Electronic packaging

About: Electronic packaging is a research topic. Over the lifetime, 3977 publications have been published within this topic receiving 48510 citations.

A projection moiré system for measuring warpage with case studies

Abstract: Microelectronic science and technology is shrinking the world. Advanced packaging and systems make bulk electronic devices miniaturized and multi-functioned. In fact, mobile, wireless, and hand-held products are becoming the mainstream of personal, as well as business practice. This new trend makes warpage, one of the main assembly issues in electronic packaging, more critical to product yield and reliability. Warpage could affect flip chip solder joint attachment in first level interconnections, as well as misregistration between the packages and the printed wiring boards. The shadow moire technique has been widely used to measure warpage. However, inherent configurations limit its use on certain scenarios. In comparison to the shadow moire approach, the projection moire method provides several advantages. It is more suited for measuring flatness of surfaces with components. The grating sizes can be easily adjusted, thus making it versatile for measuring various board and chip sizes and details. Without the grating glass, which is a substantial heat inertia, the sample can be heated more evenly during the thermal process. Also, using a laser as the light source makes the system less sensitive to ambient light. In this paper, a novel system based on the projection moire technique is presented. The system setup is described and analyzed to reveal its advantages, resolution, and accuracy. A set of experimental results of a variety of sample sizes will be shown. It is concluded that this projection moire system, which is integrated with an oven system, is a powerful tool to study warpage of printed wiring boards and integrated circuit packages.

Permittivity and permeability measurement of microwave packaging materials

Abstract: There has recently been a growing interest in using new packaging materials-dielectric and/or magnetic-in a wide variety of applications for controlling the microwave heating of food. The study of the thermal behavior of these products requires the accurate determination of the complex permittivity and permeability when the temperature varies, and when the materials are irradiated in specific conditions. One of the main challenges is to distinguish the dielectric losses from the magnetic ones. In this paper, a practical measurement method is proposed, which consists of irradiating a rod sample successively with a homogeneous electric-field distribution with a low magnetic field and with a homogeneous magnetic-field distribution with low electric field. An accurate and efficient electromagnetic analysis tool is used to generate a set of points, which allow the construction of several bilinear functions that relate the scattering parameters of the circuit to the complex values of /spl epsiv/ and /spl mu/ so that /spl epsiv/ and /spl mu/ can then be easily determined from experimental measurements in accordance to whatever the special irradiation conditions. Some results for test materials are presented and discussed.

Wiring board, electronic component packaging body using the same, and manufacturing method of the wiring board and electronic component packaging body

Abstract: PROBLEM TO BE SOLVED: To provide a wiring board that improves adhesion strength with a substrate, can be fined easily, and has a low wiring pattern, and to provide an electronic packaging body that uses the wiring board, and to provide methods for manufacturing the wiring board and the electronic component packaging body. SOLUTION: The wiring board has the substrate 100 and the wiring pattern 120 formed on the substrate 100. The wiring pattern 120 comprises an insulating resin 130, formed at the side of the substrate 100 and a conductor 140 formed by lamination on the insulating resin 130. With this configuration, the wiring board can be achieved that secures the adhesion strength between the substrate 100 and the conductor 140 by the insulating resin 130 and has the wiring pattern 120, having a fine pitch by transfer mold. COPYRIGHT: (C)2007,JPO&INPIT

New Package Scheme of a 2.5-Gb/s Plastic Transceiver Module Employing Multiwall Nanotubes for Low Electromagnetic Interference

Abstract: A novel polymer-based multiwall carbon nanotube (MWCNT) with high shielding effectiveness (SE) for use in packaging a 2.5-Gb/s plastic transceiver module is demonstrated. The MWCNT composites are tested to evaluate the electromagnetic (EM) shielding against emitted radiation from the optical transceiver modules. The results show that the SE of MWCNT composite packages exhibit 38-45 dB in the far-field source and 28-40 dB in the near-field source at a frequency range of 1-3 GHz, and an average of 14 dB for the optical transceiver modules at a frequency of 2.5 GHz. The MWCNT composites with their high SE are potentially suitable for packaging low-cost and low-EM-interference optical transceiver modules used in Gigabit Ethernet or fiber-to-the-home lightwave transmission systems