Electronic packaging

About: Electronic packaging is a research topic. Over the lifetime, 3977 publications have been published within this topic receiving 48510 citations.

Aluminum Silicon Carbide (AlSiC) for Advanced Microelectronic Packages

Abstract: Aluminum Silicon Carbide (AlSiC) metal matrix composite (MMC) materials have a unique set of material properties that are ideally suited for all electronic packaging applications requiring thermal management. The AlSiC coefficient of thermal expansion (CTE) value is compatible with direct IC device attachment for the maximum thermal dissipation through the 170 – 200 W/mK thermal conductivity value material. Additionally, the low material density of AlSiC makes it ideal for weight sensitive applications such as portable devices. The AlSiC material and functional electronic packaging geometries are produced using the Ceramics Process Systems Corporation's QuickSet™/QuickCast™ net-shape (without machining) fabrication process. Additionally, functional packaging features such as feedthrus, sealrings and substrates are incorporated in AlSiC during fabrication using the CPS Concurrent Integration™ technique eliminating the need for the traditional assembly and brazing (or soldering) operations. The ideal AlSiC material properties and the AlSiC net-shape fabrication process provides low-cost high performance functional thermal management packaging solutions. This paper will review the material properties of AlSiC contrasted to traditional heat-sinking materials. AlSiC fabrication processing flow will also be reviewed and discussed. Functional packaging designs and application solutions will be illustrated through CPS AlSiC product examples.

Viscoelastic Effect of FR-4 Material on Packaging Stress Development

Abstract: In the microelectronics device, FR-4 material is one of the key component materials in the packaging structure. The structure of FR-4 is featured as a typical orthotropic polymer composite material reinforced with glass fiber. Although the material may exhibit viscoelastic behavior, the material is commonly regarded as temperature-dependent elastic one in the microelectronics reliability analysis. The purpose of this study is to investigate the material property modeling effect of FR-4 on the reliability prediction. To obtain the FR-4 material properties, a series of stress relaxation test was performed. Based on the data, the behavior of the FR-4 was modeled as orthotropic temperature-dependent elastic and viscoelastic. An analytical method was employed to calculate the engineering constants required for the calculations. The elastic calculation was performed by ANSYS, and the viscoelastic calculation by a FORTRAN program, respectively. The FORTRAN program was written separately, and capable of calculating the viscoealstic calculations when the material is orthotropic. Board on chip (BOC) packaging structure, a new type of the first level packaging for memory chip, was considered for the stress development analysis. The results were compared to examine the difference based on the FR-4 material property modeling.

Microstructure and properties of Al/Sip composites for thermal management applications

Abstract: Aluminum matrix composite reinforced with high amount of Si particle is an advanced electronic packaging material used in thermal management. In this work, Al/Sip composites with different Si contents were prepared by rapid solidification and hot pressing. Fine and homogeneous microstructures with defect-free were achieved, and no detrimental reaction was detected. The typical thermo-physical properties such as the thermal conductivity and coefficient of thermal expansion (CTE) of the Al/Sip composites were acceptable as electronic packaging material for semiconductor devices. The CTE increased gradually with the temperature. Additionally, the mechanical properties of the composites were measured. The technological performance (workability, platability, and laser weldability) of the composites were also evaluated.

Predicting the Reliability of Power Electronic Modules

Abstract: This paper discusses the reliability of an IGBT power electronics module. This work is part of a major UK funded initiative into the design, packaging and reliability of power electronic modules. The predictive methodology combines numerical modeling techniques with experimentation and accelerated testing to identify failure modes and mechanisms for these type of power electronic module structures. The paper details results for solder joint failure substrate solder. Finite element method modeling techniques have been used to predict the stress and strain distribution within the module structures. Together with accelerated life testing, these results have provided a failure model for these joints which has been used to predict reliability of a rail traction application.

Process and system for product packaging

Abstract: A process and system are provided for printing variable data on packaging material at a package printer and machine reading the variable data on a packaging facility packaging line and associating the variable data with other information in a computer database. The process and system render unnecessary the use of a printing stage at the packaging facility, thereby improving packaging efficiency.