number of methods to increase the integration level are presented. A design process in the form of a flow chart that implements these methods in concrete design problems is presented. In this paper, the design process is applied to a dc/dc 42/14-V converter for automotive applications. Utilizing commercially available technologies that lend themselves to mass production this design process results in three packaging concepts, namely lead frame converter, printed circuit board embedded converter, and heat conductor converter. These concepts are then compared to a benchmark converter implemented in the conventional, discrete packaging technology. It is shown that by smart use of parts in the converter construction, the high values of integration level and high power densities can be achieved.

20 citations

Patent
01 Apr 2015
TL;DR: In this article, the development of electrostatic dissipative (ESD) electronic packaging materials based on the electrically conducting nanofiller decorated polyurethane foams and also describes a process for the preparation of the same.
Abstract: The present invention relates to the development of electrostatic dissipative (ESD) electronic packaging materials based on the electrically conducting nanofiller decorated polyurethane foams and also describes a process for the preparation of the same. More specifically it relates to the development of electrically conducting foams by providing a coating of 0.003 to 2.97 vol % loading of electrically conducting materials (like conducting polymers, functionalized carbon nanotubes, graphene analogues etc) over/onto otherwise electrically insulating surface of foams. The combination of low density, mechanical flexibility, resilience and surface conductivity collectively contribute towards their excellent shock absorption and static charge dissipation capabilities. In particular, these foams display surface resistivity value <109 ohm/sq and static charge dissipation time <0.5 sec, which clearly demonstrate their potential for electronic packaging applications. Besides, these foams could also be useful for antistatic dust filters, clean-room/medical apparels, static-free footwear, static dissipative upholstery items, antistatic/dissipative floorings/tiles etc.

20 citations

01 Jan 2009
TL;DR: In this article, the authors proposed System on Package (SOP) as a way to reach the threedimensional package concept where components will be placed in three-dimensional configuration, similar to package on package (PoP) or package in package (PiP).
Abstract: The electronic industry is reducing package dimensions of components as well as complete electronics systems. Surface mount device passives and semiconductor chips have to be mounted together bringing a functional system that must make asked function with necessary reliability and acceptable price. To make up a reliable and cost effective system, the size and weight being reduced by employing lower voltages and higher speeds. For example, the typical size of SMD passives 30 years ago was 1206 when they were first introduced. Generally, all components including electrical joints are becoming miniaturized and smaller. The industry is moving toward a reduced size of 0201 and 01005 for passives, new fine pitch packages for actives, but the PCB now features limits for further integration. System on Package (SOP) is one way to reach the three-dimensional package concept where components will be placed in three-dimensional configuration. A similar concept are "Package on Package" (PoP) or "Package in Package" (PiP).

20 citations

Journal ArticleDOI
TL;DR: In this article, a CO/sub 2/ laser-assisted silicon lid sealing process, utilizing Au80/Sn20 solder, for encapsulating gas breakdown test micro-electro-mechanical structures (MEMS) in a ceramic quad flatpack (CQFP) was studied.
Abstract: In this work, a CO/sub 2/ laser-assisted silicon lid sealing process, utilizing Au80/Sn20 solder, for encapsulating gas breakdown test micro-electro-mechanical structures (MEMS) in a ceramic quad flatpack (CQFP) was studied. Wire bonded MEMS dies were sealed into CQFPs under various gas media, such as air, nitrogen, helium and vacuum. The gas breakdown test results showed a significantly higher breakdown voltage for vacuum packaged parts compared to those packaged in other various gas environments. Hermeticity testing according to MIL-STD-883E showed that the leak rate of the package was below 10/sup -8/ atm cc/s. The bonding was uniform and the bonding strength is believed to be comparable to the tensile strength of Au80/Sn20 solder.

20 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202331
202293
202160
2020102
2019114
201896